Method of manufacturing an electronic device

Patent metadata

Field	Value
Publication number	US-12193167-B2
Application number	US-202318495763-A
Country	US
Kind code	B2
Filing date	Oct 27, 2023
Priority date	May 25, 2022
Publication date	Jan 7, 2025
Grant date	Jan 7, 2025

Abstract

A method of manufacturing an electronic device including the following steps is provided herein. A plurality of first electronic components is provided. The plurality of first electronic components is transferred onto a plurality of pickup sites. An empty pickup site from the plurality of pickup sites may be figured out, wherein the plurality of first electronic components is absent at the empty pickup site. A second electronic component is transferred onto the empty pickup site. A target substrate is provided. The plurality of first electronic components and the second electronic component are transferred onto the target substrate.

First claim

What is claimed is:

1. A method of manufacturing an electronic device, comprising:
providing a plurality of first electronic components;
transferring the plurality of first electronic components onto a plurality of pickup sites;
figuring out a defected electronic component from the plurality of first electronic components;
removing the defected electronic component to provide an empty pickup site among the plurality of pickup sites;
transferring a second electronic component onto the empty pickup site;
providing a target substrate; and
transferring the plurality of first electronic components and the second electronic component onto the target substrate.

2. The method of manufacturing the electronic device of claim 1 , wherein the plurality of first electronic components is transferred onto the plurality of pickup sites through a static-electricity transferring, a stamp transferring, or a vacuum transferring.

3. The method of manufacturing the electronic device of claim 1 , wherein the second electronic component is transferred onto the empty pickup site through a laser releasing method.

4. The method of manufacturing the electronic device of claim 1 , wherein the defected electronic component is removed through a laser ablation.

5. The method of manufacturing the electronic device of claim 1 , wherein the defected electronic component is removed through a laser impact.

6. The method of manufacturing the electronic device of claim 1 , wherein the defected electronic component is figured out from the plurality of first electronic components through an automatic optical inspection.

7. The method of manufacturing the electronic device of claim 1 , wherein each of the plurality of pickup sites carries one electronic component of the plurality of first electronic components and the second electronic component before the plurality of first electronic components and the second electronic component are transferred onto the target substrate.

8. The method of manufacturing the electronic device of claim 1 , wherein the plurality of first electronic components are carried by a carrier before being transferring onto the pickup sites.

9. The method of manufacturing the electronic device of claim 1 , wherein the second electronic component is transferred onto the empty pickup site from a carrier.

10. The method of manufacturing the electronic device of claim 1 , wherein a transfer head is used to transfer the plurality of first electronic components and the second electronic component and the transfer head has the plurality of pickup sites.

Assignees

• Innolux Corp

Inventors

• Cheng Kai
• Lin Fang-Ying
• Hsieh Tsau-Hua

Classifications

• H05K1/183

  associated with components mounted in and supported by recessed areas of the PCBs · CPC title

• H05K2203/16

  Inspection; Monitoring; Aligning · CPC title

• H05K13/043

  Feeding one by one by other means than belts · CPC title

• H05K13/0478

  Simultaneously mounting of different components · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title