Phenol compound, conductive paste composition, method for producing conductive paste composition, conductive wire, and method for producing conductive wire

Patent metadata

Field	Value
Publication number	US-12215243-B2
Application number	US-202118029934-A
Country	US
Kind code	B2
Filing date	Oct 14, 2021
Priority date	Nov 20, 2020
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

The present invention is a phenol compound represented by the following general formula (1A). This phenol compound makes it possible to provide a phenol compound as an additive for a conductive paste composition having a small decrease in electric conductivity in repetitive elongations and shrinkages and excellent printing processability, a conductive paste composition containing the additive, and a conductive wire made by using the conductive paste composition.

First claim

The invention claimed is:

1. A conductive paste composition, comprising (A) a conductive filler, (B) a phenol compound, (C) an elastomer resin, and (D) a solvent,
wherein the phenol compound as the component (B) is represented by the following general formula (1B),

wherein Az′ represents a linear, branched, or cyclic (ka+2)-valent hydrocarbon group or fluorinated hydrocarbon group having 1 to 19 carbon atoms, and —CH 2 — constituting the (ka+2)-valent hydrocarbon group is optionally substituted with —O—, —C(═O)— or —Si(R 2 R 3 )—; “ka” represents 0 or 1, “kb”, “kc”, “kd”, and “ke” each represent 1 or 2; R 1 represents a hydrogen atom, a halogen atom, a cyano group, or a hydroxyl group; and each of R 2 and R 3 is a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms, or a phenyl group.

2. The conductive paste composition according to claim 1 , wherein the elastomer resin as the component (C) is polyurethane.

3. The conductive paste composition according to claim 2 , wherein the elastomer resin as the component (C) is a polyurethane comprising a structure represented by the following general formulae (1a) to (1c),

wherein R represents a hydrogen atom, a fluorine atom, or a linear, branched, or cyclic hydrocarbon group having 1 to 10 carbon atoms optionally substituted with a fluorine atom; R f represents a fluorine atom, or a linear, branched, or cyclic fluorinated hydrocarbon group having 1 to 10 carbon atoms; “n” is an integer of 1 or 2; and a dashed line represents a bonding arm.

4. The conductive paste composition according to claim 3 , wherein the elastomer resin as the component (C) is a polyurethane comprising a structure represented by the following general formulae (2a) to (2c),

wherein R 4 is a hydrogen atom or a monovalent hydrocarbon group having 1 to 3 carbon atoms; A a represents a single bond, or a linear, branched, or cyclic divalent hydrocarbon group having 1 to 20 carbon atoms; and —CH 2 — constituting A a is optionally substituted with —O—, —C(═O)—, —C(═O)O— or —C 6 H 4 —, or —NR 8 —C(═O)—; R 8 is a hydrogen atom, or a linear or branched alkyl group having 1 to 4 carbon atoms; A b represents —O—, —NR 8 —, or —C(═O)O—; A c represents —O—, —NR 8 —, —C(═O)O—, or —NR 8 —C(═O)—; each of n 1 , n 2 , and n 4 is an integer of 0 to 10; n 3 is an integer of 0 or 1; and a dashed line represents a bonding arm.

5. A method for producing the conductive paste composition according to claim 4 , wherein the elastomer resin as the component (C) is produced using an alcohol represented by the following general formulae (3a) to (3c) as a chain extender,

wherein R 4 , A a , n 1 , n 2 and n 4 are as defined above.

6. The conductive paste composition according to claim 1 , wherein the conductive filler as the component (A) is contained in a proportion exceeding 70 parts by mass relative to 100 parts by mass of a total of the components (A) and (C).

7. The conductive paste composition according to claim 1 , wherein the conductive filler as the component (A) is selected from the group consisting of gold, silver, silver chloride, platinum, copper, tin, iron, titanium, nickel, palladium, aluminum, tungsten, molybdenum, ruthenium, chromium, indium, solder, carbon, and composites thereof.

8. The conductive paste composition according to claim 1 , wherein the conductive filler as the component (A) is a silver powder having an average particle size of 5 nm to 10 μm.

9. A conductive wire formed on a substrate, the conductive wire comprising a baked product of the conductive paste composition according to claim 1 .

10. The conductive wire according to claim 9 , wherein the substrate is stretchable.

11. The conductive wire according to claim 9 , wherein the substrate is a thermoplastic polyurethane.

12. The conductive wire according to claim 9 , wherein a change in electric resistance upon 20% elongation is 500% or less.

13. The conductive wire according to claim 9 , wherein a maximum electric resistance when the conductive wire is elongated and shrunk repeatedly 1000 times with an elongation ratio of 20% is 5000% or less of an electric resistance before the elongations and the shrinkages.

14. A method for producing a conductive wire by using the conductive paste composition according to claim 1 to form a conductive wire on a substrate, wherein the conductive wire is formed with a baking temperature of 60° C. to 160° C.

15. A method for producing a conductive wire, comprising printing the conductive paste composition according to claim 1 , followed by heating to form a conductive wire on a substrate.

Assignees

• Shinetsu Chemical Co

Inventors

• Hasegawa Koji
• Nonaka Shiori
• Watanabe Osamu

Classifications

• C08K2201/005

  Additives being defined by their particle size in general · CPC title

• C08K2201/002

  Physical properties · CPC title

• C08K2201/001

  Conductive additives · CPC title

• C07C2603/74

  Adamantanes · CPC title

• C07C2601/14

  The ring being saturated · CPC title