Heater system, ceramic heater, plasma treatment device and adsorption device
US-2019139805-A1 · May 9, 2019 · US
Member for semiconductor manufacturing apparatus, method for manufacturing the same, and mold
US12198965B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12198965-B2 |
| Application number | US-202016822579-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 18, 2020 |
| Priority date | Mar 26, 2019 |
| Publication date | Jan 14, 2025 |
| Grant date | Jan 14, 2025 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
A member for a semiconductor manufacturing apparatus includes a ceramic disc incorporating an electrode and a ceramic cylindrical shaft supporting the disc. The disc and the shaft are integrally formed and mutually have no bonding interface. The disc has a surface with which the shaft is integrated. The surface has a region inside the shaft and a region outside the shaft. The region inside the shaft is recessed by one step with respect to the region outside the shaft and has an electrode exposure hole through which the electrode is exposed.
First claim
Opening claim text (preview).
What is claimed is: 1. A member for a semiconductor manufacturing apparatus comprising a ceramic disc incorporating an electrode and a ceramic cylindrical shaft supporting the disc, wherein the disc and the shaft are integrally formed and mutually have no bonding interface, the disc has a surface with which the shaft is integrated, the surface having a region inside the shaft and a region outside the shaft, the region inside the shaft is recessed by one step with respect to the region outside the shaft and has an electrode exposure hole through which the electrode is exposed, the shaft has an inner space including a first space extending from a position at a predetermined height with respect to the region of the disc inside the shaft to the region of the disc inside the shaft, the first space having a frustoconical shape whose diameter increases from the position at the predetermined height toward the region of the disc inside the shaft, and the inner space of the shaft includes a second space extending from the position at the predetermined height to an opening of the shaft, the second space having a frustoconical shape whose diameter increases from the position at the predetermined height toward the opening of the shaft. 2. The member for a semiconductor manufacturing apparatus according to claim 1 , wherein the disc has a gas passage that is open in a side surface of the disc and that extends in a planar direction of the disc, and the shaft has a gas supply path which extends in a longitudinal direction and through which a gas is supplied to the gas passage. 3. The member for a semiconductor manufacturing apparatus according claim 1 , wherein a boundary between an outer surface of the shaft and the surface of the disc with which the shaft is integrated is a round or tapered surface.
Assignees
Inventors
Classifications
Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title
- H10P72/722Primary
Details of electrostatic chucks · CPC title
- H10P72/7624Primary
characterised by the mechanical construction of the susceptor, stage or support · CPC title
characterised by the construction of the shaft · CPC title
characterised by a coating, a hardness or a material · CPC title
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- What does patent US12198965B2 cover?
- A member for a semiconductor manufacturing apparatus includes a ceramic disc incorporating an electrode and a ceramic cylindrical shaft supporting the disc. The disc and the shaft are integrally formed and mutually have no bonding interface. The disc has a surface with which the shaft is integrated. The surface has a region inside the shaft and a region outside the shaft. The region inside the …
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/722. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 14 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).