Antenna and electronic device including same

Patent metadata

Field	Value
Publication number	US-12166269-B2
Application number	US-202217648217-A
Country	US
Kind code	B2
Filing date	Jan 18, 2022
Priority date	Feb 18, 2021
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

Various embodiments of the disclosure relate to an electronic device including an antenna. The electronic device may include: a housing; a main board disposed in an internal space of the housing and including a first surface oriented in a first direction, a second surface facing a direction opposite the first direction, and a through hole; and an antenna module disposed on the main board. The antenna module may include: a board at least partially disposed in the through hole and including a plurality of antenna elements; and a wireless communication circuit configured to transmit and/or receive a wireless signal in a predetermined frequency band via the plurality of antenna elements, the wireless communication circuit disposed on the second surface of the main board.

First claim

What is claimed is:

1. An electronic device comprising:
a first board comprising one or more through holes and/or cut-out portions;
an antenna module comprising one or more antenna elements; and
a wireless communication circuit configured to transmit and/or receive a wireless signal via the one or more antenna elements,
wherein at least a part of the antenna module is at least partially disposed in the one or more through holes and/or cut-out portions.

2. The electronic device of claim 1 , further comprising a housing, wherein the first board is disposed in an internal space of the housing.

3. The electronic device of claim 1 , wherein the first board is a main board.

4. The electronic device of claim 1 , wherein the first board comprises a first surface and a second surface facing in an opposite direction to the first surface,
wherein the antenna module further comprises a second board including the one or more antenna elements,
wherein at least a part of the second board is at least partially disposed in the one or more through holes and/or cut-out portions, a third surface of the second board protruding from the first surface of the first board, and
wherein the wireless communication circuit is disposed on the second surface of the first board.

5. The electronic device of claim 4 , wherein the wireless communication circuit is disposed to at least partially overlap the first board when the first surface of the first board is viewed from above.

6. The electronic device of claim 4 , wherein the second board and the wireless communication circuit are electrically and/or physically coupled to each other through a conductive bond.

7. The electronic device of claim 4 , wherein the wireless communication circuit is connected to the first board, and
wherein the second board is connected to the wireless communication circuit.

8. The electronic device of claim 4 , further comprising:
at least one matching circuit disposed between the second board and the wireless communication circuit and electrically connected to the one or more antenna elements.

9. The electronic device of claim 8 , wherein the matching circuit comprises one or more conductive patterns disposed on the second board and/or the wireless communication circuit.

10. The electronic device of claim 9 , wherein the one or more conductive patterns disposed on the second board and/or the wireless communication circuit are disposed to not overlap each other when the first surface of the first board is viewed from above.

11. The electronic device of claim 4 , wherein the second board comprises a material having a dielectric constant lower than a dielectric constant of the first board.

12. The electronic device of claim 4 , wherein the second board comprises a material having a dielectric constant lower than a dielectric constant of the first board and the wireless communication circuit is disposed between the second board and the third board and electrically connected to the one or more other antenna elements via the interposer and the third board.

13. The electronic device of claim 1 , wherein the first board comprises at least one circuit, and
wherein the wireless communication circuit is electrically connected to the at least one circuit via the first board.

14. The electronic device of claim 13 , wherein the at least one circuit comprises a communication processor and/or a power management circuit.

15. The electronic device of claim 1 , further comprising:
an interposer disposed between the first board and the wireless communication circuit, and
wherein the wireless communication circuit is electrically connected to the first board via the interposer.

16. The electronic device of claim 1 , wherein the antenna module further comprises:
a third board comprising one or more other antenna elements electrically connected to the wireless communication circuit.

17. The electronic device of claim 16 , further comprising an interposer disposed between the wireless communication circuit and the third board.

18. The electronic device of claim 16 , wherein the other antenna elements are disposed at a predetermined interval.

19. The electronic device of claim 1 , wherein the first board comprising a first surface and a second surface facing in an opposite direction to the first surface,
wherein the antenna module further comprises a second board including the one or more antenna elements,
wherein the second board is disposed in the one or more through holes and/or cut-out portions, a third surface of the second board being disposed so as to be coplanar with the first surface of the first board, and
wherein the wireless communication circuit is disposed on the second surface of the first board.

20. The electronic device of claim 1 , wherein the first board comprising a first surface and a second surface facing in an opposite direction to the first surface,
wherein the antenna module further comprises a second board including the one or more antenna elements,
wherein the second board is disposed in the one or more through holes and/or cut-out portions, a third surface of the second board being disposed so as to be lower than the first surface of the first board, and
wherein the wireless communication circuit is disposed on the second surface of the first board.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Cho Namjun
• Son Junghwan
• Na Hyoseok
• Kim Youngju

Classifications

• H01Q13/02

  Waveguide horns · CPC title

• H01Q21/06

  Arrays of individually energised antenna units similarly polarised and spaced apart · CPC title

• H01Q1/24

  with receiving set · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q9/045

  with particular feeding means (for circular polarisation H01Q9/0428) · CPC title