Coated electrical assembly

Patent metadata

Field	Value
Publication number	US-12219716-B2
Application number	US-202117505802-A
Country	US
Kind code	B2
Filing date	Oct 20, 2021
Priority date	Mar 6, 2012
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

An electrical assembly which comprises a substrate and a conformal coating deposited on at least one surface of the substrate by plasma polymerization of a compound of formula (I) and deposition of a resulting polymer of the compound of formula (I), and plasma polymerization of a fluorohydrocarbon and deposition of a resulting polymer of the fluorohydrocarbon, such that the resulting polymer of the compound of formula (I) and the resulting polymer of the fluorohydrocarbon create discrete layers of the conformal coating; wherein the compound of formula (I) is an organic compound.

First claim

What is claimed is:

1. A method for conformally coating an electrical assembly, the method comprising:
plasma polymerization of a first compound of formula (1) and deposition of a resulting polymer of the first compound of formula (I) onto at least one surface of an electrical assembly, the electrical assembly comprising a substrate, a substrate surface, at least one conductive track, at least one electrical component, and a bond connection between the at least one conductive track and the at least one electrical component, and
plasma polymerization of a first fluorocarbon and deposition of the resulting polymer of the first fluorocarbon onto the resulting polymer of the first compound of formula (1);

wherein:
R1 represents C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R2 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R3 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R4 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R5 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and
R6 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and
wherein the resulting polymer comprising of the first compound of formula (I) has a thickness from 250 nanometers to 300 nanometers and the resulting polymer comprising of the first fluorocarbon has a thickness from 25 nanometers to 50 nanometers, wherein the polymer of the first compound of formula (I) comprises crosslinked structure and retains reactive sites, and wherein the resulting polymer is deposited onto the substrate surface, the at least one conductive track, the at least one electrical component, and the bond connection,
wherein the resulting polymer is deposited onto a top side of the electrical component and further deposited on an underside of the electrical component opposite to the top side; and
wherein the resulting polymer is deposited on the substrate below the electrical component.

2. The method of claim 1 , further comprising:
plasma polymerization of a second compound of formula (I) and deposition of a resulting polymer of the second compound of formula (1) onto the resulting polymer of the first fluorocarbon; and
plasma polymerization of a second fluorocarbon and deposition of a resulting polymer of the second fluorocarbon onto the resulting polymer of the second compound of formula (I).

3. The method of claim 1 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene.

4. The method of claim 1 , wherein the first fluorocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 .

5. The method of claim 1 , wherein the first compound of formula (I) comprises 1,4-dimethylbenzene and the first fluorocarbon comprises C 3 F 6 .

6. A method for conformally coating an electrical assembly, the method comprising:
plasma polymerization of a first fluorocarbon and deposition of a resulting polymer of the first fluorocarbon onto at least one surface of the
electrical assembly, the electrical assembly comprising a substrate, a substrate surface, at least one conductive track, at least one electrical component, and a bond connection between the at least one conductive track and the at least one electrical component, and
plasma polymerization of a first compound of formula (1) and deposition of a resulting polymer of the first compound of formula (J) onto the resulting polymer of the first fluorocarbon;

wherein:
R1 represents C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R2 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R3 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R4 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl;
R5 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and
R6 represents hydrogen, C 1 -C 3 alkyl or C 2 -C 3 alkenyl; and
wherein the resulting polymer consisting essentially of the first compound of formula (1) has a thickness from 250 nanometers to 300 nanometers and the resulting polymer consisting essentially of the first fluorohydrocarbon has a thickness from 25 nanometers to 50 nanometers, wherein the polymer of the first compound of formula (I) comprises crosslinked structure and retains reactive sites and wherein the resulting polymer is deposited onto the substrate surface the at least one conductive track, the at least one electrical component, and the bond connection, and
wherein the resulting polymer is deposited onto a top side of the electrical component and further deposited on an underside of the electrical component opposite to the top side; and
wherein the resulting polymer is deposited on the substrate below the electrical component.

7. The method of claim 6 , further comprising plasma polymerization of a second fluorocarbon and deposition of a resulting polymer of the second fluorocarbon onto the resulting polymer of the first compound of formula (I).

8. The method of claim 6 , wherein the first compound of formula (I) is selected from the group consisting of 1,4-dimethylbenzene, 1,3-dimethylbenzene, 1,2-dimethylbenzene, toluene, 4-methyl styrene, 3-methyl styrene, 2-methyl styrene, 1,4-divinyl benzene, 1,3-divinyl benzene, and 1,2-divinyl benzene.

9. The method of claim 6 , wherein the first fluorocarbon is selected from the group consisting of CF 4 , C 2 F 4 , C 2 F 6 , C 3 F 6 , C 3 F 8 , and C 4 F 8 .

10. The method of claim 6 , wherein the first compound of formula (I) comprises 1,4-dimethylbenzene and the first fluorocarbon comprises C 3 F 6 .

Assignees

• Hzo Inc

Inventors

• Brooks Andrew Simon Hall
• Von Werne Timothy Allan

Classifications

• B05D1/62

  Plasma-deposition of organic layers (plasma deposition in general C23C14/00, C23C16/00) · CPC title

• H05K2203/095

  Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes · CPC title

• H05K2201/09872

  Insulating conformal coating · CPC title

• Y10T428/31544

  Addition polymer is perhalogenated · CPC title

• Y10T428/31504

  Composite [nonstructural laminate] · CPC title