Remote radio unit with reduced volume and increased thermal efficiency

Patent metadata

Field	Value
Publication number	US-12185501-B2
Application number	US-202217673261-A
Country	US
Kind code	B2
Filing date	Feb 16, 2022
Priority date	Sep 24, 2021
Publication date	Dec 31, 2024
Grant date	Dec 31, 2024

Abstract

The disclosed device may include a radio frequency (RF) component and a thermal management component establishing a thermal path with the RF component. The device may also include an RF filter electrically that is coupled to the RF component and arranged away from the thermal path. The device may further include a chassis for housing the RF component. The thermal management component and the RF filter may be positioned near an exterior of the chassis. Various other devices, apparatuses, and systems are also disclosed.

First claim

What is claimed is:

1. A device comprising:
a radio frequency (RF) component comprising a planar surface;
a thermal management component establishing a thermal path with the RF component and arranged parallel to the planar surface;
an RF filter electrically coupled to the RF component and arranged away from the thermal path and is oriented perpendicular to the planar surface; and
a chassis for housing the RF component, wherein the thermal management component and the RF filter are positioned near an exterior of the chassis.

2. The device of claim 1 , wherein the RF filter is removable from the chassis.

3. The device of claim 1 , further comprising an interconnect for coupling the RF component to the perpendicularly oriented RF filter.

4. The device of claim 3 , wherein the interconnect comprises one or more vertical connectors extending along the planar surface.

5. The device of claim 3 , wherein the interconnect allows direct coupling between the RF component and the RF filter.

6. The device of claim 1 , further comprising a power amplifier electrically coupled to the RF component and the RF filter.

7. The device of claim 6 , further comprising a shield component arranged between the RF component and the power amplifier.

8. The device of claim 1 , wherein the thermal management component comprises a passive thermal management component.

9. The device of claim 1 , wherein the RF filter comprises a duplexer.

10. The device of claim 1 , further comprising a cover at least partially covering the chassis and the thermal management component.

11. The device of claim 1 , further comprising a cover covering the thermal management component.

12. An apparatus comprising:
a radio frequency (RF) device comprising:
an RF component comprising a planar surface;
a thermal management component establishing a thermal path with the RF component and arranged parallel to the planar surface; and
a chassis for housing the RF component, wherein the thermal management component is positioned near an exterior of the chassis; and

an RF filter electrically coupled to the RF component, arranged away from the thermal path, oriented perpendicular to the planar surface, and mounted near an exterior of the chassis.

13. The apparatus of claim 12 , wherein the RF filter is removable from the chassis.

14. The apparatus of claim 12 , further comprising an interconnect for coupling the RF component to the perpendicularly oriented RF filter, wherein the interconnect comprises one or more vertical connectors extending along the planar surface and the interconnect allows direct coupling between the RF component and the RF filter.

15. The apparatus of claim 12 , further comprising:
a power amplifier electrically coupled to the RF component and the RF filter; and
a shield component arranged between the RF component and the power amplifier.

16. The apparatus of claim 12 , further comprising a cover at least partially covering the chassis and the thermal management component.

17. A system comprising:
an antenna;
a remote radio unit (RRU) coupled to the antenna and comprising:
a radio frequency (RF) component comprising a planar surface;
a thermal management component establishing a thermal path with the RF component and arranged parallel to the planar surface; and
a chassis for housing the RF component, wherein the thermal management component is positioned near an exterior of the chassis; and

an RF filter electrically coupled to the RF component, arranged away from the thermal path, oriented perpendicular to the planar surface, and mounted near an exterior of the chassis.

18. The system of claim 17 , wherein the RF filter is removable from the chassis.

19. The system of claim 17 , wherein:
the RRU further comprises an interconnect for coupling the RF component to the perpendicularly oriented RF filter;
the interconnect comprises one or more vertical connectors extending along the planar surface; and
the interconnect allows direct coupling between the RF component and the RF filter.

20. The system of claim 17 , further comprising a cover at least partially covering the chassis and the thermal management component.

Assignees

• Meta Platforms Inc

Inventors

• Udell Eric
• Engala Kodanda Ram Reddy
• Rangaswamy Granthana Kattehalli
• Shehab Imad
• Saraswat Srishti
• Tabatabai Farbod
• Volz Joseph David

Classifications

• H03F3/245

  with semiconductor devices only · CPC title

• H04B1/40 Primary

  Circuits · CPC title

• H03F2200/451

  the amplifier being a radio frequency amplifier · CPC title

• H03F3/211

  using a combination of several amplifiers (H03F3/60 takes precedence) · CPC title

• H03F3/195

  in integrated circuits · CPC title