Bonded body and acoustic wave element

US12166465B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12166465-B2
Application numberUS-202217579678-A
CountryUS
Kind codeB2
Filing dateJan 20, 2022
Priority dateJul 22, 2019
Publication dateDec 10, 2024
Grant dateDec 10, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A bonded body includes a supporting substrate, piezoelectric material substrate and a multilayer film between the supporting substrate and piezoelectric material substrate. The multilayer film includes a lamination structure having a first layer, second layer, third layer and fourth layer in that order. The first layer and third layer are composed of silicon oxides, and the second layer and fourth layer are composed of metal oxides. The refractive index of the second layer is higher than the refractive index of the first layer and refractive index of the third layer. The refractive index of the second layer is different from the refractive index of the fourth layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A bonded body comprising: a supporting substrate; a piezoelectric material substrate; and a multilayer film between said supporting substrate and said piezoelectric material substrate, wherein said multilayer film comprises a lamination structure comprising a first layer, a second layer in contact with the first layer, a third layer in contact with the second layer, and a fourth layer in contact with the third layer; wherein said first layer and said third layer comprise silicon oxides, respectively; wherein said second layer and said fourth layer comprise metal oxides, respectively; wherein a refractive index of said second layer is higher than a refractive index of said first layer and a refractive index of said third layer; and wherein said refractive index of said second layer is different from a refractive index of said fourth layer. 2. The bonded body of claim 1 , wherein said multilayer film comprises a plurality of said lamination structures. 3. The bonded body of claim 1 , wherein said metal oxides comprise hafnium oxide, tantalum oxide or zirconium oxide. 4. The bonded body of claim 1 , wherein a difference of said refractive index of said second layer and said refractive index of said first layer is 0.3 to 0.8. 5. The bonded body of claim 1 , wherein a difference of said refractive index of said second layer and said refractive index of said fourth layer is 0.02 or larger. 6. The bonded body of claim 1 , wherein each of a thickness of said first layer, a thickness of said second layer, a thickness of said third layer and a thickness of said fourth layer is 20 nm or larger and 300 nm or smaller. 7. The bonded body of claim 1 , further comprising a bonding layer having a composition of Si (1-v) O v (0.008≤v≤0.408) between said piezoelectric material substrate and said supporting substrate. 8. An acoustic wave device comprising: the bonded body of claim 1 ; and an electrode provided on said piezoelectric material substrate. 9. The acoustic wave device of claim 8 used for an acoustic wave of a frequency of 3.5 to 6 GHZ. 10. A bonded body comprising: a supporting substrate; a piezoelectric material substrate; and a multilayer film between said supporting substrate and said piezoelectric material substrate, wherein said multilayer film comprises a plurality of lamination structures, each lamination structure comprising a first layer, a second layer, a third layer and a fourth layer in the order; wherein said first layer and said third layer comprise silicon oxides, respectively; wherein said second layer and said fourth layer comprise metal oxides, respectively; wherein a refractive index of said second layer is higher than a refractive index of said first layer and a refractive index of said third layer; and wherein said refractive index of said second layer is different from a refractive index of said fourth layer. 11. A bonded body comprising: a supporting substrate; a piezoelectric material substrate; and a multilayer film between said supporting substrate and said piezoelectric material substrate, wherein said multilayer film comprises a lamination structure comprising a first layer, a second layer, a third layer and a fourth layer in the order; wherein said first layer and said third layer comprise silicon oxides, respectively; wherein said second layer and said fourth layer comprise metal oxides, respectively; wherein a refractive index of said second layer is higher than a refractive index of said first layer and a refractive index of said third layer; wherein said refractive index of said second layer is different from a refractive index of said fourth layer; and wherein each of a thickness of said first layer, a thickness of said second layer, a thickness of said third layer and a thickness of said fourth layer is 20 nm or larger and 300 nm or smaller.

Assignees

Inventors

Classifications

  • by laminating or bonding of piezoelectric or electrostrictive bodies · CPC title

  • for obtaining desired frequency or temperature coefficient · CPC title

  • Ceramic compositions · CPC title

  • of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate · CPC title

  • for the manufacture of resonators or networks using surface acoustic waves · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US12166465B2 cover?
A bonded body includes a supporting substrate, piezoelectric material substrate and a multilayer film between the supporting substrate and piezoelectric material substrate. The multilayer film includes a lamination structure having a first layer, second layer, third layer and fourth layer in that order. The first layer and third layer are composed of silicon oxides, and the second layer and fou…
Who is the assignee on this patent?
Ngk Insulators Ltd
What technology area does this patent fall under?
Primary CPC classification H03H9/02574. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).