Cutting tool

US12226836B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12226836-B2
Application numberUS-202318571264-A
CountryUS
Kind codeB2
Filing dateJun 22, 2023
Priority dateJun 22, 2023
Publication dateFeb 18, 2025
Grant dateFeb 18, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cutting tool including a substrate and a coated film arranged on the substrate, in which the coated film includes a first layer positioned on the substrate, a second layer positioned on the first layer, and a third layer positioned on the second layer, the first layer is composed of titanium carbonitride, the second layer is composed of aluminum oxide, the third layer is composed of titanium carbonitride, a residual stress X of the first layer, a residual stress Y of the second layer and a residual stress Z of the third layer satisfy a relationship of formula 1.

First claim

Opening claim text (preview).

The invention claimed is: 1. A cutting tool comprising a substrate and a coated film arranged on the substrate, wherein the coated film comprises a first layer positioned on the substrate, a second layer positioned on the first layer, and a third layer positioned on the second layer, wherein the first layer is composed of titanium carbonitride, wherein the second layer is composed of aluminum oxide, wherein the third layer is composed of titanium carbonitride, wherein a residual stress X of the first layer, a residual stress Y of the second layer and a residual stress Z of the third layer satisfy a relationship of formula 1: X<Y<Z  formula 1, wherein the residual stress X of the first layer is −1.0 GPa or more and −0.3 GPa or less, wherein the residual stress Y of the second layer is −0.5 GPa or more and 0.1 GPa or less, and wherein the residual stress Z of the third layer is −0.3 GPa or more and 0.4 GPa or less. 2. The cutting tool according to claim 1 , wherein a thickness of the first layer is 3 μm or more and 15 μm or less. 3. The cutting tool according to claim 2 , wherein the residual stress X of the first layer is −0.8 GPa or more and −0.5 GPa or less, wherein the residual stress Y of the second layer is −0.3 GPa or more and −0.1 GPa or less, and wherein the residual stress Z of the third layer is −0.1 GPa or more and 0.2 GPa or less. 4. The cutting tool according to claim 1 , wherein a thickness of the second layer is 3 μm or more and 15 μm or less. 5. The cutting tool according to claim 4 , wherein the residual stress X of the first layer is −0.8 GPa or more and −0.5 GPa or less, wherein the residual stress Y of the second layer is −0.3 GPa or more and −0.1 GPa or less, and wherein the residual stress Z of the third layer is −0.1 GPa or more and 0.2 GPa or less. 6. The cutting tool according to claim 1 , wherein a thickness of the third layer is 2 μm or more and 4 μm or less. 7. The cutting tool according to claim 6 , wherein the residual stress X of the first layer is −0.8 GPa or more and −0.5 GPa or less, wherein the residual stress Y of the second layer is −0.3 GPa or more and −0.1 GPa or less, and wherein the residual stress Z of the third layer is −0.1 GPa or more and 0.2 GPa or less. 8. The cutting tool according to claim 1 , wherein a thickness of the coated film is between 6 μm and 30 μm. 9. The cutting tool according to claim 1 , wherein Y-X is between 0.1 and 0.6. 10. The cutting tool according to claim 1 , wherein Y-Z is between −0.6 and −0.1. 11. The cutting tool according to claim 1 , wherein Y-X is between 0.1 and 0.6, and wherein Y-Z is between −0.6 and −0.1. 12. The cutting tool according to claim 1 , wherein a thickness of the coated film is between 6 μm and 30 μm, wherein Y-X is between 0.1 and 0.6, and wherein Y-Z is between −0.6 and −0.1. 13. The cutting tool according to claim 1 , wherein the substrate is comprised of cemented carbides. 14. The cutting tool according to claim 1 , wherein the residual stress of the coated film is changed using blast processing. 15. The cutting tool according to claim 1 , wherein a thickness of the first layer is 3 μm or more and 15 μm or less, and wherein a thickness of the second layer is 3 μm or more and 15 μm or less. 16. The cutting tool according to claim 15 , wherein a thickness of the third layer is 2 μm or more and 4 μm or less. 17. The cutting tool according to claim 16 , wherein a thickness of the coated film is between 6 μm and 30 μm. 18. The cutting tool according to claim 17 , wherein Y-X is between 0.1 and 0.6. 19. The cutting tool according to claim 18 , wherein Y-Z is between −0.6 and −0.1. 20. The cutting tool according to claim 19 , wherein the residual stress X of the first layer is −0.8 GPa or more and −0.5 GPa or less, wherein the residual stress Y of the second layer is −0.3 GPa or more and −0.1 GPa or less, and wherein the residual stress Z of the third layer is −0.1 GPa or more and 0.2 GPa or less.

Assignees

Inventors

Classifications

  • with specified thickness · CPC title

  • Aluminium oxide · CPC title

  • Titanium carbide nitride (TiCN) · CPC title

  • B23B27/148Primary

    Composition of the cutting inserts · CPC title

  • characterized by the composition of the alternating layers · CPC title

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What does patent US12226836B2 cover?
A cutting tool including a substrate and a coated film arranged on the substrate, in which the coated film includes a first layer positioned on the substrate, a second layer positioned on the first layer, and a third layer positioned on the second layer, the first layer is composed of titanium carbonitride, the second layer is composed of aluminum oxide, the third layer is composed of titanium …
Who is the assignee on this patent?
Sumitomo Electric Hardmetal Corp
What technology area does this patent fall under?
Primary CPC classification B23B27/148. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Feb 18 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).