Heat dissipation device

Patent metadata

Field	Value
Publication number	US-12196497-B2
Application number	US-202117557485-A
Country	US
Kind code	B2
Filing date	Dec 21, 2021
Priority date	Dec 21, 2020
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

First claim

The invention claimed is:

1. A heat dissipation device comprising:
an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source;
at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and
at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device,
wherein the air fin element has a triply periodic surface providing air fins, wherein the triply periodic surface has a scaling gradient along at least one given axis along which a size of elementary cell, of which the triply periodic surface is composed varies, and wherein the scaling of elementary cells is reduced along an air flow direction, and
wherein a scaling of elementary cells is reduced along a direction between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device.

2. The heat dissipation device of claim 1 , wherein the triply periodic surface is a minimal surface.

3. The heat dissipation device of claim 1 , wherein the triply periodic minimal surface is a Schwarz primitive triply periodic minimal surface, a Schwarz diamond triply periodic minimal surface and/or a gyroid triply periodic minimal surface.

4. The heat dissipation device of claim 1 ,
wherein a maximum scaling is provided at an air inlet side and a minimum scaling at an air outlet side.

5. The heat dissipation device of claim 1 , wherein the triply periodic surface of the air fin element and at least one of a condenser chamber wall of the condenser chamber and the side wall of the heat dissipation device are aligned with each other.

6. The heat dissipation device of claim 5 , wherein the triply periodic surface of the air fin element and at least one of the condenser chamber wall and the side wall are aligned such that their intersection area is maximized.

7. The heat dissipation device of claim 1 , wherein the air fin element has at least one reinforced rib being a part of the air fin element having a greater wall thickness than another part of the air fin element.

8. The heat dissipation device of claim 7 , wherein the reinforced rib extends between the condenser chamber and one of the further condenser chambers and the side wall of the heat dissipation device.

9. The heat dissipation device of claim 7 , wherein at least one reinforced rib is provided at an air inlet side and/or at an air outlet side and/or at a top of the air fin element.

10. The heat dissipation device of claim 7 , wherein at least one reinforced rib is provided at a location within the air fin element having a local maximum of von Mises stress simulated with given vapor pressure inside the condenser chamber.

11. The heat dissipation device of claim 1 , wherein the condenser chamber and the further condenser chamber are aligned orthogonally to the evaporator chamber.

12. The heat dissipation device of claim 1 , wherein the heat dissipation device is made by additive manufacturing.

13. A heat dissipation device comprising:
an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source;
at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and
at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device,
wherein the air fin element has a triply periodic surface providing air fins, wherein the triply periodic surface has a scaling gradient along at least one given axis along which a size of elementary cell, of which the triply periodic surface is composed varies, and wherein the scaling of elementary cells is reduced along an air flow direction,
wherein the air fin element has at least one reinforced rib being a part of the air fin element having a greater wall thickness than another part of the air fin element, and
wherein at least one reinforced rib is provided at a location within the air fin element having a local maximum of von Mises stress simulated with given vapor pressure inside the condenser chamber.

Assignees

• Abb Schweiz Ag

Inventors

• Torresin Daniele
• Agostini Bruno
• Petrov Andrey

Classifications

• H10W40/73

  for cooling by change of state · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• F28F2215/00

  Fins · CPC title

• F28F1/12

  the means being only outside the tubular element · CPC title

• F28F2225/06

  for fins · CPC title