Methods for producing nanoscale patterns, nano-fluidic devices, and nanogap electrochemical devices

Patent metadata

Field	Value
Publication number	US-12209016-B2
Application number	US-202017640890-A
Country	US
Kind code	B2
Filing date	Sep 9, 2020
Priority date	Sep 10, 2019
Publication date	Jan 28, 2025
Grant date	Jan 28, 2025

Abstract

A method for manufacturing a soft stamp includes providing a substrate having a first electrode and a second electrode, the second electrode being formed at a distance less than 100 nm from the first electrode so that a nanogap Ng is formed between the first and second electrodes; pouring a curable substance over the first and second electrodes and into the nanogap Ng; curing the curable substance to form a soft stamp; and removing the soft stamp from the first and second electrodes. The soft stamp has a nano-feature having a size less than 100 nm.

First claim

What is claimed is:

1. A method for manufacturing a soft stamp, the method comprising:
providing a substrate having a first electrode and a second electrode, the second electrode being formed at a distance less than 100 nm from the first electrode so that a nanogap Ng is formed between the first and second electrodes;
pouring a curable substance over the first and second electrodes and into the nanogap Ng;
curing the curable substance to form a soft stamp; and
removing the soft stamp from the first and second electrodes,
wherein the soft stamp has a nano-feature having a size less than 100 nm.

2. The method of claim 1 , wherein the soft stamp has a base from which extends the nano-feature.

3. The method of claim 1 , wherein the nano-feature has a height less than 50 nm.

4. The method of claim 1 , wherein the first and second electrodes are made of different materials.

5. The method of claim 1 , wherein the step of providing comprises:
patterning a first metallic layer (M 1 ) to form the first electrode on the substrate;
depositing a self-assembling monolayer, SAM, layer over and around the first electrode;
forming a second metallic layer (M 2 ) in contact with the SAM layer and the substrate; and
touchless removing parts of the second metallic layer (M 2 ) that are formed directly above the SAM layer and the first electrode, to form the second electrode, and the nanogap Ng between the first electrode and the second electrode.

6. The method of claim 5 , further comprising:
placing the substrate, the first electrode, the SAM layer, and the second metallic layer in a liquid and agitating either the substrate or the liquid.

7. The method of claim 5 , further comprising:
directing a fluid flow over the second metallic layer.

8. The method of claim 1 , wherein the step of curing comprises:
irradiating the curable substance with ultra-violet light.

9. A method for making a mask, the method comprising:
providing a substrate having a first electrode and a second electrode, the second electrode being formed at a distance less than 100 nm from the first electrode so that a nanogap Ng is formed between the first and second electrodes;
pouring a curable substance over the first and second electrodes and into the nanogap Ng;
curing the curable substance to form a soft stamp having nano-features;
removing the soft stamp from the first and second electrodes; and
forming a mask that mirrors the soft stamp, based on the soft mask,
wherein the mask is used for manufacturing a device.

10. The method of claim 9 , wherein the nano-feature has a size less than 100 nm.

11. The method of claim 9 , wherein the soft stamp has a base from which the nano-feature extends away.

12. The method of claim 9 , wherein the nano-feature has a height less than 50 nm.

13. The method of claim 9 , wherein the step of curing comprises:
irradiating the curable substance with ultra-violet light.

14. The method of claim 9 , wherein the step of forming a mask comprises:
dipping the soft stamp in ink; and
transferring traces of the ink onto an additional substrate.

15. The method of claim 9 , wherein the step of forming a mask comprises:
dipping the nano-feature of the soft stamp into a deformable polymer;
curing the polymer to form the mask; and
removing the soft stamp.

16. The method of claim 9 , wherein the step of forming a mask comprises:
placing the soft stamp over a photo-curable layer;
irradiating the photo-curable layer through the soft stamp with a light to cure portions of the photo-curable layer; and
removing the soft stamp.

17. The method of claim 9 , wherein the step of forming a mask comprises:
dipping the nano-feature of the soft stamp into an epoxy substrate;
curing the epoxy substrate to form a gap that corresponds to the nano-feature;
removing a layer of the soft stamp; and
removing a layer of the epoxy substrate to form the mask.

18. A method for manufacturing a soft stamp to be used in the manufacturing of a device, the method comprising:
providing a substrate having a first electrode and a second electrode, the second electrode being formed at a distance less than 100 nm from the first electrode so that a nanogap Ng is formed between the first and second electrodes;
depositing an anti-sticking layer over the first and second electrodes and the substrate;
pouring a curable substance over the first and second electrodes and into the nanogap Ng;
pressing the curable substance with a movable substrate, toward the substrate;
curing the curable substance to form a soft stamp; and
removing the soft stamp from the first and second electrodes, with the movable substrate.

Assignees

• Univ King Abdullah Sci & Tech

Inventors

• Anthopoulos Thomas D
• Loganathan Kalaivanan
• Buttner Ulrich
• Yengel Emre
• Faber Hendrik Andreas

Classifications

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• B29C2033/426

  Stampers · CPC title

• B29C33/424 Primary

  Moulding surfaces provided with means for marking or patterning (for injection moulding B29C45/372) · CPC title

• B29C33/3842

  Manufacturing moulds, e.g. shaping the mould surface by machining · CPC title

• B01L2300/0645

  Electrodes · CPC title