Polyamide resin, preparation method therefof, and polyamide film and resin laminate comprising the same

Patent metadata

Field	Value
Publication number	US-12180340-B2
Application number	US-201917059975-A
Country	US
Kind code	B2
Filing date	Nov 1, 2019
Priority date	Nov 5, 2018
Publication date	Dec 31, 2024
Grant date	Dec 31, 2024

Abstract

The present invention relates to a polyamide resin having a main chain having a structure in which two polyamide segments are linked in an alternating way, a preparation method thereof, and a polyamide film and resin laminate including the same.

First claim

The invention claimed is:

1. A polyamide resin which comprises:
a first polyamide segment including a repeating unit represented by the following Chemical Formula 1 or a block composed thereof; and
a second polyamide segment including a repeating unit represented by the following Chemical Formula 2, or a block composed thereof,
wherein the first polyamide segment and the second polyamide segment form a main chain including an alternating repeating unit represented by the following Chemical Formula 3:

in the Chemical Formulae 1 and 2,
Ar 1 and Ar 2 are each independently a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms, and
in the Chemical Formula 3,
A is the first polyamide segment, and
B is the second polyamide segment,
wherein the polyamide resin has a weight average molecular weight of at least 330000 g/mol,
wherein a content of the repeating units represented by Chemical Formula 1 is in an amount of 80 mol % to 90 mol %, and a content of the repeating units represented by Chemical Formula 2 is in an amount of 10 mol % to 20 mol %, based on the total repeating units contained in the polyamide resin, and
wherein the polyamide resin has a haze measured according to ASTM D1003 of 3.0% or less.

2. The polyamide resin according to claim 1 , wherein
the polyamide resin has a relative viscosity of at least 45000 cps.

3. The polyamide resin according to claim 1 , wherein
the first polyamide segment has a number average molecular weight of 100 g/mol or more and 5000 g/mol or less.

4. The polyamide resin according to claim 1 , wherein
the repeating unit represented by Chemical Formula 2 comprises a repeating unit represented by the following Chemical Formula 2-1; or a repeating unit represented by Chemical Formula 2-2:

in the Chemical Formulae 2-1 to 2-2,
Ar 2 is a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms.

5. The polyamide resin according to claim 1 , wherein
the alternating repeating unit represented by Chemical Formula 3 is a repeating unit represented by the following Chemical Formula 4:

in the Chemical Formula 4,
Ar 1 and Ar 2 are each independently a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, or a substituted or unsubstituted heteroarylene group having 2 to 20 carbon atoms,
a1 and a2 are each independently an integer of 1 to 10, and
b1 and b2 are each independently an integer of 1 to 5.

6. The polyamide resin according to claim 1 , wherein
the repeating unit represented by Chemical Formula 1 is an amide repeating unit derived from a combination of a 1,4-aromatic diacyl compound and an aromatic diamine compound.

7. The polyamide resin according to claim 6 , wherein
the 1,4-aromatic diacyl compound comprises terephthaloyl chloride, or terephthalic acid, and
the aromatic diamine compound comprises 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine.

8. The polyamide resin according to claim 1 , wherein
the repeating unit represented by Chemical Formula 2 comprises an amide repeating unit derived from a combination of a 1,2-aromatic diacyl compound and an aromatic diamine compound; or an amide repeating unit derived from a combination of a 1,3-aromatic diacyl compound and the aromatic diamine compound.

9. The polyamide resin according to claim 8 , wherein
the 1,2-aromatic diacyl compound comprises phthaloyl chloride, or phthalic acid,
the 1,3-aromatic diacyl compound comprises isophthaloyl chloride or isophthalic acid, and
the aromatic diamine compound includes 2,2′-bis(trifluoromethyl)-4,4′-biphenyldiamine.

10. A resin laminate comprising: a substrate including the first polyamide resin of claim 1 ; and a hard coating layer formed on at least one side of the substrate.

Assignees

• Lg Chemical Ltd

Inventors

• Choi Il Hwan
• Tae Young Ji
• Park Soonyong
• Park Youngseok

Classifications

• C08G81/00

  Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers (involving only carbon-to-carbon unsaturated bond reactions C08F299/00 {; polyester-amides C08G69/44; polyester-imides C08G73/16; polyamides-imides C08G73/14; block- or graft polymers containing polysiloxane sequences C08G77/42}) · CPC title

• C08J7/046

  Forming abrasion-resistant coatings; Forming surface-hardening coatings · CPC title

• C08J2377/10

  Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids · CPC title

• C08J5/18

  Manufacture of films or sheets · CPC title

• C08G69/265

  from at least two different diamines or at least two different dicarboxylic acids · CPC title