Semiconductor device package and light emitting device comprising same

Patent metadata

Field	Value
Publication number	US-12191427-B2
Application number	US-201916960695-A
Country	US
Kind code	B2
Filing date	Feb 1, 2019
Priority date	Feb 5, 2018
Publication date	Jan 7, 2025
Grant date	Jan 7, 2025

Abstract

An embodiment provides a semiconductor device package and a light emitting device comprising same, the semiconductor device package comprising: a body including a first cavity; and a semiconductor device disposed within the first cavity, wherein: the first cavity includes a first surface inclined such that the area of the cavity gradually increases as going away from the semiconductor device, and a plurality of second surfaces perpendicular to the upper surface of the semiconductor device; the body includes a first outer surface and a third outer surface that are opposite to each other, a second outer surface and a fourth surface that are opposite to each other, a first corner portion disposed in a region where the first and second outer surfaces meet each other, a second corner portion disposed in a region where the second and third outer surfaces meet each other, a third corner portion disposed in a region where the third and fourth outer surfaces meet each other, and a fourth corner portion disposed in a region where the fourth and first outer surfaces meet each other; and the plurality of second surfaces are disposed between the first and second corner portions, between the second and third corner portions, between the third and fourth corner portions, and between the fourth and first corner portions, respectively.

First claim

The invention claimed is:

1. A semiconductor device package comprising:
a body including a plurality of cavities separated from each other to be non-overlapped, each of the plurality of cavities including a bottom surface, and a slope surface connected to the bottom surface;
a substrate disposed on the bottom surface of the cavity; and
a plurality of semiconductor devices disposed in one surface of the substrate to be separately inserted into the plurality of cavities and positioned in the body such that only a single one of the semiconductor devices is separately disposed within each of the cavities,
wherein the plurality of cavities are disposed along a plurality of rows that includes a first row and a second row, wherein a first set of the cavities are arranged in the first row, and a second set of the cavities are arranged in the second row,
wherein the body includes:
a plurality of conductive portions disposed in a first direction; and
a plurality of insulation lines disposed in parallel in a second direction crossing the first direction between the plurality of conductive portions to electrically insulate the plurality of conductive portions,
wherein the plurality of insulation lines includes:
a first insulation line passing through a bottom surface of a second cavity of the first set of the cavities arranged in the first row and passing through a slope surface of a second cavity of the second set of the cavities arranged in the second row; and
a second insulation line passing through a slope surface of a first cavity of the first set of the cavities arranged in the first row and passing through a bottom surface of a first cavity of the second set of the cavities arranged in the second row,

wherein the substrate includes:
a first electrode and a second electrode disposed on one surface of the substrate; and
a first pad, a second pad and a third pad disposed on a lower surface of the substrate;
wherein the first pad is electrically connected to the first electrode, the second pad is electrically connected to the second electrode, and the third pad disposed between the first pad and the second pad is a heat dissipation pad.

2. The semiconductor device package of claim 1 , wherein the body includes a horizontal surface connecting the slope surfaces of the cavities.

3. The semiconductor device package of claim 2 , further comprising a light transmission member provided with a plurality of coupling portions coupled to a plurality of protruding portions disposed at an upper corner of the body, and fixed to the body by coupling of the plurality of protruding portions and the plurality of coupling portions.

4. The semiconductor device package of claim 1 , wherein the slope surface has a parabolic shape of which a cross-sectional area increases in a direction away from the substrate.

5. The semiconductor device package of claim 1 , wherein the cavity has a polygonal shape.

6. The semiconductor device package of claim 1 , wherein a horizontal width of the cavity is formed to decrease in a direction toward the bottom surface.

Assignees

• Lg Innotek Co Ltd

Inventors

• Oh Jung Hun
• Kim Ki Cheol
• Choi Kwang Ki

Classifications

• H10H29/8508

  Package substrates, e.g. submounts · CPC title

• H10H29/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H29/856

  Reflecting means · CPC title

• H10H29/857

  Interconnections (of active-matrix LED displays H10H29/49) · CPC title

• H10H20/8508

  Package substrates, e.g. submounts · CPC title