Vapor cycle cooling system for high powered devices

US12181193B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12181193-B2
Application numberUS-202117445226-A
CountryUS
Kind codeB2
Filing dateAug 17, 2021
Priority dateAug 19, 2020
Publication dateDec 31, 2024
Grant dateDec 31, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A vapor-compression system includes a centrifugal compressor configured to increase a pressure of a refrigerant based on at least one of an activation of a device or the device being equal to or above a first threshold temperature. A fluid communication system is configured to provide, to the device, a portion of the refrigerant in a liquid state. The portion of the liquid refrigerant in a liquid state is configured to have a saturation temperature equal to or below the first temperature threshold.

First claim

Opening claim text (preview).

What is claimed is: 1. A vapor-compression system comprising: a centrifugal compressor configured to increase a pressure of a refrigerant based on at least one of an activation of a device or a temperature of the device being equal to or above a first threshold temperature; and a fluid communication system configured to provide, to the device, a portion of the refrigerant in a liquid state, wherein the portion of the refrigerant in the liquid state is configured to have a saturation temperature equal to or below the first temperature threshold. 2. The vapor-compression system of claim 1 , wherein the centrifugal compressor is further configured to shut off based on at least one of the device being deactivated or the temperature of the device being equal to or below a second threshold temperature. 3. The vapor-compression system of claim 1 , wherein the device comprises a directed energy device. 4. The vapor-compression system of claim 1 , wherein the device is configured to output an amount of heat that is greater than a cooling capacity of the vapor-compression system when activated, wherein the device is configured to output an amount of heat that is less than the cooling capacity of the vapor-compression system when deactivated. 5. The vapor-compression system of claim 4 , wherein the cooling capacity of the vapor-compression system is equal to or less than 15 kilowatts. 6. The vapor-compression system of claim 2 , wherein the fluid communication system is further configured to provide liquid refrigerant having a saturation temperature below the second threshold temperature to a thermal capacitor. 7. The vapor-compression system of claim 6 , wherein the thermal capacitor is at least one of a battery, an electronic controller of the device, or a housing of the device. 8. The vapor-compression system of claim 1 , further comprising: a first expansion valve configured to reduce a pressure of the refrigerant before the portion of the refrigerant in the liquid state is provided to the device; and a second expansion valve configured to further reduce a pressure of the refrigerant downstream from the first expansion valve. 9. The vapor-compression system of claim 8 , wherein the fluid communication system is further configured to cause at least a portion of the refrigerant to bypass the device to the second expansion valve. 10. The vapor-compression system of claim 1 , wherein the fluid communication system is configured to provide liquid refrigerant equal to or below the first temperature threshold to the device without a surge valve. 11. A method of cooling a device, the method comprising: increasing, via a centrifugal compressor, a pressure of a refrigerant upon at least one of an activation of a device or a temperature of the device being equal to or above a first threshold temperature; and providing, via a fluid communication system, a portion of the refrigerant in a liquid state to the device, wherein the portion of the refrigerant in the liquid state has a saturation temperature equal to or below the first temperature threshold. 12. The method of claim 11 , further comprising: shutting off the centrifugal compressor based on at least one of the device being deactivated or the temperature of the device being equal to or below a second threshold temperature. 13. The method of claim 11 , wherein the device comprises a directed energy device. 14. The method of claim 11 , wherein the device is configured to output an amount of heat that is greater than a cooling capacity of a vapor-compression system when activated, wherein the device is configured to output an amount of heat that is less than the cooling capacity of the vapor-compression system when deactivated. 15. The method of claim 14 , wherein the cooling capacity of the vapor-compression system is equal to or less than 15 kilowatts. 16. The method of claim 12 , further comprising: providing, via the fluid communication system, liquid refrigerant having a saturation temperature equal to or below the second threshold temperature to a thermal capacitor. 17. The method of claim 16 , wherein the thermal capacitor is at least one of a battery, an electronic controller of the device, or a housing of the device. 18. The method of claim 11 , further comprising: reducing, via a first expansion valve, a pressure of the refrigerant before the portion of the refrigerant in the liquid state is provided to the device; and reducing, via a second expansion valve, the pressure of the refrigerant downstream from the first expansion valve. 19. The method of claim 18 , further comprising: causing, via the fluid communication system, at least a portion of the refrigerant to bypass the device to the second expansion valve. 20. A vapor-compression system comprising: a centrifugal compressor configured to increase a pressure of a refrigerant based on at least one of an activation of a device or a temperature of the device being equal to or above a first threshold temperature; a condenser in fluid communication with the centrifugal compressor and configured to remove heat and condense at least a portion of the refrigerant to a liquid state; an expansion valve in fluid communication with the condenser and configured to decrease a pressure of the refrigerant; and a fluid communication system configured to provide, to the device, the portion of the refrigerant in the liquid state, wherein the portion of the liquid refrigerant in the liquid state is configured to have a first saturation temperature equal to or below the first temperature threshold, wherein the fluid communication system is further configured to provide a second portion of the refrigerant in a liquid state to a thermal capacitor downstream from the device, wherein the second portion of the refrigerant in the liquid state has a second saturation temperature equal to or below the first saturation temperature, wherein the centrifugal compressor is further configured to shut off based on at least one of the device being deactivated or the temperature of the device being equal to or below a second threshold temperature.

Assignees

Inventors

Classifications

  • Liquid cooling, e.g. by water · CPC title

  • Suction pressures · CPC title

  • Dispositions with two or more expansion means arranged in series, i.e. multi-stage expansion, on a refrigerant line leading to the same evaporator · CPC title

  • F25B49/022Primary

    Compressor control arrangements · CPC title

  • Condensers · CPC title

Patent family

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Frequently asked questions

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What does patent US12181193B2 cover?
A vapor-compression system includes a centrifugal compressor configured to increase a pressure of a refrigerant based on at least one of an activation of a device or the device being equal to or above a first threshold temperature. A fluid communication system is configured to provide, to the device, a portion of the refrigerant in a liquid state. The portion of the liquid refrigerant in a liqu…
Who is the assignee on this patent?
Honeywell Int Inc
What technology area does this patent fall under?
Primary CPC classification F25B49/022. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Dec 31 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).