Display module and display device

Patent metadata

Field	Value
Publication number	US-12225697-B2
Application number	US-202218022379-A
Country	US
Kind code	B2
Filing date	Jun 30, 2022
Priority date	Jun 30, 2022
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

A display module is provided, including a display panel and a flexible printed circuit (FPC) bonded to the display panel; the display panel includes a display area and a non-display area disposed at the periphery of the display area, the non-display area includes a bonding area disposed on one side of the display area, and a driver integrated circuit (IC) is disposed in the bonding area; the FPC includes a main body part, an orthographic projection of the main body part onto the display panel is in the bonding area, and a first accommodating groove for accommodating the driver IC is provided in a first surface of the FPC close to the display panel; a heat dissipation structure extending from within the first accommodating groove to outside the FPC is further disposed between the FPC and the bonding area. A display device is further provided.

First claim

What is claimed is:

1. A display module, comprising: a display panel and a flexible printed circuit bonded to the display panel; wherein
the display panel comprises a display area and a non-display area disposed at the periphery of the display area, the non-display area comprises a bonding area disposed on one side of the display area, and a driver integrated circuit (IC) is disposed in the bonding area;
the flexible printed circuit comprises a main body part, an orthographic projection of the main body part onto the display panel is in the bonding area, and a first accommodating groove for accommodating the driver IC is provided in a first surface of the flexible printed circuit close to the display panel; and
a heat dissipation structure, extending from within the first accommodating groove to outside the flexible printed circuit, is further disposed between the flexible printed circuit and the bonding area.

2. The display module according to claim 1 , wherein the heat dissipation structure comprises a heat-conducting metal structure disposed between the flexible printed circuit and the bonding area.

3. The display module according to claim 2 , wherein the heat dissipation structure further comprises an electrical-insulating and beat-conducting adhesive layer between the heat-conducting metal structure and the driver IC.

4. The display module according to claim 3 , wherein at least a portion of the driver IC is covered by the electrical-insulating and heat-conducting adhesive layer.

5. The display module according to claim 4 , wherein the electrical-insulating and heat-conducting adhesive layer is disposed between at least some of side walls of the first accommodating groove and the driver IC, and the heat-conducting metal structure comprises a metal sheet, one end of the metal sheet extending into the first accommodating groove and being attached to the electrical-insulating and heat-conducting adhesive layer, and an other end of the metal sheet extending out of the flexible printed circuit in a direction away from the first accommodating groove.

6. The display module according to claim 5 , wherein the electrical-insulating and heat-conducting adhesive layer is disposed between some of the side walls of the first accommodating groove and the driver IC, the first surface of the flexible printed circuit comprises a first region disposed at the some of the side walls and away from the accommodating groove, and the first region is recessed to form an accommodating space between the flexible printed circuit and the display panel for accommodating the metal sheet.

7. The display module according to claim 5 , wherein at least one first through hole extending along a direction perpendicular to the first surface is formed in the flexible printed circuit, the first through hole extends from a bottom of the first accommodating groove towards a direction away from the first surface and penetrates a second surface of the flexible printed circuit opposite to the first surface, an orthographic projection of the first through hole onto the display panel is within an orthographic projection of the electrical-insulating and heat-conducting adhesive layer onto the display panel.

8. The display module according to claim 5 , wherein the electrical-insulating and heat-conducting adhesive layer surrounds and covers the driver IC externally, and the metal sheet is an annular structure enclosing the electrical-insulating and heat-conducting adhesive layer peripherally.

9. The display module according to claim 5 , wherein the metal sheet is a copper foil.

10. The display module according to claim 3 , wherein the heat dissipation structure further comprises a heat dissipation member, the heat dissipation member being attached to a portion of the metal sheet exposed outside the flexible printed circuit.

11. The display module according to claim 10 , wherein the heat dissipation member is a thermal conductive adhesive at least partially overlying the portion of the metal sheet exposed outside the flexible printed circuit.

12. The display module according to claim 1 , wherein the heat dissipation structure comprises:
a heat dissipation hole provided at a bottom of the first accommodating groove and penetrating the flexible printed circuit;
a first heat-conducting metal member, wherein the first beat-conducting metal member comprises a first portion passing through the heat dissipation hole and a second portion extending into the first accommodating groove and being attached to the display panel, and the second portion is a second accommodating groove enclosing the driver IC externally.

13. The display module according to claim 12 , wherein the heat dissipation structure further comprises a second heat-conducting metal member attached to the first heat-conducting metal member, the second heat-conducting metal member being disposed in parallel on a second surface of the flexible printed circuit opposite to the first surface.

14. The display module according to claim 13 , wherein a space between the first portion and the heat dissipation hole is filled with an electrical-insulating and heat-conducting adhesive layer, a space between the second portion and the first accommodating groove is filled with an electrical-insulating and heat-conducting adhesive layer, and a space between the second heat-conducting metal member and the second surface is filled with an electrical-insulating and heat-conducting adhesive layer.

15. The display module according to claim 12 , wherein the driver IC is a strip-shaped structure, the heat dissipation structure comprises one or more heat dissipation units distributed along an extension direction of the driver IC, and each of the heat dissipation units comprises the heat dissipation hole and the first heat-conducting metal member.

16. The display module according to claim 12 , wherein the driver IC is surrounded and covered externally by an electrical-insulating and heat-conducting adhesive layer.

17. The display module according to claim 1 , wherein a bonding part for bonding to the display panel is disposed on the flexible printed circuit, and the bonding part and the first accommodating groove are located on a same side of the flexible printed circuit.

18. A display device, comprising a display module, wherein the display module comprises: a display panel and a flexible printed circuit bonded to the display panel:
the display panel comprises a display area and a non-display area disposed at the periphery of the display area, the non-display area comprises a bonding area disposed on one side of the display area, and a driver integrated circuit (IC) is disposed in the bonding area;
the flexible printed circuit comprises a main body part, an orthographic projection of the main body part onto the display panel is in the bonding area, and a first accommodating groove for accommodating the driver IC is provided in a first surface of the flexible printed circuit close to the display panel; and
a heat dissipation structure, extending from within the first accommodating groove to outside the flexible printed circuit, is further disposed between the flexible printed circuit and the bonding area.

19. The display module according to claim 13 , wherein the driver IC is a strip-shaped structure, the heat dissipation structure comprises one or more heat dissipation units distributed along an extension direction of the driver IC, and each of the heat dissipation units comprises the heat dissipation hole and the first heat-conducting metal member.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Cai Yangyang
• Liang Hengzhen
• Xie Zhihao
• Zhang Ying
• Min Hang

Classifications

• H05K2201/10128

  Display · CPC title

• H05K1/189 Primary

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K7/20963 Primary

  Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20972 takes precedence) · CPC title

• G09F9/30

  in which the desired character or characters are formed by combining individual elements (panels comprising a number of electrodes in a single cell controlling light arriving from an independent light source, e.g. electro-optical or magneto-optical cell, G02F1/00) · CPC title