Electronic component and method for manufacturing the same
US-2018322999-A1 · Nov 8, 2018 · US
US12230428B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12230428-B2 |
| Application number | US-202217747696-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 18, 2022 |
| Priority date | Sep 4, 2017 |
| Publication date | Feb 18, 2025 |
| Grant date | Feb 18, 2025 |
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An inductor component comprising a spiral wiring wound on a plane; first and second magnetic layers located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the wound spiral wiring; a vertical wiring extending from the spiral wiring in the normal direction to penetrate at least the inside of the first magnetic layer; and an external terminal disposed on at least a surface of the first magnetic layer to cover an end surface of the vertical wiring. The first magnetic layer is larger than the second magnetic layer in terms of the area of the external terminal viewed in the normal direction, and when A is the thickness of the first magnetic layer and B is the thickness of the second magnetic layer, A/((A+B)/2) is from 0.6 to 1.6.
Opening claim text (preview).
What is claimed is: 1. An inductor component comprising: a spiral wiring wound on a plane; a first magnetic layer and a second magnetic layer located at positions sandwiching the spiral wiring from both sides in a normal direction relative to the plane of the spiral wiring; a vertical wiring extending from the spiral wiring in the normal direction to penetrate at least the inside of the first magnetic layer out of the first magnetic layer and the second magnetic layer; an insulating layer that is between the spiral wiring and the second magnetic layer; a resin layer that is between the first magnetic layer and the second magnetic layer, and a portion of the resin layer is external to an outer perimeter of the spiral wiring; and an external terminal disposed on at least a surface of the first magnetic layer out of the first magnetic layer and the second magnetic layer to cover an end surface of the vertical wiring, wherein the first magnetic layer is larger than the second magnetic layer in terms of an area of the external terminal viewed in the normal direction, a thickness of the first magnetic layer is greater than a thickness of the second magnetic layer, and the first magnetic layer includes a substantially spherical magnetic powder and the second magnetic layer includes a flattened magnetic powder, and, in the second magnetic layer, a major axis of the flattened magnetic powder is arranged along a direction orthogonal to the normal direction. 2. The inductor component according to claim 1 , wherein the thickness of the first magnetic layer and the thickness of the second magnetic layer are each 10 μm or more. 3. The inductor component according to claim 1 , wherein the spiral wiring is a conductor made of copper or a copper compound. 4. The inductor component according to claim 1 , wherein the spiral wiring is covered with the insulating layer that includes an insulating resin made of an inorganic filler and an organic resin. 5. The inductor component according to claim 1 , wherein a thickness of the inductor component is 0.35 mm or less. 6. The inductor component according to claim 1 , wherein when A is a thickness of the first magnetic layer and B is a thickness of the second magnetic layer, A/((A+B)/2) is from 0.6 to 1.6. 7. The inductor component according to claim 6 , wherein a thickness of the spiral wiring is from (A+B)/2 to 2 (A+B). 8. The inductor component according to claim 7 , wherein a thickness of the inductor component is 0.2 mm or less. 9. The inductor component according to claim 6 , wherein the spiral wiring is a conductor made of copper or a copper compound. 10. The inductor component according to claim 6 , wherein the spiral wiring is covered with the insulating layer that includes an insulating resin made of an inorganic filler and an organic resin. 11. The inductor component according to claim 6 , wherein a thickness of the inductor component is 0.35 mm or less. 12. The inductor component according to claim 11 , wherein a thickness of the inductor component is 0.2 mm or less. 13. The inductor component according to claim 1 , wherein a magnetic permeability of the second magnetic layer is higher than a magnetic permeability of the first magnetic layer. 14. The inductor component according to claim 13 , wherein the vertical wiring is not present inside the second magnetic layer. 15. The inductor component according to claim 14 , wherein the first magnetic layer is a composite material of an inorganic filler made of an FeSi- or FeCo- or FeAl-based alloy or an amorphous alloy thereof and an epoxy- or polyimide- or phenol-based organic resin, wherein the content percentage of the inorganic filler is 50 vol % or more based on the organic resin, and the inorganic filler is substantially spherical. 16. The inductor component according to claim 13 , wherein at least a portion between the first magnetic layer and the second magnetic layer includes a region in which an amount of magnetic powder is smaller as compared to the first magnetic layer and the second magnetic layer. 17. The inductor component according to claim 16 , wherein a thickness of the region is from 0.5 μm to 30 μm. 18. The inductor component according to claim 1 , wherein the spiral wiring is one of multiple spiral wirings, a via conductor connecting the spiral wirings in series is further included between the multiple spiral wirings, and a same layer as the via conductor includes only the via conductor, an inorganic filler, and an organic resin. 19. The inductor component according to claim 18 , wherein a thickness of the same layer as the via conductor is from 1 μm to 20 μm. 20. The inductor component according to claim 18 , wherein the inorganic filler is made of at least one of an FeSi alloy, an FeCo alloy, an FeAl alloy, an amorphous alloy thereof, and SiO2, and wherein the average particle size of the inorganic filler is 5 μm or less.
with a magnetic layer · CPC title
Insulating of coils, windings, or parts thereof · CPC title
Terminals; Tapping arrangements {for signal inductances} · CPC title
Wires (H01F27/2866 takes precedence) · CPC title
Printed windings · CPC title
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