Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation method

Patent metadata

Field	Value
Publication number	US-12224250-B2
Application number	US-202318328892-A
Country	US
Kind code	B2
Filing date	Jun 5, 2023
Priority date	Mar 26, 2020
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

First claim

What is claimed is:

1. A film formation apparatus,
the apparatus being configured to form an electromagnetic wave attenuator, the attenuator including a first structure body,
the first structure body including
a first member in which a plurality of first magnetic layers and a plurality of first nonmagnetic layers are alternately stacked, and
a second member in which a plurality of second magnetic layers and a plurality of second nonmagnetic layers are alternately stacked,
a thickness of one of the plurality of first magnetic layers being greater than a thickness of one of the plurality of second magnetic layers,

the apparatus comprising:
a container configured to maintain an atmosphere depressurized from atmospheric pressure;
a first film formation part, a second film formation part, and a third film formation part, the first, second, and third film formation parts being provided in the container, the first, second, and third film formation parts including a sputter source to form the electromagnetic wave attenuator by depositing a film formation material on a processing body by sputtering;
a transfer part provided in the container, the transfer part being configured to circulatively transfer the processing body in a circumferential trajectory to the first film formation part, the second film formation part, and the third film formation part; and
a controller configured to control the first, second and third film formation parts, and the transfer part,
when forming one of the plurality of first magnetic layers, the controller being configured to
cause the transfer part to circulatively transfer the processing body to the first film formation part and the second film formation part,
cause the first film formation part to form a part of the one of the plurality of first magnetic layers, and cause the second film formation part to form remaining portion the one of the plurality of first magnetic layers,
cause the transfer part to circulatively transfer the processing body to the third film formation part after the forming the one of the plurality of first magnetic layers, and
cause the third film formation part to form one of the plurality of first nonmagnetic layers, and

when forming one of the plurality of second magnetic layers, the controller being configured to
cause the transfer part to circulatively transfer the processing body to the first film formation part and the second film formation part,
cause the first film formation part to form the one of the plurality of second magnetic layers and cause the second film formation part to form an other one of the plurality of second magnetic layers,
cause the transfer part to circulatively transfer the processing body to the third film formation part after the forming the one of the plurality of second magnetic layers, and
cause the third film formation part to form one of the plurality of second nonmagnetic layers.

2. The apparatus according to claim 1 , further comprising:
a partition part partitioning a film formation position at which the processing body is formed by the sputter sources of the first, second, and third film formation parts,
the controller causes the processing body to a pass through a film formation position at which film formation of one type of film formation material is performed while depositing the one type of film formation material on the processing body, causes the processing body to pass through a region other than the film formation position at which the film formation of the one type of film formation material is performed, and causes the processing body to again reach the film formation position at which the film formation of the one type of film formation material is performed.

3. The film formation apparatus according to claim 1 , wherein
a number of one of formations of the first magnetic layers and formations of the second magnetic layers is detected, and
the one of formations of the first magnetic layers and formations of the second magnetic layers is stopped when the number reaches a determined value.

4. The film formation apparatus according to claim 1 , wherein
a number of formations of at least one of the first magnetic layers or the first nonmagnetic layers is detected, and
the formations of the first member is stopped when the number of formation of the first magnetic layer or the number of formation of the first nonmagnetic layer reaches a determined value.

5. The film formation apparatus according to claim 1 , wherein
a number of formations of at least one of the second magnetic layers or the second nonmagnetic layers is detected, and
the formations of the second member is stopped when the number of formation of the second magnetic layer or the number of formation of the second nonmagnetic layer reaches a determined value.

6. The film formation apparatus according to claim 1 , wherein
the first structure body further includes a third member in which a plurality of third magnetic layers and a plurality of third nonmagnetic layers are alternately stacked,
the controller is further configured to cause at least one of the first film formation part, the second film formation part, or a third film formation part form the plurality of third magnetic layers,
a number of formations of at least one of the third magnetic layers or the third nonmagnetic layers is detected, and
the formations of the third member is stopped when the number of formation of the third magnetic layer or the number of formation of the third nonmagnetic layer reaches a determined value.

7. A film formation apparatus,
the apparatus being configured to form an electromagnetic wave attenuator, the attenuator including a first structure body,
the first structure body including
a first member in which a plurality of first magnetic layers and a plurality of first nonmagnetic layers are alternately stacked, and
a second member in which a plurality of second magnetic layers and a plurality of second nonmagnetic layers are alternately stacked,
a thickness of one of the plurality of first magnetic layers being greater than a thickness of one of the plurality of second magnetic layers,

the apparatus comprising:
a container configured to maintain an atmosphere depressurized from atmospheric pressure;
a first film formation part, a second film formation part, and a third film formation part, the first, second, and third film formation parts being provided in the container, the first, second, and third film formation parts including a sputter source to form the electromagnetic wave attenuator by depositing a film formation material on a processing body by sputtering;
a transfer part provided in the container, the transfer part being configured to circulatively transfer the processing body in a circumferential trajectory to the first film formation part, the second film formation part, and the third film formation part; and
a controller configured to control the first, second and third film formation parts, and the transfer part,
when forming one of the plurality of first magnetic layers, the controller being configured to
cause the transfer part to circulatively transfer the processing body to the first film formation part or the second film formation part,
cause the first film formation part to form the one of the plurality of first magnetic layers, or cause the second film formation part to form the one of the plurality of first magnetic layers,
cause the transfer part to circulatively transfer the processing body to the third film formation part after the forming the one of the plurality of first magnetic layers, and
cause the third film formation part to form one of the plurality of first nonmagnetic layers, and

when forming one of the plurality of second magneti

Assignees

• Shibaura Mechatronics Corp

Inventors

• Nishigaki Hisashi
• Fujita Atsushi
• Tanabe Shohei
• Kamo Yoshinao
• Matsunaka Shigeki

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W42/287

  materials for magnetic shielding, e.g. ferromagnetic materials · CPC title

• H10W42/276

  the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W42/20 Primary

  protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons · CPC title