Antenna modules in phased array antennas

Patent metadata

Field	Value
Publication number	US-12166282-B2
Application number	US-202318216415-A
Country	US
Kind code	B2
Filing date	Jun 29, 2023
Priority date	May 9, 2019
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

An apparatus includes a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver, a transmitter, or a transceiver. The first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB. The apparatus includes an antenna having a first side and a second side opposite the first side. The second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

First claim

The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows:

1. An apparatus comprising:
a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver, a transmitter, or a transceiver and wherein the first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB; and
an antenna having a first side and a second side opposite the first side, wherein second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.

2. The apparatus of claim 1 , wherein the second side of the antenna is configured to be spaced from the PCB by a second distance greater than the first distance.

3. The apparatus of claim 1 , wherein the first distance is equal to a height of a cavity defined by a subset of the plurality of conductive structures when the plurality of conductive structures is physically and electrically coupled with the PCB.

4. The apparatus of claim 3 , further comprising an amplifier electrically coupled with the antenna and wherein the amplifier is located within the cavity.

5. The apparatus of claim 4 , further comprising one of a filter, a phase shifter, a digital beamformer, a switch to select between transmitter or receiver operation, an up converter, a down converter, a mixer, an analog-to-digital converter (ADC), or a digital-to-analog converter (DAC) located within the cavity.

6. The apparatus of claim 3 , further comprising an amplifier and a filter located within the cavity, and wherein the amplifier electrically couples with the antenna and the filter electrically couples with the amplifier and the PCB.

7. The apparatus of claim 1 , further comprising first and second active electrical components spaced at the first distance from the PCB when the plurality of conductive structures is physically coupled with the PCB.

8. The apparatus of claim 7 , further comprising one or more layers disposed between the antenna and the plurality of conductive structures, the one or more layers including one or both of a conductive trace or a conductive via to route radio frequency (RF) signals between the antenna and the PCB when the plurality of conductive structures is physically coupled with the PCB, and wherein a particular conductive structure of the plurality of conductive structures routes the RF signals to or from the PCB.

9. The apparatus of claim 8 , wherein the first active electrical component comprises an amplifier electrically coupled with the antenna and the second active electrical component comprises a filter electrically coupled between the first active electrical component and the particular conductive structure.

10. The apparatus of claim 1 , wherein a conductive structure of the plurality of conductive structures has a spherical shape, has a columnar shape, or is a solder ball.

11. The apparatus of claim 1 , further comprising an amplifier electrically coupled with the antenna and spaced at the first distance from the PCB, and wherein a signal pathway length between the antenna and the amplifier is 0.5 millimeter (mm) or less, approximately 0.25 mm, less than 2 mm, or less than 5 mm.

12. The apparatus of claim 1 , wherein the apparatus is included in an antenna lattice of a phased array antenna, wherein the PCB is associated with the antenna lattice, and wherein the apparatus is configured to be particularly located on and selectively physically decoupleable from the PCB.

13. The apparatus of claim 1 , further comprising one or more layers disposed between the antenna and the plurality of conductive structures, and wherein the one or more layers comprises laminate or prepreg material having a loss tangent of less than 0.003.

14. An antenna module comprising:
an antenna element having a first side and a second side opposite the first side; and
a plurality of structures configured to be physically and electrically coupleable with a PCB of a receiver, a transmitter, or a transceiver wherein at least a subset of the plurality of structures define a cavity, and wherein a particular structure of the plurality of structures comprises an electrical connection between the PCB and the antenna module when the plurality of structures is physically coupled with the PCB.

15. The antenna module of claim 14 , wherein at least one structure of the plurality of structures is configured to reduce signal leakage between the antenna element and the cavity.

16. The antenna module of claim 14 , wherein the plurality of structures is physically and electrically coupleable or decoupleable from the antenna module.

17. The antenna module of claim 14 , wherein the plurality of structures have first sides and second sides opposite to the first sides, wherein the plurality of structures is spaced a first distance from the PCB when the plurality of structures is physically coupled with the PCB, wherein the second side of the antenna element is spaced a second distance from the PCB when the plurality of structures is physically coupled with the PCB, and wherein the second distance is greater than the first distance.

18. The antenna module of claim 17 , wherein the first distance, a height of the cavity, and a height of the plurality of structures are equal to each other.

19. The antenna module of claim 14 , further comprising one or more layers disposed between the antenna element and the plurality of structures, wherein the one or more layers includes one or both of a conductive trace or a conductive via to route radio frequency (RF) signals between the antenna element and the PCB when the plurality of structures is physically coupled with the PCB.

20. The antenna module of claim 19 , wherein each structure of the plurality of structures is physically and electrically coupled with the one or more layers at a location not occupied by the conductive trace or the conductive via.

21. The antenna module of claim 14 , wherein at least a subset of the plurality of structures is configured to reduce signal leakage or coupling between the antenna element and the cavity.

22. An antenna module included in a phased array antenna, the antenna module comprising:
an antenna element having a radiating side;
a plurality of structures configured to be physically and electrically coupleable with a PCB of a receiver, a transmitter, or a transceiver wherein at least a subset of the plurality of structures define a cavity, wherein a particular structure of the plurality of structures comprises an electrical coupling structure between the PCB and the antenna element, and wherein the plurality of structures is disposed between the antenna element and the PCB; and
a via electrically coupled between the antenna element and the PCB, wherein the via and the particular structure define a signal path between the antenna element and the PCB.

23. The antenna module of claim 22 , further comprising an additional via electrically coupled between the antenna element and the PCB, wherein the additional via is configured to reduce signal leakage between the antenna element and the cavity.

24. The ante

Assignees

• Space Exploration Tech Corp

Inventors

• Rodriguez De Luis Javier
• Apaydin Nil
• Yetisir Ersin
• Mahanfar Alireza
• Ebadi Siamak

Classifications

• H01Q21/0025

  Modular arrays · CPC title

• H01Q3/26

  varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture ({H01Q3/12,} H01Q3/22, H01Q3/24 take precedence) · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q5/25

  Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems · CPC title

• H01Q9/285

  Planar dipole (H01Q9/065 takes precedence; patch antenna H01Q9/0407) · CPC title