Liquid-cooled power electronics unit

Patent metadata

Field	Value
Publication number	US-12200916-B2
Application number	US-202218058277-A
Country	US
Kind code	B2
Filing date	Nov 23, 2022
Priority date	Nov 25, 2021
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

A liquid-cooled power electronics unit includes a planar circuit board body having conductor tracks, a wet side with a wet space for carrying a dielectric cooling liquid, and a fluidically, separated dry side, wherein at least two high-voltage power semiconductors are arranged on the circuit board body on the wet side within the wet space, the high-voltage power semiconductors being cooled by the cooling liquid, and an electronic low-voltage circuit is arranged on the dry side of the circuit board body.

First claim

The invention claimed is:

1. A liquid-cooled power electronics unit, comprising:
a planar circuit board body having conductor tracks;
a wet side with a wet space for carrying a dielectric cooling liquid; and
a fluidically separated dry side, wherein at least two high-voltage power semiconductors are arranged on the circuit board body on the wet side within the wet space, the high-voltage power semiconductors being cooled by the cooling liquid,
an electronic low-voltage circuit is arranged on the dry side of the circuit board body, and
the low-voltage circuit and the high-voltage power semiconductors are galvanically separated from each other and a potential-separating signal link is arranged between the low-voltage circuit and the high-voltage power semiconductors.

2. The liquid-cooled power electronics unit as claimed in claim 1 , wherein the circuit board body fluidically separates the wet space and the dry side from each other.

3. The liquid-cooled power electronics unit as claimed in claim 1 , wherein a heat sink is mounted on distal sides of the high-voltage power semiconductors.

4. The liquid-cooled power electronics unit as claimed in claim 1 , wherein the circuit board body comprises plastic and a metal plate is integrated into the plastic of the circuit board body.

5. The liquid-cooled power electronics unit as claimed in claim 1 , wherein a sensor for ascertaining a physical quantity of the cooling liquid is arranged on the wet side of the circuit board body, the sensor being connected to the low-voltage circuit so as to convey information to it.

Assignees

• Porsche Ag
• Fraunhofer Ges Forschung
• Fraunhofer Ges Zur Foerderung Den Angewandten Forschung E V

Inventors

• Barkow Maximilian
• Fuchs Patrick
• Velic Timijan
• Eckardt Bernd
• Hofmann Maximilian
• Rauh Hubert
• Mueller Andre
• Bayer Benjamin
• Sorge Jordan

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• H05K1/0254

  High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection (electrostatic discharge protection for electric apparatus in general H05K9/0067, H05K9/0079); Arrangements for regulating voltages or for using plural voltages · CPC title