Display device and circuit board

Patent metadata

Field	Value
Publication number	US-12185452-B2
Application number	US-202117802990-A
Country	US
Kind code	B2
Filing date	Aug 11, 2021
Priority date	Sep 30, 2020
Publication date	Dec 31, 2024
Grant date	Dec 31, 2024

Abstract

The present disclosure is related to a display device and a circuit board (200). The display device comprises a light-emitting module (100), a circuit board (200) and a conductive structure (300). The surface of the light-emitting module (100) is provided with a conductive portion (101). The circuit board (200) is arranged on a back face (102) of the light-emitting module (100), and has a first surface (201) close to the light-emitting module (100). The first surface (201) of the circuit board (200) is provided with an exposed external conductive layer (210), and the external conductive layer (210) is electrically connected to a ground wire of the circuit board (200). The conductive structure (300) is located between the circuit board (200) and the light-emitting module (100), and makes the external conductive layer (210) electrically connect to the conductive portion (101).

First claim

What is claimed is:

1. A display device, comprising:
a light emitting module, wherein a surface of the light emitting module is provided with a conductive portion;
a circuit board, disposed at a back face of the light emitting module and provided with a first surface close to the light emitting module, wherein the first surface of the circuit board is provided with an exposed external conductive layer, and the external conductive layer is electrically coupled to a ground wire of the circuit board; and
a conductive structure, located between the circuit board and the light emitting module, and configured to electrically couple the external conductive layer to the conductive portion,
wherein the circuit board comprises a signal transmission area, and the signal transmission area is provided with a signal transmission lead; and
the external conductive layer comprises a first external conductive layer and an orthographic projection of the first external conductive layer on a base substrate of the circuit board is located within the signal transmission area.

2. The display device according to claim 1 , wherein the circuit board comprises a power management area, and the power management area is provided with a power management circuit; and
the external conductive layer comprises a second external conductive layer, and an orthographic projection of the second external conductive layer on a base substrate of the circuit board is located within the power management area.

3. The display device according to claim 1 , wherein the circuit board comprises a plurality of metal wiring layers that are stacked, wherein a first metal wiring layer closest to the first surface is provided with the external conductive layer.

4. The display device according to claim 1 , wherein the circuit board is provided with a second surface away from the light emitting module; and
a capacitive device and a resistive device of the circuit board are disposed on the second surface of the circuit board.

5. The display device according to claim 1 , wherein a conductive material is used for the back face of the light emitting module; and
the conductive structure is a conductive foam or a conductive adhesive layer.

6. The display device according to claim 1 , wherein the display device further comprises a thermally conductive structure; and
at least a partial area of the external conductive layer is electrically coupled to the back face of the light emitting module through the conductive structure, and a remaining area of the external conductive layer is electrically coupled to the back face of the light emitting module through the thermally conductive structure.

7. The display device according to claim 6 , wherein a grid shape is formed by an orthographic projection of one of the conductive structure and the thermally conductive structure on the external conductive layer, and an orthographic projection of the other one of the conductive structure and the thermally conductive structure on the external conductive layer is located in a mesh of the grid shape; or
the orthographic projection of one of the conductive structure and the thermally conductive structure on the external conductive layer is a ring shape along an edge of the external conductive layer, and the orthographic projection of the other one of the conductive structure and the thermally conductive structure on the external conductive layer is located within an inner edge of the ring shape.

8. The display device according to claim 1 , wherein the back face of the light emitting module is insulative; and
the conductive structure comprises a conductive tape attached to the back face of the light emitting module and coupled to the conductive portion, the circuit board is disposed on a side of the conductive tape away from the light emitting module, and the external conductive layer is electrically coupled with the conductive tape.

9. A circuit board, comprising a first surface and a second surface disposed oppositely; wherein a resistive device and a capacitive device of the circuit board are disposed on the second surface; and
the first surface of the circuit board is provided with an exposed external conductive layer, and the external conductive layer is electrically coupled to a ground wire of the circuit board,
wherein the circuit board comprises a signal transmission area, and the signal transmission area is provided with a signal transmission lead; and
the external conductive layer comprises a first external conductive layer, and an orthographic projection of the first external conductive layer on a base substrate of the circuit board is located within the signal transmission area.

10. The circuit board according to claim 9 , wherein the circuit board comprises a power management area, and the power management area is provided with a power management circuit; and
the external conductive layer comprises a second external conductive layer, and an orthographic projection of the second external conductive layer on the base substrate of the circuit board is located within the power management area.

11. The circuit board according to claim 9 , wherein the circuit board comprises a plurality of metal wiring layers that are stacked, and a first metal wiring layer closest to the first surface is provided with the external conductive layer.

Assignees

• Hefei Xinsheng Optoelectronics Technology Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Wang Rui
• Chen Zejun
• Wang Jianjun
• Liu Xiaoshi
• Yuan Xianfeng

Classifications

• H05K2201/10136

  Liquid Crystal display [LCD] · CPC title

• H05K1/0234

  Resistors or by disposing resistive or lossy substances in or near power planes (H05K1/0246 takes precedence) · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• G02F1/1336

  Illuminating devices · CPC title

• G02F1/133612

  Electrical details · CPC title