Manufacturing method of continuous sheet for circuit board production and continuous sheet for circuit board production manufactured therefrom

Patent metadata

Field	Value
Publication number	US-12225669-B2
Application number	US-201916966766-A
Country	US
Kind code	B2
Filing date	Oct 1, 2019
Priority date	Oct 4, 2018
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

The present disclosure relates to a manufacturing method of a continuous sheet for circuit board production providing reel type laminates in a roll-to-roll continuous process without a belt press by connecting at least two or more sheet type metal laminates using an adhesion substrate which includes a reinforcement film and a conductor, the manufacturing method providing improved mechanical properties, and excellent chemical resistance and productivity, and the continuous sheet for circuit board production manufactured therefrom.

First claim

The invention claimed is:

1. A manufacturing method of a continuous sheet for circuit board production comprising:
providing at least two or more sheet type metal laminates, each of which including a metal foil, adjoined in series in a length direction of the metal foil, and
winding an adhesion substrate one or more turns around a perimeter of an adjoining portion of the adjoined sheet type metal laminates,
wherein the adhesion substrate includes a first adhesion substrate and a second adhesion substrate,
wherein the step of winding an adhesion substrate includes:
winding the first adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adjoining portion of the adjoined sheet type metal laminates; and
winding the second adhesion substrate 0.5 turns to 1.5 turns around the perimeter of the adjoining portion of the adjoined sheet type metal laminates, around which the first adhesion substrate has been wound, subsequently to the first adhesion substrate.

2. The manufacturing method of a continuous sheet for circuit board production according to claim 1 ,
wherein the first and second adhesion substrates are:
1) A reinforcement adhesion substrate including a reinforcement film layer, and an adhesive layer coated onto at least one surface of the reinforcement film layer; and
2) a conductor adhesion substrate including a conductor layer, and an adhesive layer coated onto at least one surface of the conductor layer,
or vice versa.

3. The manufacturing method of a continuous sheet for circuit board production according to claim 2 ,
wherein the conductor layer has a thickness of 7 μm to 35 μm and includes copper, steel use stainless, or aluminum foil.

4. The manufacturing method of a continuous sheet for circuit board production according to claim 2 ,
wherein the reinforcement film layer has a thickness of 5 μm to 25 μm and includes one or more polymer resins selected from the group consisting of polyimide, polyethylene naphthalate, polyethylene terephthalate glycol, polycarbonate and polyphenylene sulfide.

5. The manufacturing method of a continuous sheet for circuit board production according to claim 2 ,
wherein the adhesive layer has a thickness of 1 μm to 10 μm and is formed using a varnish containing an adhesive resin and a conductive powder in a weight ratio of 1:0.005 to 1:0.015.

6. The manufacturing method of a continuous sheet for circuit board production according to claim 5 ,
wherein the conductive powder includes one or more selected from the group consisting of copper, aluminum, nickel, silver, and iron.

7. The manufacturing method of a continuous sheet for circuit board production according to claim 5 ,
wherein the adhesive resin includes one or more selected from the group consisting of polyimide-based resin, epoxy-based resin, acrylic-based resin, phenoxy-based resin and polyisocyanate-based resin, having a weight average molecular weight of 33000 g/mol to 38000 g/mol.

8. The manufacturing method of a continuous sheet for circuit board production according to claim 1 ,
further comprising a step of forming a metal layer on the outermost part of the adhesion substrate.

9. The manufacturing method of a continuous sheet for circuit board production according to claim 1 ,
wherein the sheet type metal laminate is manufactured by a method comprising:
producing a prepreg by impregnating a fabric substrate into a thermosetting resin vanish and then semi-curing the thermosetting resin vanish,
laminating one or more of the prepregs, and
laminating a metal foil on one or both sides of the prepreg, followed by heating and pressing.

10. The manufacturing method of a continuous sheet for circuit board production according to claim 1 ,
further comprising a step of winding at least two or more sheet type metal laminates connected by the adhesion substrate in a horizontal direction via a guide means.

11. The manufacturing method of a continuous sheet for circuit board production according to claim 1 ,
wherein the step of providing at least two or more sheet type metal laminates comprises:
providing the at least two or more sheet type metal laminates cut into a predetermined size; and
placing the at least two or more sheet type metal laminates horizontally and so as to be in contact with each other.

Assignees

• Lg Chemical Ltd

Inventors

• Oh Hyung Suk
• Jung Kwanghee
• Kim Chul Young
• Kim Ji Hyup

Classifications

• H05K3/0064

  onto a polymeric substrate · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B38/18

  Handling of layers or the laminate · CPC title

• B32B15/01

  all layers being exclusively metallic {(making layered metal workpieces by pressure cladding B23K20/22; making coatings with a metallic material characterised by its composition C23C30/00)} · CPC title