Sensor module

Patent metadata

Field	Value
Publication number	US-12212825-B2
Application number	US-202117799231-A
Country	US
Kind code	B2
Filing date	Feb 10, 2021
Priority date	Feb 19, 2020
Publication date	Jan 28, 2025
Grant date	Jan 28, 2025

Abstract

A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.

First claim

The invention claimed is:

1. A sensor module, comprising:
a housing;
a sensor board that includes a sensor element and is arranged in the housing;
an external connector that is provided to the housing;
a flexible printed circuit that electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line; and
a metallic shield case that includes a bottom portion and a peripheral surface portion, the bottom portion being arranged between the flexible printed circuit and the external connector, the peripheral surface portion covering around the sensor board,
the external connector including a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case,
the bottom portion including a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.

2. The sensor module according to claim 1 , wherein
the flexible printed circuit further includes a base-material end that supports the signal line and the ground line and is arranged in the bottom portion,
the base-material end includes an opening through which the third connection pin passes, the opening having a larger opening area than the third hole, and
the thermal storage is provided to a region that faces the opening.

3. The sensor module according to claim 2 , wherein
the thermal storage includes a plurality of slits annularly formed around the third hole.

4. The sensor module according to claim 2 , wherein
the thermal storage includes a concave portion that is annularly formed around the third hole.

5. The sensor module according to claim 2 , wherein
the thermal storage includes a heat transfer portion that is more highly thermally conductive than a metallic material of the bottom portion.

6. The sensor module according to claim 2 , wherein
the third connection pin is arranged offset from a center of the opening.

7. The sensor module according to claim 2 , wherein
the opening is formed into a circular shape or an elliptic shape.

8. The sensor module according to claim 1 , wherein
the third connection pin includes a plurality of connection pins, and
the opening includes a plurality of openings respectively provided correspondingly to connection pins of the plurality of connection pins.

9. The sensor module according to claim 8 , wherein
the connection pins of the plurality of connection pins are provided symmetrically with respect to the first connection pin.

10. The sensor module according to claim 1 , wherein
the sensor element is a solid-state imaging device.

11. The sensor module according to claim 1 , wherein
the sensor module is attachable to a vehicle.

Assignees

• Sony Semiconductor Solutions Corp

Inventors

• Owaki Hirofumi
• Agawa Tomonori
• Togano Kunihiko
• Suzuki Hiroo

Classifications

• H05K9/0007

  Casings (standardised racks H05K9/0062) · CPC title

• H04N23/40

  Circuit details for pick-up tubes · CPC title

• H04N23/57

  Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices · CPC title

• H04N23/52

  Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements · CPC title

• H04N23/51 Primary

  Housings · CPC title