Resin compound and resin composition containing the same

Patent metadata

Field	Value
Publication number	US-12202935-B2
Application number	US-202217590530-A
Country	US
Kind code	B2
Filing date	Feb 1, 2022
Priority date	Dec 3, 2021
Publication date	Jan 21, 2025
Grant date	Jan 21, 2025

Abstract

A resin compound has a structure represented by a chemical formula (I):

In the chemical formula (I), each R 1 independently represents a C 1 -C 20 alkylene group or a C 7 -C 40 alkylarylene group, and R 1 are the same or different from each other; n independently represents an integer of 1-4; each R 2 independently represents a C 1 -C 20 alkyl group or a C 2 -C 20 terminal alkenyl group, and R 2 are the same or different from each other. When at least one of R 1 represents a C 1 -C 20 alkylene group, at least one of R 2 is a C 2 -C 20 terminal alkenyl group.

First claim

What is claimed is:

1. A resin compound having a structure represented by chemical formula (II):

wherein each R 1 independently represents a C 1 -C 20 alkylene group or a C 7 -C 40 alkylarylene group;
each R 2 independently represents a C 1 -C 20 alkyl group or a C 2 -C 20 terminal alkenyl group, and
each R 3 independently represents a single bond or a C 1 -C 18 alkylene group;
m independently represents an integer of 0-3, and
each R 1 , R 2 , and R 3 are the same or different from each other.

2. The resin compound as claimed in claim 1 , wherein each R 1 independently represents a C 1 -C 6 alkylene group or a C 7 -C 10 alkylarylene group, and each R 2 independently represents a C 1 -C 6 alkyl group or a C 2 -C 6 terminal alkenyl group.

3. The resin compound as claimed in claim 1 , wherein each R 2 independently represents a methyl group, an ethyl group, a propyl group, an iso-butyl group, a sec-butyl group, a tert-butyl group, a pentyl group, an iso-amyl group, a hexyl group, an ethenyl group, a 2-propenyl group, or a 1-butenyl group.

4. The resin compound as claimed in claim 1 , wherein the resin compound has a structure represented by chemical formula (II-1):

wherein each R 1 independently represents a C 1 -C 20 alkylene group or a C 7 -C 40 alkylarylene group;
each R 2 independently represents a C 1 -C 20 alkyl group;
each R 3 independently represents a C 1 -C 18 alkylene group, and
each R 1 , R 2 , and R 3 are the same or different from each other.

5. A resin composition, comprising the resin compound as claimed in claim 1 and a crosslinking agent.

6. The resin composition as claimed in claim 5 , wherein the crosslinking agent is selected from a group consisting of a divinylbenzene (DVB), a 4-tert-butoxystyrene (tBOS), a triallyl isocyanurate (TAIC), a triallyl cyanurate (TAC), and a 2,2-bis [3-allyl-4-(4-vinylbenzyl)phenyl]propane (AV-BPA).

7. A resin composition, comprising the resin compound as claimed in claim 2 and a crosslinking agent.

8. A resin composition, comprising the resin compound as claimed in claim 3 and a crosslinking agent.

9. A resin composition, comprising the resin compound as claimed in claim 4 and a crosslinking agent.

Assignees

• Ind Tech Res Inst

Inventors

• Hsu Meei-Yu
• Lin Chih-Hao
• Chen Kai-Chi
• Chen Yi-Chun

Classifications

• C07C2602/26

  the ring system containing ten carbon atoms · CPC title

• C07C13/61

  with a bridged indene ring, e.g. dicyclopentadiene · CPC title

• C08G2261/312

  Non-condensed aromatic systems, e.g. benzene · CPC title

• C08G2261/3325

  derived from other polycyclic systems · CPC title

• C08G2261/344

  containing heteroatoms · CPC title