Electrostatic chuck device

US12176237B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12176237-B2
Application numberUS-202117799956-A
CountryUS
Kind codeB2
Filing dateFeb 10, 2021
Priority dateFeb 21, 2020
Publication dateDec 24, 2024
Grant dateDec 24, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at least an internal electrode, and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. The electrostatic chuck device is such that the substrate has a through-hole provided so as to pass through in the thickness direction, a sleeve formed from an insulating material is inserted into the through-hole, and the sleeve is joined to the through-hole via a joining means at an upper portion of the substrate in the thickness direction.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electrostatic chuck device comprising: a substrate comprising: a through-hole provided so as to pass through in a thickness direction of the substrate, the through-hole having a concave portion provided on an inner wall of the hole within 50% of the thickness of the substrate from a surface of the substrate, adhesive within the concave portion of the through-hole, and having a total length amount to 5% to 30% of the thickness of the substrate, and a sleeve, formed from an insulating material, inserted into the through-hole and joined to the through-hole via the adhesive; a laminated body that is laminated on the substrate and that includes at least an internal electrode; and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. 2. The electrostatic chuck device according to claim 1 , wherein the ceramic layer comprises a base layer and a surface layer formed on the upper surface of the base layer and having irregularities. 3. The electrostatic chuck device according to claim 2 , wherein the laminated body comprises at least an insulating organic film provided on both sides of the internal electrode in the thickness direction. 4. The electrostatic chuck device according to claim 1 , wherein the laminated body comprises at least an insulating organic film provided on both sides of the internal electrode in the thickness direction.

Assignees

Inventors

Classifications

  • H10P72/722Primary

    Details of electrostatic chucks · CPC title

  • H10P72/72Primary

    using electrostatic chucks · CPC title

  • characterised by a coating, a hardness or a material · CPC title

  • Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US12176237B2 cover?
An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at l…
Who is the assignee on this patent?
Tomoegawa Co Ltd, Tomoegawa Corp
What technology area does this patent fall under?
Primary CPC classification H10P72/722. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 24 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).