Apparatus and power module

Patent metadata

Field	Value
Publication number	US-12217899-B2
Application number	US-202318389120-A
Country	US
Kind code	B2
Filing date	Nov 13, 2023
Priority date	Oct 9, 2018
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

A power system includes a power module, an electronic load and a system board. The power module includes a first surface, a second surface, a switch and a plurality of conductive parts, wherein the switch is disposed on the first surface of the power module and the plurality of conductive parts are disposed on the second surface of the power module. The electronic load includes a plurality of conductive parts. The power module and the electronic load are disposed on two opposite sides of the system board, the power module delivers power to the electronic load through the system board, and gaps and networks of the plurality of conductive parts of the power module correspond to those of the plurality of conductive parts of the electronic load.

First claim

What is claimed is:

1. An apparatus, comprising:
a first circuit board assembly, comprising a first printed circuit board and at least one power circuit, wherein the first printed circuit board has a first surface and a second surface opposite to each other, and the at least one switch circuit is disposed on the first printed circuit board;
a magnetic core assembly, being adjacent to the first printed circuit board, and comprising a magnetic core portion and at least one first electrical conductor, wherein the at least one first electrical conductor is penetrated through the magnetic core portion; and
a second electrical conductor, at least one third electrical conductor and a signal communication part conductor, being around the magnetic core portion together.

2. The apparatus according to claim 1 , further comprising:
a second circuit board assembly comprising a second printed circuit board, the second printed circuit board having a first surface and a second surface opposite to each other;
wherein the second electrical conductor, the at least one third electrical conductor, the signal communication part conductor and the magnetic core assembly are located between the first circuit board assembly and the second circuit board assembly.

3. The apparatus according to claim 2 , wherein the second circuit board assembly further comprises a plurality of pads and a plurality of conductive parts, the plurality of pads are disposed on the second surface of the second printed circuit board to form a first pattern, the plurality of conductive parts are disposed on the first surface of the second printed circuit board to form a second pattern, and the plurality of pads are electrically connected with the plurality of conductive parts through the second printed circuit board.

4. The apparatus according to claim 3 , wherein the first pattern is different from the second pattern.

5. The apparatus according to claim 2 , wherein the apparatus is used to provide power to an electronic device through a system board, and the apparatus and the electronic device are located at opposite sides of the system board.

6. The apparatus according to claim 5 , wherein the second circuit board assembly further comprises at least one output capacitor disposed on the second surface of the second printed circuit board or embedded within the second printed circuit board, wherein a vertical projection of the at least one output capacitor on the system board at least partially overlaps with a vertical projection of the electronic device on the system board.

7. The apparatus according to claim 1 , wherein the magnetic core assembly is an inductor.

8. The apparatus according to claim 1 , wherein the apparatus further comprises at least one input capacitor, wherein the input capacitor is disposed on the first surface of the first printed circuit board.

9. A power module, comprising:
a magnetic core assembly, comprising a magnetic core portion and at least one first electrical conductor; and
a second electrical conductor, at least one third electrical conductor and a signal communication part conductor, being around the magnetic core together, each of the at least one first electrical conductor, the second electrical conductor, the at least one third electrical conductor and the signal communication part conductor has a first terminal and a second terminal, the first terminals of the at least one first electrical conductor, the second electrical conductor, the at least one third electrical conductor and the signal communication part conductor forming a first surface of the power module together, the second terminals of the at least one first electrical conductor, the second electrical conductor, the at least one third electrical conductor and the signal communication part conductor forming a second surface of the power module together, wherein the first surface and the second surface is used for soldering.

10. The power module according to claim 9 , wherein the power module is a self-contained unit.

11. The power module according to claim 9 , wherein the power module is soldered to a first printed circuit board through the first surface of the power module to realize electrical connection between the power module and the first printed circuit board, and the power module is soldered to a second printed circuit board through the second surface of the power module to realize electrical connection between the power module and the second printed circuit board.

12. The power module according to claim 11 , wherein each of the second electrical conductor and the at least one third electrical conductors comprises a bump, the second printed circuit board comprises a second soldering pad and at least one third soldering pad, the bump of the second electrical conductor is used as the second terminal of the second electrical conductor and the bump of the at least one third electrical conductor is used as the second terminal of the at least one third electrical conductor, the bump of the second electrical conductor is soldered on the second soldering pad and the bump of the at least one third conductor is soldered on the corresponding third soldering pad so as to form a plurality of receiving spaces between the bumps.

Assignees

• Delta Electronics Inc

Inventors

• Xiong Yahong
• Jin Da
• Su qinghua

Classifications

• H10W90/00

  Package configurations · CPC title

• H05K2201/10984

  Component carrying a connection agent, e.g. solder, adhesive · CPC title

• H05K2201/10734

  Ball grid array [BGA]; Bump grid array · CPC title

• H05K2201/10053

  Switch · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title