Silica particle dispersion liquid and production method thereof

Patent metadata

Field	Value
Publication number	US-12187618-B2
Application number	US-202017029716-A
Country	US
Kind code	B2
Filing date	Sep 23, 2020
Priority date	Sep 30, 2019
Publication date	Jan 7, 2025
Grant date	Jan 7, 2025

Abstract

A silica particle dispersion liquid includes a silica particle that satisfies (i) to (iii) below: (i) an average particle diameter d is 5 to 300 nm; (ii) an occlusion amount of a basic substance per 1 g of the particle is 2 mg or more; and (iii) a Sears number Y exceeds 12.0.

First claim

What is claimed is:

1. A silica particle dispersion liquid, which is used for polishing, comprising a silica particle that satisfies (i) to (iv) below: (i) an average particle diameter d is 5 to 300 nm; (ii) an occlusion amount of a basic substance per 1 g of the particle is 2 mg or more; (iii) a Sears number Y exceeds 12.0; (iv) a density p of 1.00 g/cm3 or less; and a coefficient of variance for the average particle diameter d of the silica particle is 10% or less, wherein the silica particle has a plurality of pores that occludes the basic substance.

2. The silica particle dispersion liquid according to claim 1 ,
wherein the Sears number Y of (iii) is more than 12.0 and not more than 20.0.

3. The silica particle dispersion liquid according to claim 1 ,
wherein the silica particle has a structure in which a surface of the particle communicates with a pore inside the particle.

4. A production method of a silica particle dispersion liquid of claim 1 , comprising:
preparing a silica particle dispersion liquid containing a silica particle having an average particle diameter d of 5 to 300 nm and a Sears number Y or 40 or more by hydrolyzing and polycondensing alkoxysilane in the presence of water, an organic solvent, and an alkali catalyst under a reaction temperature is lower than 20° C., and a time involved in growth of the particle is within 30 minutes;
substituting the organic solvent in the silica particle dispersion liquid with water;
heating, under normal pressure at pH 7 or more, the silica particle dispersion liquid obtained by substituting with water such that the Sears number Y of the silica particle does not become 12.0 or less; and
concentrating, at less than pH 7, the dispersion liquid obtained by heating.

5. The production method according to claim 4 ,
wherein the heating includes adjusting adjusting the Sears number Y of the silica particle to more than 12.0 and not more than 20.0.

6. The production method according to claim 4 ,
wherein the time involved in growth of the particle is within 20 minutes.

Assignees

• Jgc Catalysts & Chemicals Ltd

Inventors

• Egami Miki
• Kumazawa Mitsuaki
• Muraguchi Ryo
• Komatsu Michio

Classifications

• C01P2004/64

  Nanometer sized, i.e. from 1-100 nanometer · CPC title

• C01P2004/90

  Other morphology not specified above · CPC title

• C01P2004/62

  Submicrometer sized, i.e. from 0.1-1 micrometer · CPC title

• C01P2006/10

  Solid density · CPC title

• C09K3/1409

  Abrasive particles per se (preparation of diamond C01B32/25) · CPC title