Process for producing a pressure-sensitive adhesive based on acrylonitrile-butadiene rubber and adhesive tape comprising said adhesive

Patent metadata

Field	Value
Publication number	US-12221570-B2
Application number	US-201917416751-A
Country	US
Kind code	B2
Filing date	Dec 17, 2019
Priority date	Dec 19, 2018
Publication date	Feb 11, 2025
Grant date	Feb 11, 2025

Abstract

A process for producing a cured pressure-sensitive adhesive that comprises a composition including at least one solid acrylonitrile-butadiene rubber, at least one tackifier resin, and optionally at least one liquid acrylonitrile-butadiene rubber, comprises subjecting the composition to electron-beam irradiation (EBC) with an acceleration voltage of 1.8 to 2.38 kV per 1 pm layer thickness of the composition and with a total beam dose of 5 to 50 kGy. Also disclosed is a cured pressure-sensitive adhesive obtained or obtainable by the process. Further disclosed is a double-sidedly adhering, especially carrierless, adhesive tape, and also single- or double-sidedly adhering adhesive tape comprising, on a carrier layer, the cured pressure-sensitive adhesive. Disclosed finally is the use of the pressure-sensitive adhesive or of an adhesive tape made therefrom for bonding components in electronic devices, especially in mobile electronic devices, preferably tablets, mobile phones or smart watches.

First claim

The invention claimed is:

1. A method of producing a cured pressure-sensitive adhesive from a composition comprising:
a) at least one solid acrylonitrile-butadiene rubber,
b) at least one tackifier resin, and
c) optionally at least one liquid acrylonitrile-butadiene rubber,

said method comprising subjecting the composition to electron beam irradiation (EBI) with an acceleration voltage per 1 μm of layer thickness of the composition of 1.8 to 2.38 kV and a total radiation dose of 5 to 50 kGy to obtain the cured pressure-sensitive adhesive.

2. The method as claimed in claim 1 , wherein the acceleration voltage per 1 μm of layer thickness of the composition is 1.9 to 2.3 kV.

3. The method as claimed in claim 1 , wherein the total radiation dose is 5 to 40 kGy.

4. The method as claimed in claim 1 , wherein the at least one solid acrylonitrile-butadiene rubber (a) has an acrylonitrile content of 20% to 40% by weight based on a total weight of the solid acrylonitrile-butadiene rubber.

5. The method as claimed in claim 1 , wherein the composition contains the at least one solid acrylonitrile-butadiene rubber in a total amount of 50 to 80 parts by weight, where parts by weight of (a), (b) and (c) are normalized such that (a)+ (b)+ (c) adds up to 100.

6. The method as claimed in claim 1 , wherein the at least one tackifier resin (b) is a modified aromatic hydrocarbon resin.

7. The method as claimed in claim 1 , wherein the composition contains the at least one tackifier resin (b) in a total amount of 20 to 50 parts by weight, where parts by weight of (a), (b) and (c) are normalized such that (a)+ (b)+ (c) adds up to 100.

8. The method as claimed in claim 1 , wherein the composition comprises at least one liquid acrylonitrile-butadiene rubber, and the at least one liquid acrylonitrile-butadiene rubber (c) has an acrylonitrile content of 25% to 45% by weight, based on a total weight of the liquid acrylonitrile-butadiene rubber.

9. The method as claimed in claim 1 , wherein the composition contains the at least one liquid acrylonitrile-butadiene rubber (c) in a total amount of 1 to 10 parts by weight, where parts by weight of (a), (b) and (c) are normalized such that (a)+ (b)+ (c) adds up to 100.

10. The method as claimed in claim 1 , wherein the composition contains polymers other than components (a) to (c) in a total amount of 0 to 5 parts by weight, based on (a)+ (b)+ (c)=100.

11. The method as claimed in claim 1 , wherein the composition additionally comprises at least one compound (d) selected from the group consisting of aging agents, separating agents, fillers, dyes, plasticizers, and mixtures thereof, wherein the composition contains the at least one compound (d) in a total amount of 0.1 to 5 parts by weight, based on (a)+ (b)+ (c)=100.

12. A cured pressure-sensitive adhesive obtained by a method as claimed in claim 1 .

13. A single - or double-sided adhesive tape, comprising a cured pressure-sensitive adhesive as claimed in claim 12 on a carrier layer.

14. A double-sided adhesive tape comprising a cured pressure-sensitive adhesive as claimed in claim 12 , wherein the double-sided adhesive tape is in a carrier-free configuration.

15. A method of bonding a component in an electronic device with an adhesive or an adhesive tape comprising said adhesive, said method comprising applying said adhesive or adhesive tape to said component, wherein the adhesive is a cured pressure-sensitive adhesive as claimed in claim 12 .

16. A method of producing a cured pressure-sensitive adhesive from a composition comprising:
a) 62 to 67 parts by weight of at least one solid acrylonitrile-butadiene rubber based on a total of 100 parts by weight of the composition, wherein the at least one solid acrylonitrile-butadiene rubber has an acrylonitrile content of 20 to 25 percent by weight based on a total weight of the solid acrylonitrile-butadiene rubber;
b) 27 to 34.5 parts by weight of at least one modified aromatic hydrocarbon tackifier resin based on a total weight of the composition; and
c) 2.5 to 6 parts by weight of at least one liquid acrylonitrile-butadiene rubber based on a total of 100 parts by weight of the composition, wherein the at least one liquid acrylonitrile-butadiene rubber has an acrylonitrile content of 25 to 35 percent by weight based on a total weight of the liquid acrylonitrile-butadiene rubber;

said method comprising subjecting the composition to electron beam irradiation (EBI) with an acceleration voltage per 1 μm of layer thickness of the composition of 1.8 to 2.38 kV and a total radiation dose of 5 to 50 kGy to obtain the cured pressure-sensitive adhesive.

Assignees

• Tesa Se

Inventors

• Schönrock Julia
• Lim Cairong
• Tepe Yeliz

Classifications

• C09J2467/006

  in the substrate · CPC title

• C09J2409/00

  Presence of diene rubber · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J2301/302

  the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C · CPC title

• C09J2301/124

  the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape · CPC title