Tantalum capacitor having lead frame including plural electrode portions inclined in different directions

Patent metadata

Field	Value
Publication number	US-12176155-B2
Application number	US-202217877243-A
Country	US
Kind code	B2
Filing date	Jul 29, 2022
Priority date	Mar 11, 2022
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

A tantalum capacitor includes a tantalum body having one surface which a tantalum wire extends from, a molded portion including first and second surfaces facing each other in a first direction and third and fourth surfaces facing each other in a second direction, and surrounding the tantalum body, a first lead frame including a first electrode portion in contact with the second surface of the molded portion, a second electrode portion connected to the first electrode portion, a third electrode portion connected to the second electrode portion, and a fourth electrode portion connected to the third electrode portion and the tantalum wire, and a second lead frame disposed to be in contact with the second surface of the molded portion and spaced apart from the first lead frame. The second electrode portion and the third electrode portion are inclined in different directions with respect to the second surface.

First claim

What is claimed is:

1. A tantalum capacitor comprising:
a tantalum body having one surface which a tantalum wire extends from;
a molded portion including first and second surfaces facing each other in a first direction and third and fourth surfaces facing each other in a second direction, and surrounding the tantalum body;
a first lead frame including a first electrode portion in contact with the second surface of the molded portion, a second electrode portion connected to the first electrode portion, a third electrode portion connected to the second electrode portion, and a fourth electrode portion connected to the third electrode portion and the tantalum wire; and
a second lead frame disposed to be in contact with the second surface of the molded portion and spaced apart from the first lead frame,
wherein the second electrode portion and the third electrode portion are inclined in different directions with respect to the second surface of the molded portion,
wherein the second electrode portion is inclined toward the first surface of the molded portion from the first electrode portion,
wherein the third electrode portion is inclined toward the second surface of the molded portion from the second electrode portion, and
wherein the fourth electrode portion is inclined toward the first surface of the molded portion from the third electrode portion so as to be connected to a lower surface of the tantalum wire.

2. The tantalum capacitor of claim 1 , wherein the fourth electrode portion is substantially vertically connected to the tantalum wire.

3. The tantalum capacitor of claim 1 , wherein at least a portion of the first electrode portion protrudes from the third surface of the molded portion, and at least a portion of the second lead frame protrudes from the fourth surface of the molded portion.

4. The tantalum capacitor of claim 1 , wherein the fourth electrode portion is spaced apart from the first electrode portion.

5. The tantalum capacitor of claim 1 , wherein an inclination angle between the first electrode portion and the second electrode portion is 10° to 90°.

6. The tantalum capacitor of claim 1 , wherein one end portion of the fourth electrode portion includes a recess, and at least a portion of the tantalum wire is disposed in the recess of the fourth electrode portion.

7. The tantalum capacitor of claim 1 , wherein
the first lead frame includes a support portion disposed at an end of the fourth electrode portion, and
the support portion is in contact with and connected to a lower surface of the tantalum wire.

8. The tantalum capacitor of claim 7 , wherein the support portion is vertically bent from the end of the fourth electrode portion.

9. A tantalum capacitor comprising:
a tantalum body having one surface which a tantalum wire extends from;
a molded portion including first and second surfaces facing each other in a first direction and third and fourth surfaces facing each other in a second direction, and surrounding the tantalum body;
a first lead frame disposed to be in contact with the second surface of the molded portion and connected to the tantalum wire; and
a second lead frame disposed to be in contact with the second surface of the molded portion and spaced apart from the first lead frame,
wherein the first lead frame includes a first bent portion bent to be inclined toward the first surface of the molded portion from the second surface of the molded portion, a second bent portion disposed to be closer to the third surface of the molded portion than the first bent portion and bent to be inclined toward the second surface of the molded portion, and a third bent portion disposed to be closer to the third surface of the molded portion than the second bent portion and bent toward the tantalum wire so as to be connected to a lower surface of the tantalum wire.

10. The tantalum capacitor of claim 9 , wherein the first lead frame is substantially vertically connected to the tantalum wire.

11. The tantalum capacitor of claim 9 , wherein the first bent portion of the first lead frame has an acute or right angle.

12. The tantalum capacitor of claim 9 , wherein the third bent portion of the first lead frame has an acute angle.

13. A tantalum capacitor comprising:
a tantalum body having one surface which a tantalum wire extends from in an extending direction;
a molded portion including first and second surfaces facing each other in a first direction and third and fourth surfaces facing each other in a second direction, and surrounding the tantalum body;
a first lead frame including a first electrode portion in contact with the second surface of the molded portion, a fourth electrode portion connected to the tantalum wire, and a plurality of electrode portions having a zigzag shape connected between the first electrode portion and the fourth electrode portion; and
a second lead frame disposed to be in contact with the second surface of the molded portion and spaced apart from the first lead frame,
wherein the first electrode portion extends from one end of the first electrode portion connected to the plurality of electrode portions to another end of the first electrode portion in the extending direction.

14. The tantalum capacitor of claim 13 , wherein the fourth electrode portion is substantially vertically connected to the tantalum wire.

15. The tantalum capacitor of claim 13 , wherein at least a portion of the first electrode portion protrudes from the third surface of the molded portion, and at least a portion of the second lead frame protrudes from the fourth surface of the molded portion.

16. The tantalum capacitor of claim 13 , wherein the fourth electrode portion is spaced apart from the first electrode portion.

17. The tantalum capacitor of claim 13 , wherein one end portion of the fourth electrode portion includes a recess, and at least a portion of the tantalum wire is disposed in the recess of the fourth electrode portion.

18. The tantalum capacitor of claim 13 , wherein the first lead frame includes a support portion disposed at an end of the fourth electrode portion, and
the support portion is connected to a lower surface of the tantalum wire.

19. The tantalum capacitor of claim 18 , wherein the support portion is bent from the fourth electrode portion.

Assignees

• Samsung Electro Mech

Inventors

• Jung Hun Chol

Classifications

• H01G9/15

  Solid electrolytic capacitors (H01G11/00 takes precedence) · CPC title

• H01G9/042

  characterised by the material (H01G11/22 takes precedence) · CPC title

• H01G9/10

  Sealing, e.g. of lead-in wires · CPC title

• H01G2009/05

  consisting of tantalum, niobium, or sintered material; Combinations of such electrodes with solid semiconductive electrolytes, e.g. manganese dioxide · CPC title

• H01G9/048

  characterised by their structure (H01G11/22 takes precedence) · CPC title