Flexible ultrasound transducer

Patent metadata

Field	Value
Publication number	US-12194497-B2
Application number	US-202418589696-A
Country	US
Kind code	B2
Filing date	Feb 28, 2024
Priority date	Mar 14, 2019
Publication date	Jan 14, 2025
Grant date	Jan 14, 2025

Abstract

The present invention provides a flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object. The ultrasound transducer comprises an integrated circuit structure and a multi-layered structure, said multi-layered structure comprising an array of ultrasound transducing elements arranged in a first layer structure and configured for generating ultrasonic energy propagating along a main transducer axis Z and an array of control circuits arranged in a second layer structure, and wherein the array of control circuits and the integrated circuit structure are configured for operating the array of ultrasound transducing elements in said first layer structure, Further, the multi-layered structure comprises at least one flexible layer arranged so that the bending flexibility of the multi-layered structure permits the ultrasound transducer to form a continuous contact with said curved object during operation.

First claim

The invention claimed is:

1. A flexible ultrasound transducer for an ultrasound monitoring system for examining a curved object,
said flexible ultrasound transducer comprising a multi-layered structure,
said multi-layered structure comprising an array of ultrasound transducing elements, an array of control circuits and flexible layers,
said array of ultrasound transducing elements being arranged in a first layer structure of the multi-layered structure and configured for generating ultrasonic energy propagating along a main transducer axis Z,
said array of control circuits being arranged in a second layer structure of the multi-layered structure,
said array of control circuits being configured for operating the array of ultrasound transducing elements arranged in said first layer structure,
said flexible layers being arranged in said multi-layer structure so that the multi-layered structure and the whole ultrasound transducer become flexible, thereby permitting the ultrasound transducer to form a continuous contact with said curved object during operation,
wherein said first layer structure is arranged at a position that is further along in a positive direction of the main transducer axis Z than said second layer structure, which first layer structure and said second layer structure of said multi-layered structure, respectively, constitute a frontplane and a backplane of the flexible ultrasound transducer,
wherein said flexible layers comprise a frontplane flexible layer and a backplane flexible layer, which backplane flexible layer is arranged at a position that is further along in a negative direction of the main transducer axis Z than the second layer structure.

2. The flexible ultrasound transducer according to claim 1 , wherein said flexible ultrasound transducer further comprises an integrated circuit structure.

3. The flexible ultrasound transducer according to claim 2 , wherein said array of control circuits and said integrated circuit structure are configured for operating the array of ultrasound transducing elements arranged in said first layer structure.

4. The flexible ultrasound transducer according to claim 2 , wherein said integrated circuit structure comprises a plurality of Application Specific Integrated Circuits (ASIC), wherein at least one ASIC is configured to support a plurality of individual control circuits.

5. The flexible ultrasound transducer according to claim 4 , wherein said plurality of Application Specific Integrated Circuits (ASIC) is either mounted as discrete elements attached to said backplane flexible layer or is incorporated in one of the layers of the multi-layered structure.

6. The flexible ultrasound transducer ( 1 ) according to claim 1 , wherein each ultrasound transducing element in the array of said first layer structure is connected with an individual control circuit of the array of said second layer structure.

7. The flexible ultrasound transducer according to claim 1 , wherein said array of ultrasound transducing elements comprises an array of piezoelements,
wherein said first layer structure comprises said frontplane flexible layer arranged between said array of piezoelements and a bulk layer,
wherein said bulk layer comprises internal walls so as to define an array of cavities therein, and
wherein an ultrasound transducing element in the array is defined by one of piezoelement of said array of piezoelements, a cavity of said array of cavities and the portion of the frontplane flexible layer that is arranged between the piezoelement and the cavity.

8. The flexible ultrasound transducer according to claim 1 , wherein the array of control circuits comprises an array of thin film transistors (TFT).

9. The flexible ultrasound transducer according to claim 1 , wherein the multi-layered structure further comprises an acoustic backing layer arranged at a position that is further along in the negative direction of the main transducer axis Z than said first layer structure for reducing the acoustic transmission directed away from said curved object during operation.

10. The flexible ultrasound transducer according to claim 9 , wherein the acoustic backing layer is arranged at a position that is further along in the negative direction of the main transducer axis Z than said second layer structure.

11. The flexible ultrasound transducer according to claim 9 , wherein the acoustic backing layer is an acoustic damping layer or an acoustic reflection layer in the form of a Bragg stack, and wherein said Bragg stack comprises multiple layers of alternating high and low acoustic impedance materials.

12. The flexible ultrasound transducer according to claim 1 , further comprising a top flexible layer arranged as an outermost layer at a position that is further along in the positive direction of the main transducer axis Z than the first layer structure.

13. The flexible ultrasound transducer according to claim 1 , wherein the multi-layered structure has a bending flexibility such that the flexible ultrasound transducer is bent with a radius of curvature that is less than 5 cm.

14. A method for producing the flexible ultrasound transducer according to claim 1 , comprising the steps of
a) arranging said backplane of the ultrasound transducer comprising said second layer structure at the position that is further along in the positive direction of the main transducer axis Z than the backplane flexible layer, which backplane flexible layer is temporarily bonded to a first rigid substrate;
b) arranging said frontplane of the ultrasound transducer comprising said first layer structure at a position that is further along in the positive direction of the main transducer axis Z than said backplane of the ultrasound transducer, wherein said backplane and frontplane of the ultrasound transducer are manufactured independently from each other;
c) forming the multi-layered structure of the flexible ultrasound transducer; and
d) removing said first rigid substrate.

15. The method according to claim 14 , wherein the first layer structure is temporarily bonded to a second rigid substrate, and wherein the method further comprises removing said second rigid substrate before forming the multi-layered structure of the flexible ultrasound transducer.

Assignees

• Imec Vzw
• Univ Leuven Kath
• Katbolieke Univ Leuven

Inventors

• Cheyns David
• Jeong Yongbin
• Rottenberg Xavier

Classifications

• B06B2201/76

  Medical, dental · CPC title

• B06B1/0685

  on the back only of piezoelectric elements · CPC title

• B06B1/0207

  Driving circuits (specially adapted for particular applications, see the relevant subclass, e.g. G01; circuits for steering transducer arrays G10K11/34; basic circuits H03) · CPC title

• A61B8/4488

  the transducer being a phased array · CPC title

• B06B1/0629 Primary

  Square array · CPC title