Film-initiated cure of structural adhesive film

US12187929B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12187929-B2
Application numberUS-201915733471-A
CountryUS
Kind codeB2
Filing dateFeb 8, 2019
Priority dateFeb 9, 2018
Publication dateJan 7, 2025
Grant dateJan 7, 2025

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Curable adhesive free-standing films and adhesive systems comprising such films are provided. In some embodiments, a curable adhesive free-standing film comprises a blend of: a) a first film-forming polymer or oligomer; b) a first species comprising first unsaturated free-radically polymerizable groups, which may be a) or a species other than a); c) a first transition metal cation; d) a reducing agent; and no oxidizing agent. In some embodiments, an adhesive system comprises: I) a first curable adhesive free-standing film as described preceding; and II) a second curable adhesive free-standing film comprising a blend of: e) a second film-forming polymer or oligomer; f) a second species comprising second unsaturated free-radically polymerizable groups, which may be e) or may be a species other than e); and g) an oxidizing agent. In some embodiments, the curable adhesive free-standing films may be pressure sensitive adhesives prior to cure. Methods of use are provided.

First claim

Opening claim text (preview).

We claim: 1. An adhesive system comprising: I) a tape comprising a support layer with two first curable adhesive films borne on or directly bound to opposite faces of the support layer, each first curable adhesive film independently comprising a blend of: a) a first film-forming polymer or oligomer; b) a first species comprising first unsaturated free-radically polymerizable groups, which may be a) or a species other than a); c) a first transition metal cation; and d) a reducing agent which is not a), b), or c); wherein neither of the first curable adhesive films comprises an oxidizing agent which is not a), b), c), or d); and II) a second curable adhesive film comprising a blend of: e) a second film-forming polymer or oligomer; f) a second species comprising second unsaturated free-radically polymerizable groups, which may be e) or may be a species other than e); and g) an oxidizing agent which is not e) or f). 2. The adhesive system according to claim 1 wherein b) is a). 3. The adhesive system according to claim 1 wherein b) is a species other than a), wherein a) does not comprise unsaturated free-radically polymerizable groups. 4. The adhesive system according to claim 3 wherein a) is selected from the group consisting of acrylic polymers, rubber polymers, polyester polymers, polyurethane polymers, polyamide polymers, and combinations thereof. 5. The adhesive system according to claim 1 wherein the reducing agent does not comprise a transition metal, nitrogen or sulfur. 6. The adhesive system according to claim 1 wherein the reducing agent is selected from organic reducing agents. 7. The adhesive system according to claim 1 wherein each first curable adhesive film is a pressure sensitive adhesive. 8. The adhesive system according to claim 1 wherein f) is e). 9. The adhesive system according to claim 1 wherein f) is a species other than e), wherein e) does not comprise unsaturated free-radically polymerizable groups. 10. The adhesive system according to claim 9 wherein e) is selected from the group consisting of acrylic polymers, rubber polymers, polyester polymers, polyurethane polymers, polyamide polymers, and combinations thereof. 11. The adhesive system according to claim 1 wherein the second curable adhesive film is a pressure sensitive adhesive. 12. The adhesive system according to claim 1 , wherein the first film-forming polymer or oligomer is a poly(meth)acrylate oligomer. 13. The adhesive system according to claim 1 , wherein the support layer is a foam. 14. A method of binding two substrates comprising the steps of: 1) Providing a first substrate bearing on a first surface the tape according to claim 1 ; 2) Providing a second substrate bearing on a second surface the second curable adhesive film according to claim 1 ; and 3) Bringing together the first and second surfaces of the first and second substrates such that the tape and the second curable adhesive film are in contact. 15. A method of binding two substrates comprising the steps of: 1) providing the second curable adhesive film according to claim 1 ; 2) Providing a first substrate bearing on a first surface a first portion of the tape according to claim 1 ; 3) Providing a second substrate bearing on a second surface a second portion of the tape according to claim 1 ; where the first and second portions have compositions chosen independently of each other; and 4) Bringing together 1), 2), and 3) such that the first portion of the tape and the second portion of the tape are in contact with opposite faces of the second curable adhesive film. 16. A method of binding two substrates comprising the steps of: 1) Providing the tape according to claim 1 ; 2) Providing a first substrate bearing on a first surface a first portion of the second curable adhesive film according to claim 1 ; 3) Providing a second substrate bearing on a second surface a second portion of the second curable adhesive film according to claim 1 ; wherein the first and second portions have compositions chosen independently of each other; and 4) Bringing together 1), 2), and 3) such that the first portion of the second curable adhesive film and the second portion of the second curable adhesive film are in contact with opposite faces of the tape. 17. An adhesive system comprising: I) a tape comprising a support layer with two first curable adhesive films borne on or directly bound to opposite faces of the support layer, each first curable adhesive film independently comprising a blend of: a) a first film-forming polymer or oligomer; b) a first species comprising first unsaturated free-radically polymerizable groups, which may be a) or a species other than a); and c) a first transition metal cation; wherein the first curable adhesive film comprises no oxidizing agent which is not a), b), or c); and II) a second curable adhesive film comprising a blend of: e) a second film-forming polymer or oligomer; f) a second species comprising second unsaturated free-radically polymerizable groups, which may be e) or may be a species other than e); and g) an oxidizing agent which is not e) or f). 18. The adhesive system according to claim 17 , wherein the second curable adhesive film additionally comprises: h) a second transition metal cation. 19. The adhesive system according to claim 17 , wherein both of the first curable adhesive films and the second curable adhesive film are pressure-sensitive adhesives. 20. The adhesive system according to claim 17 , wherein the support layer is a foam.

Assignees

Inventors

Classifications

  • Presence of (meth)acrylic polymer · CPC title

  • inorganic · CPC title

  • C09J5/04Primary

    involving separate application of adhesive ingredients to the different surfaces to be joined · CPC title

  • the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C · CPC title

  • the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive · CPC title

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What does patent US12187929B2 cover?
Curable adhesive free-standing films and adhesive systems comprising such films are provided. In some embodiments, a curable adhesive free-standing film comprises a blend of: a) a first film-forming polymer or oligomer; b) a first species comprising first unsaturated free-radically polymerizable groups, which may be a) or a species other than a); c) a first transition metal cation; d) a reducin…
Who is the assignee on this patent?
3M Innovative Properties Company
What technology area does this patent fall under?
Primary CPC classification C09J5/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 07 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).