Curable silicone composition, cured product thereof, and method for producing same

Patent metadata

Field	Value
Publication number	US-12173202-B2
Application number	US-201917418382-A
Country	US
Kind code	B2
Filing date	Dec 27, 2019
Priority date	Dec 27, 2018
Publication date	Dec 24, 2024
Grant date	Dec 24, 2024

Abstract

Provided is a curable silicone composition and applications thereof. The composition has hot-melt properties as a whole, superior workability and curing characteristics such as overmolding, as well as superior flexibility and stress relief properties of a cured product thereof, even when a relatively large amount of filler is blended. Also provided is a cured product with a relatively small coefficient of thermal expansion. A curable silicone composition, comprising: an organopolysiloxane resin where 20 mol % or more of the total siloxane units of the organopolysiloxane resin is siloxane units represented by SiO 4/2 ; and one or more functional fillers. A vinyl (CH 2 ═CH—) group content of curing reactive functional groups containing carbon-carbon double bonds is 0.05 to 1.50 mol % per 100 g of silicone component(s) in the composition.

First claim

The invention claimed is:

1. A curable granular silicone composition that has hot-melt properties as a whole, comprising:
(A) 100 mass parts of an organopolysiloxane resin A particulate having no hot-melt properties as a whole molecule, having at least one curing reactive functional group containing a carbon-carbon double bond, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin A particulate is siloxane units represented by SiO 4/2 ;
(B) 350 to 600 mass parts of an organopolysiloxane resin B particulate having no hot-melt properties as a whole molecule, not having a curing reactive functional group containing a carbon-carbon double bond, and where 20 mol % or more of the total siloxane units of the organopolysiloxane resin B particulate is siloxane units represented by SiO 4/2 ;
(C) 65 to 200 mass parts of a straight- or branched-chain organopolysiloxane, liquid at 25° C., having at least two curing reactive functional groups containing a carbon-carbon double bond;
(D) one or more curing agents selected from (d1) or (d2) below, in an amount necessary to cure the composition:
(d1) an organic peroxide,
(d2) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms and a hydrosilylation reaction catalyst; and

(E) a functional filler, where the amount of component (E) is in the range of 10 to 1,000 mass parts relative to 100 mass parts of the sum of the components (A) to (C);
wherein a vinyl (CH 2 ═CH—) group content of curing reactive functional groups containing carbon-carbon double bonds is 0.05 to 1.50 mol % per 100 g of silicone component(s) in the composition; and
wherein component (A) and component (B) are spherical organopolysiloxane resin microparticles having an average primary particle diameter of 1 to 20 μm.

2. The curable granular silicone composition according to claim 1 ,
where the amount of component (E) is in the range of 10 to 750 mass parts relative to 100 mass parts of the sum of the components (A) to (C).

3. The curable granular silicone composition according to claim 1 , wherein:
component (A) is a non-hot-meltable organopolysiloxane resin represented by the following average unit formula (A1):
(R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 1 SiO 3/2 ) c (SiO 4/2 ) d (R 2 O 1/2 ) e

where each R 1 is independently a monovalent hydrocarbon group having 1 to 10 carbon atoms, provided that 1 to 12 mol % of all R 1 in formula (A1) is an alkenyl group; each R 2 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and a, b, c, d, and e are numbers satisfying the following: 0.10≤a≤≤0.60, 0≤b≤0.70, 0≤c≤0.80, 0.20≤d≤0.65, 0≤e≤0.05, and (a+b+c+d)=1;
component (B) is a non-hot-meltable organopolysiloxane resin represented by the following average unit formula (B1):
(R 3 3 SiO 1/2 ) f (R 3 2 SiO 2/2 ) g (R 3 SiO 3/2 ) h (SiO 4/2 ) i (R 2 O 1/2 ) j

where each R 3 is independently a monovalent hydrocarbon group having 1 to 10 carbon atoms and not containing a carbon-carbon double bond; R 2 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and f, g, h, i, and j are numbers satisfying the following: 0.35≤f≤0.55, 0≤g≤0.20, 0≤h≤0.20, 0.45≤i≤0.65, 0≤j≤0.05, and(f+g+h+i)=1;
component (C) is a straight-chain organopolysiloxane represented by the following structural formula (C1):
R 4 3 SiO(SiR 4 2 O) k SiR 4 3

where each R 4 is independently a monovalent hydrocarbon group having 1 to 10 carbon atoms, provided that at least two of the R 4 in formula (C1) are alkenyl groups, and k is a number from 20 to 5,000; and
component (E) is one or more types selected from the group consisting of a reinforcing filler, a white pigment, a thermally conductive filler, an electrically conductive filler, and an organic filler.

4. The curable granular silicone composition according to claim 1 , wherein component (D) comprises:
(d2-1) the organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms and (d2-2) the hydrosilylation reaction catalyst, where
the content of the (d2-1) organohydrogenpolysiloxane is an amount where the molar ratio of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane relative to the curing reactive functional groups containing the carbon-carbon double bonds in component (A) and component (C) is in the range of 0.5 to 20.

5. The curable granular silicone composition according to claim 1 , wherein component (E) is a functional filler containing one or more types selected from the group consisting of a reinforcing filler, a white pigment, a thermally conductive filler, an electrically conductive filler, and an organic filler.

6. The curable granular silicone composition according to claim 1 , further comprising:
(F) hot-melt particles with a drip point of 50° C. or more and a melt viscosity of 10 Pa·s or less as measured by a rotational viscometer at 150° C.

7. The curable granular silicone composition according to claim 6 , wherein component (F) is a hot-melt particle comprising a fatty acid metal salt.

8. A method for manufacturing the curable granular silicone composition according to claim 1 , wherein each component that makes up the curable granular silicone composition is granulated by mixing under temperature conditions not exceeding 50° C.

9. A method of molding a cured product, comprising the following steps:
(I) heating and melting the curable granular silicone composition according to claim 1 at a temperature of 50° C. or higher to form a curable silicone composition;
(II) injecting the curable silicone composition in a liquid state obtained in step (I) into a mold or distributing the curable silicone composition obtained in step (I) to a mold by clamping; and
(III) curing the curable silicone composition injected or distributed in step (II).

10. The curable granular silicone composition according to claim 1 , wherein component (D) comprises component (d2).

Assignees

• Dow Toray Co Ltd

Inventors

• Yamazaki Ryosuke

Classifications

• H10W74/476

  Organic materials comprising silicon · CPC title

• H10W74/016

  using moulds · CPC title

• H10W42/121

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W74/473 Primary

  containing a filler · CPC title

• H10H20/854

  characterised by their material, e.g. epoxy or silicone resins · CPC title