Method for degreasing shaped ceramic molded body and method for manufacturing ceramic fired body

US12221386B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12221386-B2
Application numberUS-202017005781-A
CountryUS
Kind codeB2
Filing dateAug 28, 2020
Priority dateMar 1, 2018
Publication dateFeb 11, 2025
Grant dateFeb 11, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A ceramic molded body including a ceramic powder and an organic binder includes an oxidizable ceramic powder as the ceramic powder, includes an oxidizable metal or metal compound, or is in contact with a solid body including an oxidizable metal or metal compound. In a hydrogen atmosphere, the ceramic molded body is heated to a maximum temperature set within a range of 1,100° C. to 1,400° C. at a heating rate of more than 25° C./h, is degreased at the maximum temperature, and is then cooled at a cooling rate of more than 25° C./h.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for degreasing a ceramic molded body, comprising degreasing a ceramic molded body including a ceramic powder and an organic binder, wherein the ceramic molded body includes an oxidizable ceramic powder as the ceramic powder, includes an oxidizable metal or metal compound, or is in contact with a solid body including an oxidizable metal or metal compound, and in an atmosphere of hydrogen gas alone or in an atmosphere of a mixture of an inert gas and hydrogen gas with a hydrogen gas concentration of 20% by volume or more, the ceramic molded body is heated to a maximum temperature set within a range of 1,100° C. to 1,400° C. at a heating rate of more than 25° C./h, is degreased at the maximum temperature, and is then cooled at a cooling rate of more than 25° C./h, and wherein the ceramic molded body is degreased without oxidizing the oxidizable ceramic powder and the oxidizable metal or metal compound, and without forming cracks in the ceramic molded body. 2. A method for degreasing a ceramic molded body, comprising degreasing a ceramic molded body including a ceramic powder and an organic binder, wherein the ceramic molded body includes an oxidizable ceramic powder as the ceramic powder, includes an oxidizable metal or metal compound, or is in contact with a solid body including an oxidizable metal or metal compound, and in an atmosphere of hydrogen gas alone or in an atmosphere of a mixture of an inert gas and hydrogen gas with a hydrogen gas concentration of 20% by volume or more, the ceramic molded body is heated to an intermediate temperature set within a range of 600° C. to 1,100° C. at a heating rate of more than 25° C./h, is held at the intermediate temperature for a predetermined period of time, is heated to a maximum temperature set above the intermediate temperature within a range of 1,100° C. to 1,400° C. at a heating rate of more than 25° C./h, is degreased at the maximum temperature, and is then cooled at a cooling rate of more than 25° C./h, and wherein the ceramic molded body is degreased without oxidizing the oxidizable ceramic powder and the oxidizable metal or metal compound, and without forming cracks in the ceramic molded body. 3. The method for degreasing a ceramic molded body according to claim 1 , wherein the oxidizable ceramic powder is aluminum nitride, silicon nitride, or silicon carbide. 4. The method for degreasing a ceramic molded body according to claim 1 , wherein the oxidizable metal is Ni, W, or Mo, and the oxidizable metal compound is WC or MoC. 5. The method for degreasing a ceramic molded body according to claim 1 , wherein the heating and cooling rates are 50° C./h to 500° C./h. 6. The method for degreasing a ceramic molded body according to claim 1 , wherein the ceramic molded body has a porosity of 20% by volume to 70% by volume. 7. A method for manufacturing a ceramic fired body, comprising: a degreasing step of degreasing a ceramic molded body including a ceramic powder and an organic binder; and a firing step of firing the degreased ceramic molded body, wherein the method for degreasing a ceramic molded body according to claim 1 is employed in the degreasing step. 8. The method for degreasing a ceramic molded body according to claim 2 , wherein the oxidizable ceramic powder is aluminum nitride, silicon nitride, or silicon carbide. 9. The method for degreasing a ceramic molded body according to claim 2 , wherein the oxidizable metal is Ni, W, or Mo, and the oxidizable metal compound is WC or MoC. 10. The method for degreasing a ceramic molded body according to claim 2 , wherein the heating and cooling rates are 50° C./h to 500° C./h. 11. The method for degreasing a ceramic molded body according to claim 2 , wherein the ceramic molded body has a porosity of 20% by volume to 70% by volume. 12. A method for manufacturing a ceramic fired body, comprising: a degreasing step of degreasing a ceramic molded body including a ceramic powder and an organic binder; and a firing step of firing the degreased ceramic molded body, wherein the method for degreasing a ceramic molded body according to claim 2 is employed in the degreasing step.

Assignees

Inventors

Classifications

  • Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

  • Hydrogen containing atmosphere · CPC title

  • Heating rate · CPC title

  • Burning or sintering processes (C04B33/32 takes precedence {; powder metallurgy B22F}) · CPC title

  • C04B35/638Primary

    Removal thereof · CPC title

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Frequently asked questions

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What does patent US12221386B2 cover?
A ceramic molded body including a ceramic powder and an organic binder includes an oxidizable ceramic powder as the ceramic powder, includes an oxidizable metal or metal compound, or is in contact with a solid body including an oxidizable metal or metal compound. In a hydrogen atmosphere, the ceramic molded body is heated to a maximum temperature set within a range of 1,100° C. to 1,400° C. at …
Who is the assignee on this patent?
Ngk Insulators Ltd
What technology area does this patent fall under?
Primary CPC classification C04B35/638. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Feb 11 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).