Methods for making euv patternable hard masks
US-2021013034-A1 · Jan 14, 2021 · US
US12221691B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12221691-B2 |
| Application number | US-202217992166-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 22, 2022 |
| Priority date | Nov 24, 2021 |
| Publication date | Feb 11, 2025 |
| Grant date | Feb 11, 2025 |
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The invention provides certain organotin compounds which are believed to be useful in the vapor deposition of tin-containing films onto the surface of microelectronic device substrates, as well as in the deposition of EUV-patternable films. Also provided are certain novel precursor compositions. Also disclosed are processes for using the novel precusors to form films.
Opening claim text (preview).
What is claimed is: 1. A process for the deposition of a tin-containing film onto a surface of a microelectronic device in a reaction zone, which comprises introducing into the reaction zone, a precursor composition comprising at least one compound chosen from Formula (I): wherein R 1 is a divalent group chosen from —C(R) 2 —, —CR(X)—, —O—, and —N(R)—, wherein R is chosen from H and C 1 -C 5 alkyl, wherein X is chosen from F, Cl, Br, I, —OCH 3 , —OCH 2 CH 3 , —OCH 2 CH 2 CH 3 , and —OCH(CH 3 ) 2 , and R 2 is chosen from H, —N(R) 2 , and —OR, and —R 1 ; under vapor deposition conditions. 2. The process of claim 1 , wherein R 1 is a group of the formula —N(R)—. 3. The process of claim 1 , wherein R 2 is a group of the formula —N(R) 2 . 4. The process of claim 1 , wherein the vapor deposition conditions are atomic layer deposition conditions. 5. A process for the deposition of a tin-containing film onto a surface of a microelectronic device in a reaction zone, which comprises introducing into the reaction zone, a precursor composition comprising at least one compound chosen from Formula (I): wherein R 1 is a divalent group chosen from —C(R) 2 —, —CR(X)—, —O—, and —N(R)—, wherein R is chosen from H and C 1 -C 5 alkyl, wherein X is chosen from F, Cl, Br, I, —OCH 3 , —OCH 2 CH 3 , —OCH 2 CH 2 CH 3 , and —OCH(CH 3 ) 2 , and R 2 is chosen from H, —N(R) 2 , and —OR, and —R 1 ; and at least one counter-reactant chosen from compounds capable of reacting with —OR and —N(R) 2 , under vapor deposition conditions. 6. The process of claim 5 , wherein R 1 is a group of the formula —N(R)—. 7. The process of claim 5 , wherein R 2 is a group of the formula —N(R) 2 . 8. The process of claim 5 , wherein the vapor deposition conditions are atomic layer deposition conditions.
characterized by the use of precursors specially adapted for ALD · CPC title
Compounds with one or more Sn-N linkages · CPC title
Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title
from metallo-organic compounds · CPC title
of zinc, germanium, cadmium, indium, tin, thallium or bismuth · CPC title
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