Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation

Patent metadata

Field	Value
Publication number	US-12176643-B2
Application number	US-202017033386-A
Country	US
Kind code	B2
Filing date	Sep 25, 2020
Priority date	Sep 25, 2020
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.

First claim

What is claimed is:

1. An electronic package, comprising:
an interposer, wherein the interposer comprises:
an alignment standoff extending away from the interposer;

a socket secured to the interposer, wherein the socket comprises:
a housing comprising a protrusion that extends into a hole in the interposer;
a plurality of interconnect pins through the housing; and
a hole for receiving the alignment standoff; and

a spring around the alignment standoff, wherein the spring applies a force to separate the interposer from the socket.

2. The electronic package of claim 1 , wherein the plurality of interconnect pins are spaced apart from the interposer.

3. The electronic package of claim 2 , wherein the housing is held approximately 1.0 mm away from the interposer.

4. The electronic package of claim 1 , wherein the spring is a helical coil spring, a torsional spring, a leaf spring, or a wave spring.

5. The electronic package of claim 1 , wherein the housing comprises prongs that extend into an interior of the alignment standoff.

6. The electronic package of claim 5 , wherein the prongs comprise a protrusion configured to engage a ledge in the interior of the alignment standoff.

7. The electronic package of claim 6 , further comprising:
a push pin rivet inserted between the prongs, wherein the push pin rivet expands the prongs so that they engage with the ledge.

8. The electronic package of claim 1 , wherein the interposer is attached to the socket by a screw that engages the alignment standoff.

9. The electronic package of claim 1 , wherein the interposer is attached to the socket by a push pin rivet that is inserted into the alignment standoff.

10. The electronic package of claim 1 , wherein the alignment standoff comprises prongs, wherein the prongs are pushed together when passing through the hole, and wherein the prongs expand after passing through the hole to secure the socket to the interposer.

11. An electronic package, comprising:
a board;
a socket over the board, wherein the socket comprises:
a housing comprising a protrusion that extends into a hole in the board; and
interconnect pins through the housing;

a retention cover over the socket, wherein the retention cover compresses a bottom end of the interconnect pins between the board and the retention cover, wherein the retention cover interfaces with a load post of the electronic package;
a nut wherein the nut is secured to the load post; and
a helical spring provided around the load post, wherein a top of the helical spring is against the nut, and wherein a bottom of the helical spring presses against the retention cover to apply a downward force that compresses the bottom end of the interconnect pins between the board and the retention cover.

12. The electronic package of claim 11 , further comprising:
spring loaded handles attached to the retention cover, wherein pushing down the spring loaded handles applies a downward force onto the retention cover to compress the bottom end of the interconnect pins between the board and the retention cover.

13. The electronic package of claim 12 , wherein springs of the spring loaded handles are secured against flanges of a socket loading frame, and wherein the springs press against cams on the retention cover.

14. The electronic package of claim 11 , further comprising:
a handle plate over the retention cover, wherein the handle plate comprises latch point protrusions;
a plurality of helical springs between the handle plate and the retention cover;
a socket loading frame, wherein the socket loading frame comprises a plurality of flanges, and wherein the latch point protrusions lock against the flanges.

15. The electronic package of claim 11 , wherein the interconnect pins are compression mounted technology (CMT) pins.

16. The electronic package of claim 15 , wherein individual ones of the CMT pins comprise middle interface features.

17. An electronic package, comprising:
an interposer, wherein the interposer comprises an array of pads;
a socket attached to the interposer, wherein the socket comprises:
a housing comprising a protrusion that extends into a hole in the interposer; and
a plurality of compression mounted technology (CMT) pins passing through the housing; and

wherein the plurality of CMT pins are spaced apart from the array of pads, or wherein the plurality of CMT pins have bottom surfaces that are compressed so that they contact the array of pads.

18. The electronic package of claim 17 , further comprising:
a retention cover over the socket, wherein the retention cover compresses the bottom surface of the plurality of CMT pins against the array of pads.

19. An electronic package, comprising:
a board;
a socket over the board, wherein the socket comprises:
a housing comprising a protrusion that extends into a hole in the board; and
interconnect pins through the housing;

a retention cover over the socket, wherein the retention cover compresses a bottom end of the interconnect pins between the board and the retention cover; and
spring loaded handles attached to the retention cover, wherein pushing down the spring loaded handles applies a downward force onto the retention cover to compress the bottom end of the interconnect pins between the board and the retention cover.

20. The electronic package of claim 19 , wherein springs of the spring loaded handles are secured against flanges of a socket loading frame, and wherein the springs press against cams on the retention cover.

21. An electronic package, comprising:
a board;
a socket over the board, wherein the socket comprises:
a housing comprising a protrusion that extends into a hole in the board; and
interconnect pins through the housing;

a retention cover over the socket, wherein the retention cover compresses a bottom end of the interconnect pins between the board and the retention cover;
a handle plate over the retention cover, wherein the handle plate comprises latch point protrusions;
a plurality of helical springs between the handle plate and the retention cover; and
a socket loading frame, wherein the socket loading frame comprises a plurality of flanges, and wherein the latch point protrusions lock against the flanges.

Assignees

• Intel Corp

Inventors

• Boyd Thomas
• Cheng Feifei
• Buddrius Eric W
• Prabhugoud Mohanraj

Classifications

• H05K7/1069

  with spring contact pieces · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• H01R12/88

  acting manually by rotating or pivoting connector housing parts · CPC title

• H01R12/714

  with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit · CPC title

• H01R12/7005

  Guiding, mounting, polarizing or locking means; Extractors (for printed circuit boards H05K) · CPC title