Memory slot and printed circuit board and network system

Patent metadata

Field	Value
Publication number	US-12224529-B2
Application number	US-202318243779-A
Country	US
Kind code	B2
Filing date	Sep 8, 2023
Priority date	Dec 19, 2017
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

A chip slot is disclosed, which includes a slot, where a plurality of terminal groups are disposed in the slot, terminals in each terminal group include metal sheets that are symmetrically disposed on two opposite inner side walls of the slot, and each metal sheet has a bending pin that extends outside the slot; bending directions of bending pins on the terminals in each terminal group are same; and for any row of metal sheets in any two adjacent terminal groups, along an arrangement direction of the row of metal sheets, bending pins of the metal sheets in the adjacent terminal groups are alternately arranged on both sides of the row of metal sheets. The bending pins of the row of metal sheets are bent toward two different directions.

First claim

What is claimed is:

1. A memory slot, comprising:
a slot; and
a first and second rows of metal sheets located in the slot, wherein the first row of metal sheets is disposed on a first inner side wall of the slot, the second row of metal sheets is disposed on a second inner side wall of the slot that is opposite to the first inner side wall, and an extension direction of a long side of each of the first and second inner side walls is parallel to a longitudinal direction of the slot;
wherein the first and second rows of metal sheets comprise a plurality of terminal groups, each terminal group comprises at least one pair of metal sheets, one metal sheet in each pair of metal sheets is located in the first row, the other metal sheet of each pair of metal sheets is located in the second row, and each pair of metal sheets are symmetrically disposed in the slot; and
wherein bending directions of bending pins of a plurality of metal sheets located in a same terminal group are identical, bending directions corresponding to two adjacent terminal groups are opposite, and a bending direction corresponding to a terminal group is aligned with bending directions of bending pins of a plurality of metal sheets located in the terminal group;
wherein a pad is disposed at an end of each bending pin; wherein solder is disposed on the pad corresponding to the bending pin.

2. The memory slot according to claim 1 , wherein a bending direction corresponding to each terminal group is perpendicular to a depth direction of the slot.

3. The memory slot according to claim 1 , wherein main bodies of a plurality of metal sheets that are in the two adjacent terminal groups and located in the first row are all located on a first straight line, a bending pin of at least one metal sheet that is in a first terminal group of the two adjacent terminal groups and located in the first row is located on one side of the first straight line, and a bending pin of at least one metal sheet that is in a second terminal group of the two adjacent terminal groups and located in the first row is located on the other side of the first straight line.

4. The memory slot according to claim 3 , wherein an end of the bending pin of the at least one metal sheet that is in the first terminal group and located in the first row is located on a second straight line, an end of the bending pin of the at least one metal sheet that is in the second terminal group and located in the first row is located on a third straight line, and both the second straight line and the third straight line are parallel to the first straight line.

5. The memory slot according to claim 4 , wherein two adjacent pairs of metal sheets are respectively used to transmit different types of signals.

6. The memory slot according to claim 5 , wherein one of the two adjacent pairs of metal sheets are used to transmit a signal, and the other pair of metal sheets are used for grounding.

7. The memory slot according to claim 1 , wherein the pad has a protrusion structure.

8. The memory slot according to claim 7 , wherein protrusion directions of protrusion structures of two adjacent metal sheets that are in the same terminal group and located in the first row of metal sheets are opposite.

9. An electronic device, comprising:
a printed circuit board; and
a memory slot disposed on the printed circuit board, the memory slot having a slot and a first and second rows of metal sheets located in the slot, wherein the first row of metal sheets is disposed on a first inner side wall of the slot, the second row of metal sheets is disposed on a second inner side wall of the slot that is opposite to the first inner side wall, and an extension direction of a long side of each of the first and second inner side walls is parallel to a longitudinal direction of the slot;
wherein the first and second rows of metal sheets comprise a plurality of terminal groups, each terminal group comprises at least one pair of metal sheets, one metal sheet in each pair of metal sheets is located in the first row, the other metal sheet in each pair of metal sheets is located in the second row, and each pair of metal sheets are symmetrically disposed in the slot; and
wherein bending directions of bending pins of a plurality of metal sheets located in a same terminal group are identical, bending directions corresponding to two adjacent terminal groups are opposite, and a bending direction corresponding to a terminal group is aligned with bending directions of bending pins of a plurality of metal sheets located in the terminal group;
wherein a pad is disposed at an end of each bending pin; wherein solder is disposed on the pad corresponding to the bending pin.

10. The electronic device according to claim 9 , wherein a bending direction corresponding to each terminal group is perpendicular to a depth direction of the slot.

11. The electronic device according to claim 9 , wherein main bodies of a plurality of metal sheets that are in the two adjacent terminal groups and located in the first row are all located on a first straight line, a bending pin of at least one metal sheet that is in a first terminal group of the two adjacent terminal groups and located in the first row is located on one side of the first straight line, and a bending pin of at least one metal sheet that is in a second terminal group of the two adjacent terminal groups and located in the first row is located on the other side of the first straight line.

12. The electronic device according to claim 11 , wherein an end of the bending pin of the at least one metal sheet that is in the first terminal group and located in the first row is located on a second straight line, an end of the bending pin of the at least one metal sheet that is in the second terminal group and located in the first row is located on a third straight line, and both the second straight line and the third straight line are parallel to the first straight line.

13. The electronic device according to claim 12 , wherein two adjacent pairs of metal sheets are respectively used to transmit different types of signals.

14. The electronic device according to claim 13 , wherein one of the two adjacent pairs of metal sheets are used to transmit a signal, and the other pair of metal sheets are used for grounding.

15. The electronic device according to claim 9 , wherein the pad has a protrusion structure.

16. The electronic device according to claim 15 , wherein protrusion directions of protrusion structures of two adjacent metal sheets that are in the same terminal group and located in the first row of metal sheets are opposite.

Assignees

• Huawei Tech Co Ltd

Inventors

• Liu Tianren
• Ou kanghua
• Cai Yuanbin
• Zhong Junwei
• Chen Xianfeng
• Wang Feng
• Zhang Zhiwei

Classifications

• H01R13/10

  Sockets for co-operation with pins or blades · CPC title

• H01R12/721

  cooperating directly with the edge of the rigid printed circuits · CPC title

• H01R13/6461 Primary

  Means for preventing cross-talk · CPC title

• H01R12/57

  surface mounting terminals · CPC title

• H01R12/707

  Soldering or welding · CPC title