Structure, manufacturing method for structure and system for manufacturing structure

US12193541B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12193541-B2
Application numberUS-201917252457-A
CountryUS
Kind codeB2
Filing dateJun 28, 2019
Priority dateJun 28, 2018
Publication dateJan 14, 2025
Grant dateJan 14, 2025

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A structure in which complexity of the moving path of the nozzle during forming is suppressed even if the structure has regions with different elasticity and a manufacturing method for a structure that can suppress complexity of the moving path of the nozzle when forming the structure with regions with different elasticity. The structure includes a formed body with a linear structure formed of a linear resin. The formed body includes first and second elastic regions, and the linear resin forming the first elastic region is thinner than the linear resin forming the second elastic region.

First claim

Opening claim text (preview).

The invention claimed is: 1. A structure comprising: a base layer; and a covering layer formed at a forming temperature of 238 degrees Celsius, which is a formed body, covering an entire area of an upper surface of the base layer, wherein the covering layer includes a linear structure, the linear structure is formed of a linear portion, and the base layer is made of a shape memory material containing a shape memory polymer, the covering layer is made of an elastomer, the elastomer is softer than the shape memory material at 25 degrees Celsius, a glass-transition temperature Tg of the shape memory polymer is 35 to 100 degrees Celsius, a ratio of an elastic modulus of the shape memory polymer at Tg+20 degrees Celsius to an elastic modulus of the shape memory polymer at Tg-20 degrees Celsius is equal to or larger than 10, the base layer and the covering layer are formed by laminating the linear structure which is formed of a linear resin by two-dimensionally moving a nozzle configured to eject the linear resin, and the linear structure includes a plurality of grooves extending parallel to one another.

Assignees

Inventors

Classifications

  • of foam · CPC title

  • Physical, chemical or physicochemical properties · CPC title

  • characterised by features of a layer {of} foamed material · CPC title

  • multilayered · CPC title

  • for controlling or regulating additive manufacturing processes · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12193541B2 cover?
A structure in which complexity of the moving path of the nozzle during forming is suppressed even if the structure has regions with different elasticity and a manufacturing method for a structure that can suppress complexity of the moving path of the nozzle when forming the structure with regions with different elasticity. The structure includes a formed body with a linear structure formed of …
Who is the assignee on this patent?
Kyoraku Co Ltd
What technology area does this patent fall under?
Primary CPC classification B33Y80/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jan 14 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).