Wireless headset

US12212943B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12212943-B2
Application numberUS-202017638361-A
CountryUS
Kind codeB2
Filing dateJul 16, 2020
Priority dateAug 26, 2019
Publication dateJan 28, 2025
Grant dateJan 28, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode. A plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. In the foregoing technical solutions, wind noise can be reduced, and call experience can be improved.

First claim

Opening claim text (preview).

What is claimed is: 1. A wireless headset, comprising: a headset housing; and a headset assembly accommodated in the headset housing, wherein the headset assembly comprises a microphone; wherein the headset housing comprises a bottom housing, the bottom housing comprises a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode; and wherein a plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. 2. The wireless headset according to claim 1 , wherein the plurality of sound inlet holes are evenly disposed on the bottom housing. 3. The wireless headset according to claim 1 , wherein the plurality of sound inlet holes are disposed on the insulating material. 4. The wireless headset according to claim 1 , wherein the plurality of sound inlet holes comprise two sound inlet holes, and axes of the two sound inlet holes overlap. 5. The wireless headset according to claim 1 , wherein a cross section of the microphone sound inlet channel is in at least one shape from the group consisting of: a circle, an oval, a polygon, and a wave shape. 6. The wireless headset according to claim 1 , wherein the microphone sound inlet channels comprise a first sound inlet channel and a second sound inlet channel that communicate with each other, and the first sound inlet channel and the second sound inlet channel communicate with the microphone through a common sound inlet channel. 7. The wireless headset according to claim 1 , wherein an outer wall of the bottom housing is arc-shaped. 8. The wireless headset according to claim 1 , wherein the headset assembly further comprises a flexible printed circuit and a battery electrically connected to the flexible printed circuit, and the first bottom housing part and the second bottom housing part each are electrically connected to the flexible printed circuit. 9. The wireless headset according to claim 8 , wherein a first bending part is disposed on an end of the flexible printed circuit close to the bottom housing, and the microphone is disposed on the first bending part, and is electrically connected to the flexible printed circuit. 10. The wireless headset according to claim 8 , wherein a second bending part is disposed on an in-ear end of the flexible printed circuit in the headset housing, and a speaker is disposed on the second bending part. 11. A wireless headset, comprising: a headset housing; and a headset assembly accommodated in the headset housing; wherein the headset assembly comprises a microphone; wherein the headset housing comprises a bottom housing, the bottom housing is one of a positive charging electrode and a negative charging electrode, and the other of the positive charging electrode and the negative charging electrode is separated from the bottom housing; and wherein a plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. 12. The wireless headset according to claim 11 , wherein the headset housing comprises a front housing, a rear housing, and a headset handle, the front housing is connected to the rear housing, the rear housing extends downward to form the headset handle, the bottom housing is located at an end of the headset handle, and the other of the positive charging electrode and the negative charging electrode is disposed on the rear housing. 13. The wireless headset according to claim 11 , wherein the plurality of sound inlet holes are evenly disposed on the bottom housing. 14. The wireless headset according to claim 11 , wherein the plurality of sound inlet holes comprise two sound inlet holes, and axes of the two sound inlet holes overlap. 15. The wireless headset according to claim 11 , wherein a cross section of the microphone sound inlet channel is in at least one shape from the group consisting of: a circle, an oval, a polygon, and a wave shape. 16. The wireless headset according to claim 11 , wherein the microphone sound inlet channels comprise a first sound inlet channel and a second sound inlet channel that communicate with each other, and the first sound inlet channel and the second sound inlet channel communicate with the microphone through a common sound inlet channel. 17. The wireless headset according to claim 11 , wherein an outer wall of the bottom housing is arc-shaped. 18. The wireless headset according to claim 11 , wherein the headset assembly further comprises a flexible printed circuit and a battery electrically connected to the flexible printed circuit, one end of the flexible printed circuit is electrically connected to the bottom housing, and the other end of the flexible printed circuit is electrically connected to the other of the positive charging electrode and the negative charging electrode. 19. The wireless headset according to claim 18 , wherein a first bending part is disposed on an end of the flexible printed circuit close to the bottom housing, and the microphone is disposed on the first bending part, and is electrically connected to the flexible printed circuit. 20. The wireless headset according to claim 18 , wherein a second bending part is disposed on an in-ear end of the flexible printed circuit in the headset housing, and a speaker is disposed on the second bending part.

Assignees

Inventors

Classifications

  • Mechanical or electrical reduction of wind noise generated by wind passing a microphone · CPC title

  • Applications of wireless loudspeakers or wireless microphones · CPC title

  • Monophonic and stereophonic headphones with microphone for two-way hands free communication · CPC title

  • H04R1/1075Primary

    Mountings of transducers in earphones or headphones · CPC title

  • Accumulators specially adapted for earpieces; Arrangements specially adapted for charging thereof · CPC title

Patent family

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Frequently asked questions

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What does patent US12212943B2 cover?
This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are sep…
Who is the assignee on this patent?
Huawei Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification H04R1/1075. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 28 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).