Semiconductor packages with vertical passive components

Patent metadata

Field	Value
Publication number	US-12230615-B2
Application number	US-202117558592-A
Country	US
Kind code	B2
Filing date	Dec 22, 2021
Priority date	Dec 30, 2020
Publication date	Feb 18, 2025
Grant date	Feb 18, 2025

Abstract

An embodiment related to a package is disclosed. The package includes a component mounted to a die attach region on a package substrate. A passive component with first and second passive component terminals is vertically attached to the package substrate. An encapsulant is disposed over the package substrate to encapsulate the package. In one embodiment, an external component is stacked above the encapsulant and is electrically coupled to the encapsulated package.

First claim

What is claimed is:

1. A device comprising:
a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes an active package surface configured with a component attach region and terminal pads;
a component mounted onto the component attach region of the active package surface, the component is electrically coupled to the terminal pads;
a passive component with opposing first and second passive component terminals, wherein the passive component is attached to the package substrate in a vertical configuration comprising,
the first passive component terminal attached to one terminal pad of the terminal pads, and
the second passive component terminal is distal from the top major package substrate surface; and

an encapsulant, the encapsulant forms an encapsulated package.

2. The device of claim 1 wherein a top surface of the encapsulant exposes the second passive component terminal to provide external connection for the passive component.

3. The device of claim 2 further comprises an external component disposed on the top surface of the encapsulant, wherein the second passive component terminal is coupled to the external component.

4. The device of claim 3 wherein the external component comprises a heat dissipation component.

5. The device of claim 1 wherein the one terminal pad is commonly coupled to the first passive component terminal and the component.

6. The device of claim 1 wherein electrically coupling the component to the terminal pads comprises a clip bond, wherein the clip bond electrically couples component pads of the component to the terminal pads.

7. The device of claim 1 wherein electrically coupling the component to the terminal pads comprises wire bonds, wherein the wire bonds electrically couple component pads of the component to the terminal pads.

8. The device of claim 1 wherein electrically coupling the component to the terminal pads comprises a clip bond and wire bonds, wherein the clip bond and wire bonds electrically couple component pads of the component to the terminal pads.

9. The device of claim 1 wherein:
the component comprises a second component stacked on top of a first component which is attached to the component attach region;
the first component is electrically coupled to first terminal pads of the terminal pads; and
the second component is coupled to second terminal pads of the terminal pads.

10. The device of claim 9 wherein
electrically coupling the first component to the first terminal pads comprises a first clip bond, the clip bond electrically couples first component pads of the first component to the first terminal pads; and
electrically coupling the second component to the second terminal pads comprises a second clip bond, the clip bond electrically couples second component pads of the second component to the second terminal pads.

11. The device of claim 10 wherein a top surface of the encapsulant exposes the second passive component terminal to provide external connection for the passive component.

12. The device of claim 10 wherein the second passive component terminal is coupled to the second clip bond.

13. The device of claim 10 wherein a top surface of the encapsulant exposes the second clip bond to provide external connection.

14. A method for forming a device comprising:
providing a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes an active package surface configured with a component attach region and terminal pads;
disposing a component on the component attach region, the component is electrically coupled to the terminal pads;
attaching a passive component with opposing first and second passive component terminals to the package substrate, wherein the first passive component terminal is attached to the package substrate in a vertical configuration comprising,
the first passive component terminal attached to one terminal pad of the terminal pads, and
the second passive component terminal is distal from the top major package substrate surface; and

depositing an encapsulant, the encapsulant forms an encapsulated package.

15. The method of claim 14 further comprises
disposing an external component on a top surface of the encapsulant, wherein the top surface of the encapsulant exposes the second passive component terminal to electrically couple to the external component.

16. The method of claim 14 wherein electrically coupling the component to the terminal pads comprises a clip bond, wherein the clip bond electrically couples component pads of the component to the terminal pads.

17. The method of claim 14 further comprises
mounting a first component to the component attach region, wherein the first component is electrically coupled to first terminal pads of the terminal pads by a first clip bond,
stacking a second component over the first component; and
disposing a second clip bond on the second component, wherein the second clip bond electrically couples the second component to second terminal pads of the terminal pads.

18. The method of claim 17 wherein a top surface of the encapsulant exposes the second passive component terminal, or the second clip bond or a combination of both the second passive component terminal and the second clip bond to provide external connection.

19. The method of claim 17 wherein the second passive component terminal is coupled to the second clip bond.

20. A device comprising:
a package substrate having top and bottom major package substrate surfaces, the top major package substrate surface includes a component mounting region and terminal pads;
a component attached to the component mounting region, wherein the component includes component pads connected to the terminal pads; and
a passive component with opposing first and second passive component terminals, wherein the passive component is attached to the package substrate in a vertical configuration comprising,
the first passive component terminal attached to one terminal pad of the terminal pads, and
the second passive component terminal is distal from the top major package substrate surface.

Assignees

• Utac Headquarters Pte Ltd

Inventors

• Charoenratpratoom Jiraphat
• Sawasdee Phongsak
• Panphrom Wannasat

Classifications

• H10W90/769

  between a chip and a laterally-adjacent discrete passive device · CPC title

• H10W90/767

  between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink · CPC title

• H10W90/762

  between stacked chips · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title