Composition for injection molding, sintered compact, and method for producing sintered compact
US-2015376397-A1 · Dec 31, 2015 · US
US12221386B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12221386-B2 |
| Application number | US-202017005781-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 28, 2020 |
| Priority date | Mar 1, 2018 |
| Publication date | Feb 11, 2025 |
| Grant date | Feb 11, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A ceramic molded body including a ceramic powder and an organic binder includes an oxidizable ceramic powder as the ceramic powder, includes an oxidizable metal or metal compound, or is in contact with a solid body including an oxidizable metal or metal compound. In a hydrogen atmosphere, the ceramic molded body is heated to a maximum temperature set within a range of 1,100° C. to 1,400° C. at a heating rate of more than 25° C./h, is degreased at the maximum temperature, and is then cooled at a cooling rate of more than 25° C./h.
Opening claim text (preview).
What is claimed is: 1. A method for degreasing a ceramic molded body, comprising degreasing a ceramic molded body including a ceramic powder and an organic binder, wherein the ceramic molded body includes an oxidizable ceramic powder as the ceramic powder, includes an oxidizable metal or metal compound, or is in contact with a solid body including an oxidizable metal or metal compound, and in an atmosphere of hydrogen gas alone or in an atmosphere of a mixture of an inert gas and hydrogen gas with a hydrogen gas concentration of 20% by volume or more, the ceramic molded body is heated to a maximum temperature set within a range of 1,100° C. to 1,400° C. at a heating rate of more than 25° C./h, is degreased at the maximum temperature, and is then cooled at a cooling rate of more than 25° C./h, and wherein the ceramic molded body is degreased without oxidizing the oxidizable ceramic powder and the oxidizable metal or metal compound, and without forming cracks in the ceramic molded body. 2. A method for degreasing a ceramic molded body, comprising degreasing a ceramic molded body including a ceramic powder and an organic binder, wherein the ceramic molded body includes an oxidizable ceramic powder as the ceramic powder, includes an oxidizable metal or metal compound, or is in contact with a solid body including an oxidizable metal or metal compound, and in an atmosphere of hydrogen gas alone or in an atmosphere of a mixture of an inert gas and hydrogen gas with a hydrogen gas concentration of 20% by volume or more, the ceramic molded body is heated to an intermediate temperature set within a range of 600° C. to 1,100° C. at a heating rate of more than 25° C./h, is held at the intermediate temperature for a predetermined period of time, is heated to a maximum temperature set above the intermediate temperature within a range of 1,100° C. to 1,400° C. at a heating rate of more than 25° C./h, is degreased at the maximum temperature, and is then cooled at a cooling rate of more than 25° C./h, and wherein the ceramic molded body is degreased without oxidizing the oxidizable ceramic powder and the oxidizable metal or metal compound, and without forming cracks in the ceramic molded body. 3. The method for degreasing a ceramic molded body according to claim 1 , wherein the oxidizable ceramic powder is aluminum nitride, silicon nitride, or silicon carbide. 4. The method for degreasing a ceramic molded body according to claim 1 , wherein the oxidizable metal is Ni, W, or Mo, and the oxidizable metal compound is WC or MoC. 5. The method for degreasing a ceramic molded body according to claim 1 , wherein the heating and cooling rates are 50° C./h to 500° C./h. 6. The method for degreasing a ceramic molded body according to claim 1 , wherein the ceramic molded body has a porosity of 20% by volume to 70% by volume. 7. A method for manufacturing a ceramic fired body, comprising: a degreasing step of degreasing a ceramic molded body including a ceramic powder and an organic binder; and a firing step of firing the degreased ceramic molded body, wherein the method for degreasing a ceramic molded body according to claim 1 is employed in the degreasing step. 8. The method for degreasing a ceramic molded body according to claim 2 , wherein the oxidizable ceramic powder is aluminum nitride, silicon nitride, or silicon carbide. 9. The method for degreasing a ceramic molded body according to claim 2 , wherein the oxidizable metal is Ni, W, or Mo, and the oxidizable metal compound is WC or MoC. 10. The method for degreasing a ceramic molded body according to claim 2 , wherein the heating and cooling rates are 50° C./h to 500° C./h. 11. The method for degreasing a ceramic molded body according to claim 2 , wherein the ceramic molded body has a porosity of 20% by volume to 70% by volume. 12. A method for manufacturing a ceramic fired body, comprising: a degreasing step of degreasing a ceramic molded body including a ceramic powder and an organic binder; and a firing step of firing the degreased ceramic molded body, wherein the method for degreasing a ceramic molded body according to claim 2 is employed in the degreasing step.
Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title
Hydrogen containing atmosphere · CPC title
Heating rate · CPC title
Burning or sintering processes (C04B33/32 takes precedence {; powder metallurgy B22F}) · CPC title
Removal thereof · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.