Cutting apparatus

US12208482B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12208482-B2
Application numberUS-202217653375-A
CountryUS
Kind codeB2
Filing dateMar 3, 2022
Priority dateMar 23, 2021
Publication dateJan 28, 2025
Grant dateJan 28, 2025

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cutting apparatus includes a chuck table configured to hold the workpiece, and a cutting unit fitted with a cutting blade including an annular base and a cutting edge that includes abrasive grains and a binder configured to fix the abrasive grains, and is formed along an outer circumferential edge of the base. The cutting unit includes a spindle, a blade mount fitted to a distal end portion of the spindle, and a fixing nut configured to fix the cutting blade to the blade mount, and the blade mount or the fixing nut is provided with a corrosion layer formed of a material having a higher ionization tendency than a material constituting the binder.

First claim

Opening claim text (preview).

What is claimed is: 1. A cutting apparatus for cutting a workpiece, the cutting apparatus comprising: a chuck table configured to hold the workpiece; and a cutting unit fitted with a cutting blade including an annular base and a cutting edge that includes abrasive grains and a binder configured to fix the abrasive grains, and is formed along an outer circumferential edge of the base, the cutting unit including a spindle, a blade mount fitted to a distal end portion of the spindle, and a fixing nut configured to fix the cutting blade to the blade mount, and the blade mount or the fixing nut being provided with a corrosion layer formed of a material having a higher ionization tendency than a material constituting the binder, wherein the binder and the corrosion layer are formed by a nickel plating layer containing sulfur, and a content rate of sulfur in the corrosion layer is higher than a content rate of sulfur in the binder. 2. The cutting apparatus according to claim 1 , wherein the content rate of sulfur in the corrosion layer is equal to or more than 1.2 times the content rate of sulfur in the binder.

Assignees

Inventors

Classifications

  • Cutting or separating of wafers, substrates or parts of devices · CPC title

  • B24B41/06Primary

    Work supports, e.g. adjustable steadies (B24B37/27 takes precedence) · CPC title

  • by cutting with discs or wheels · CPC title

  • using a tool turning around the workpiece · CPC title

  • B24B27/06Primary

    Grinders for cutting-off · CPC title

Patent family

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Frequently asked questions

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What does patent US12208482B2 cover?
A cutting apparatus includes a chuck table configured to hold the workpiece, and a cutting unit fitted with a cutting blade including an annular base and a cutting edge that includes abrasive grains and a binder configured to fix the abrasive grains, and is formed along an outer circumferential edge of the base. The cutting unit includes a spindle, a blade mount fitted to a distal end portion o…
Who is the assignee on this patent?
Disco Corp
What technology area does this patent fall under?
Primary CPC classification B24B41/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 28 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).