Reduction of ringing and intermodulation distortion in a MEMS device

Patent metadata

Field	Value
Publication number	US-12187599-B2
Application number	US-202117491416-A
Country	US
Kind code	B2
Filing date	Sep 30, 2021
Priority date	Sep 30, 2021
Publication date	Jan 7, 2025
Grant date	Jan 7, 2025

Abstract

Described embodiments include a microelectromechanical system (MEMS) array comprising a first MEMS device that includes a first movable electrostatic plate elastically connected to a first structure, the first movable electrostatic plate having a first mass, a first fixed electrostatic plate, and a first drive circuit having a first drive output coupled to the first fixed electrostatic plate. There is a second MEMS device that includes a second movable electrostatic plate elastically connected to a second structure, the second movable electrostatic plate having a second mass that is different than the first mass, a second fixed electrostatic plate, and a second drive circuit having a second drive output coupled to the second fixed electrostatic plate.

First claim

What is claimed is:

1. A microelectromechanical system (MEMS) array comprising:
a first MEMS device, including:
a first movable electrostatic plate elastically connected to a first structure, the first movable electrostatic plate having a first mass and a first lateral bending mode;
a first fixed electrostatic plate;
a first drive circuit having a first drive output coupled to the first fixed electrostatic plate;
a first filter coupled to the first drive output, the first filter having a first frequency response producing a first resonant frequency in the first fixed electrostatic plate; and

a second MEMS device, including:
a second movable electrostatic plate elastically connected to a second structure, the second movable electrostatic plate having a second mass different than the first mass;
a second fixed electrostatic plate;
a second drive circuit having a second drive output coupled to the second fixed electrostatic plate; and
a second filter coupled to the second drive output, the second filter having a second frequency response, the second frequency response different than the first frequency response producing a second resonant frequency in the second fixed electrostatic plate that is different than the first resonant frequency.

2. The array of claim 1 , wherein:
the first and second movable electrostatic plates have material added to their periphery, increasing their respective masses; and
the masses of the material added are different between the first and second movable electrostatic plates.

3. The array of claim 1 , wherein:
the first and second movable electrostatic plates have cutouts having first and second cutout patterns, respectively, the cutouts decreasing the first mass and the second mass; and
the first and second cutout patterns are different.

4. The array of claim 3 , wherein the first and second movable electrostatic plates also have material added to their periphery, and the masses of the material added are different between the first and second movable electrostatic plates.

5. The array of claim 1 , wherein the first movable electrostatic plate is pulled toward the first fixed electrostatic plate by an electromagnetic force.

6. The array of claim 5 , wherein the first movable electrostatic plate makes electrical and mechanical contact with a signal output terminal in response to the electromagnetic force, and breaks electrical and mechanical contact with the signal output terminal in response to an absence of the electromagnetic force.

7. The array of claim 1 , wherein the first movable electrostatic plate has a first lateral bending mode, the second movable electrostatic plate has a second lateral bending mode, and the first and second lateral bending modes are different.

8. The array of claim 1 , wherein the MEMS array is packaged in a vacuum.

9. A microelectromechanical system (MEMS) varactor array comprising:
a first MEMS device, including:
a first fixed electrostatic plate coupled to a first input signal terminal;
a second fixed electrostatic plate coupled to a first output signal terminal;
a first movable electrostatic plate elastically connected to a first structure, the first movable electrostatic plate having a first mass, and the first movable electrostatic plate forming first and second capacitors with the first and second fixed electrostatic plates, respectively;
a first drive circuit having a first drive output coupled to the first movable electrostatic plate;
a first filter coupled to the first drive output, the first filter having a first frequency response producing a first resonant frequency in the first fixed electrostatic plate; and

a second MEMS device, including:
a third fixed electrostatic plate coupled to a second input signal terminal;
a fourth fixed electrostatic plate coupled to a second output signal terminal;
a second movable electrostatic plate elastically connected to a second structure, the second movable electrostatic plate having a second mass that is different than the first mass, and the second movable electrostatic plate forming third and fourth capacitors with the third and fourth fixed electrostatic plates, respectively; and
a second drive circuit having a second drive output coupled to the second movable electrostatic plate; and
a second filter coupled to the second drive output, the second filter having a second frequency response, the second frequency response different than the first frequency response producing a second resonant frequency in the second fixed electrostatic plate that is different than the first resonant frequency.

10. The array of claim 9 , wherein:
the first and second movable electrostatic plates have material added to their periphery, increasing their respective masses; and
the masses of the material added are different between the first and second movable electrostatic plates.

11. The array of claim 9 , wherein:
the first and second movable electrostatic plates have cutouts having first and second cutout patterns, respectively, the cutouts decreasing the first mass and the second mass; and
the first and second cutout patterns are different.

12. The array of claim 11 , wherein the first and second movable electrostatic plates also have material added to their periphery, and the masses of the material added are different between the first and second movable electrostatic plates.

13. The array of claim 9 , wherein the first movable electrostatic plate is attracted toward the first fixed electrostatic plate by an electromagnetic force.

14. The array of claim 9 , wherein the first movable electrostatic plate has a first lateral bending mode, the second movable electrostatic plate has a second lateral bending mode, and the first and second lateral bending modes are different.

15. A microelectromechanical system (MEMS) array comprising:
a first MEMS device, including:
a first movable electrostatic plate elastically connected to a first structure;
a first fixed electrostatic plate;
a first drive circuit having a first drive output coupled to the first fixed electrostatic plate, and providing a first drive signal;
a first signal input terminal coupled to one of either the first movable electrostatic plate or the first fixed electrostatic plate; and
a first filter coupled to the first drive output, the first filter having a first frequency response producing a first resonant frequency in the first fixed electrostatic plate; and

a second MEMS device, including:
a second movable electrostatic plate elastically connected to a second structure;
a second fixed electrostatic plate;
a second drive circuit having a second drive output coupled to the second fixed electrostatic plate, and providing a second drive signal;
a second signal input terminal coupled to one of the second movable electrostatic plate or the second fixed electrostatic plate; and
a second filter coupled to the second drive output, the second filter having a second frequency response, the second frequency response different than the first frequency response producing a second resonant frequency in the second fixed electrostatic plate that is different than the first resonant frequency.

16. The array of claim 15 , wherein the first filter includes a first filter resistor and a first filter capacitor, and the second filter includes a second filter resistor and a second filter capacitor.

17. The array of claim 16 , wherein the first and second filter resistors have the same resistance, and the first and second filter capacitors have different capacitances.

Assignees

• Texas Instruments Inc

Inventors

• Fruehling Adam Joseph

Classifications

• G02B26/0833

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title

• B81B2201/0221

  Variable capacitors · CPC title

• B81B2201/01

  Switches · CPC title

• B81B2207/03

  Electronic circuits for micromechanical devices which are not application specific, e.g. for controlling, power supplying, testing, protecting · CPC title