Applicator system containing a microneedle array which comprises an active ingredient for wound healing

US12214149B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12214149-B2
Application numberUS-201816634592-A
CountryUS
Kind codeB2
Filing dateAug 4, 2018
Priority dateAug 4, 2017
Publication dateFeb 4, 2025
Grant dateFeb 4, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention relates to an applicator system comprising a microneedle array and to the use thereof for the intradermal delivery of active ingredients, and in particular of medicinal drugs, wherein this microneedle array is suitable for penetrating the skin of humans or animals and includes at least one active ingredient for wound healing.

First claim

Opening claim text (preview).

The invention claimed is: 1. An applicator system comprising a microneedle array for use for the intradermal delivery of a first active ingredient, the applicator system comprising: a plurality of microneedles on a carrier, wherein the microneedles are made of a polymer matrix in which at least one second active ingredient for wound healing is integrated or incorporated; a trigger mechanism; and at least one reservoir for storing the first active ingredient, the reservoir being in connection to the microneedles; and wherein the first active ingredient is different from the at least one second active ingredient for wound healing, and the first active ingredient is a medicinal drug; wherein the at least one second active ingredient for wound healing is selected from the group consisting of dexpanthenol, collagen, hyaluronic acid, and combinations thereof; and wherein the polymer of the polymer matrix is selected from the group consisting of polylactides, polyglycolides, polylactide-co-glycolides, polyanhydrides, poly(ortho)esters, polyurethanes, polybutyric acids, polyvaleric acids, polylactide-co-caprolactones, polycarbonates, polyesters, polyvinyl chloride, polyacrylamides, cycloolefin (co)polymers, polymethacrylates, and thermoplastics. 2. The applicator system according to claim 1 , wherein the microneedle array is planar. 3. The applicator system according to claim 1 , wherein the density of the microneedles on a carrier is 5 to 5,000 pieces/cm 2 . 4. The applicator system according to claim 1 , wherein the at least one second active ingredient for wound healing is integrated or incorporated in the polymer matrix in an amount of 150 to 200 mg/cm 2 . 5. The applicator system according to claim 1 , wherein the microneedle array comprises fixation means. 6. The applicator system according to claim 1 , wherein the microneedle array comprises fixation means which is selected from the group consisting of adhesive strip, patch, band, elastic band, rubber and strap. 7. The applicator system according to claim 1 , wherein the first active ingredient is stored in the reservoir. 8. The applicator system according to claim 1 , wherein the reservoir is a flexible bag or a balloon. 9. The applicator system according to claim 1 , wherein the carrier is flexible and planar and the plurality of microneedles are integrated into the flexible planar carrier. 10. The applicator system according to claim 9 , wherein the applicator system comprises at least one reservoir containing the first active ingredient. 11. An applicator system comprising a microneedle array for the intradermal delivery of a first active ingredient, the applicator system comprising: a plurality of microneedles on a carrier, wherein the microneedles are made of a polymer matrix in which at least one second active ingredient for wound healing is integrated or incorporated; a trigger mechanism; and at least one reservoir in connection with the microneedles; and wherein the at least one reservoir contains the first active ingredient; wherein the first active ingredient is different from the at least one second active ingredient for wound healing, and the first active ingredient is a medicinal drug; wherein the at least one second active ingredient for wound healing is selected from the group consisting of dexpanthenol, collagen, hyaluronic acid, and combinations thereof; and wherein the polymer of the polymer matrix is selected from the group consisting of polylactides, polyglycolides, polylactide-co-glycolides, polyanhydrides, poly(ortho)esters, polyurethanes, polybutyric acids, polyvaleric acids, polylactide-co-caprolactones, polycarbonates, polyesters, polyvinyl chloride, polyacrylamides, cycloolefin (co)polymers, polymethacrylates, and thermoplastics. 12. The applicator system according to claim 11 , wherein the reservoir is a flexible bag or a balloon.

Assignees

Inventors

Classifications

  • Drug applicators using microneedles · CPC title

  • Connective tissue peptides, e.g. collagen, elastin, laminin, fibronectin, vitronectin, cold insoluble globulin [CIG] · CPC title

  • Aloeaceae (Aloe family), e.g. aloe vera · CPC title

  • Oleaceae (Olive family), e.g. jasmine, lilac or ash tree · CPC title

  • Hyaluronic acid · CPC title

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What does patent US12214149B2 cover?
The invention relates to an applicator system comprising a microneedle array and to the use thereof for the intradermal delivery of active ingredients, and in particular of medicinal drugs, wherein this microneedle array is suitable for penetrating the skin of humans or animals and includes at least one active ingredient for wound healing.
Who is the assignee on this patent?
Lts Lohmann Therapie Systeme Ag
What technology area does this patent fall under?
Primary CPC classification A61M37/0015. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Feb 04 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).