Method for transferring a layer to a substrate

Patent metadata

Field	Value
Publication number	US-12214580-B2
Application number	US-202217834413-A
Country	US
Kind code	B2
Filing date	Jun 7, 2022
Priority date	Jun 9, 2021
Publication date	Feb 4, 2025
Grant date	Feb 4, 2025

Abstract

The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.

First claim

What is claimed is:

1. A method comprising:
providing a stack by:
forming a first transfer layer over a first substrate;
forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble; and
forming a target layer in contact with the second transfer layer such that the target layer forms a top surface of the stack;

bonding the top surface of the stack to a second substrate;
separating the first transfer layer from the second transfer layer; and
removing the second transfer layer from the target layer such that the target layer remains on the second substrate.

2. The method of claim 1 , wherein removing the second transfer layer comprises dissolving the second transfer layer.

3. The method of claim 2 , wherein dissolving the second transfer layer comprises dissolving the second transfer layer in water.

4. The method according to claim 3 , wherein dissolving the second transfer layer comprises dissolving the second transfer layer at room temperature.

5. The method according to claim 1 , wherein the target layer comprises an elastomer layer.

6. The method according to claim 5 , wherein the elastomer layer has a Young's modulus equal to or less than 500 MPa at room temperature.

7. The method according to claim 5 , wherein the target layer further comprises a conductive layer.

8. The method according to claim 7 , wherein forming the target layer comprises forming the conductive layer and then forming the elastomer layer.

9. The method according to claim 7 , wherein the conductive layer is a thin film metal layer.

10. The method according to claim 7 , wherein the conductive layer is an inorganic layer.

11. The method according to claim 1 , wherein the second substrate comprises a glass supporting substrate.

12. The method according to claim 1 , wherein the second substrate comprises an elastomer layer.

13. The method of claim 12 , wherein the elastomer layer comprises a channel configured for microfluidic flow.

14. The method according to claim 1 , wherein the first substrate is transparent.

15. The method of claim 1 , wherein the first transfer layer is an optically sensitive layer.

16. The method of claim 1 , wherein separating the first transfer layer from the second transfer layer comprises separating the first transfer layer from the second transfer layer by exposure to a laser source.

17. The method of claim 1 , wherein the second transfer layer comprises a polyvinyl alcohol.

18. The method of claim 1 , wherein separating the first transfer layer from the second transfer layer comprises using heat to remove the first transfer layer.

19. A method comprising:
providing a first stack by:
forming a first transfer layer over a first substrate;
forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble; and
forming a target layer on the second transfer layer such that the target layer forms a first top surface of the first stack;

bonding the first top surface of the first stack to a second top surface of a second substrate stack that comprises a support structure, a patterned elastomer layer forming the second top surface, and a patterned thin film layer between the support structure and the patterned elastomer layer, wherein the patterned thin film layer comprises electronic circuitry configured for controlling a microfluidic device;
separating the first transfer layer from the second transfer layer; and
removing the second transfer layer from the target layer such that the target layer remains on the second substrate stack.

20. The method of claim 19 , wherein the electronic circuitry is configured for controlling fluid flow through the target layer or through the patterned elastomer layer.

Assignees

• Imec Vzw
• Univ Leuven Kath

Inventors

• Liang Boshen
• Wysocka Dominika
• Cheyns David

Classifications

• B81C2203/0785

  Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates · CPC title

• B81C1/00238

  Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure · CPC title

• B32B2037/243

  Coating · CPC title

• B32B37/24

  with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate (B32B37/15 takes precedence) · CPC title

• B32B43/006 Primary

  Delaminating · CPC title