Process for manufacturing a leaf spring and insert for leaf spring

US12163565B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12163565-B2
Application numberUS-202017424112-A
CountryUS
Kind codeB2
Filing dateJan 17, 2020
Priority dateJan 17, 2019
Publication dateDec 10, 2024
Grant dateDec 10, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An insert to a mold for a leaf spring comprises a substrate and a hole that extends through the substrate, A post protrudes from the substrate such that the insert, may be coupled to the mold. Further, the post covers the hole on a first end, so the hole is not exposed. On the other end of the hole, a thin overlay that covers the hole. Thus, during a process where resin is added to the mold, no resin enters the hole. The insert, when added to a leaf spring, offers reinforcement on areas where there is high stress. Therefore, holes may be added to a leaf spring at areas of high stress without overly weakening the leaf spring.

First claim

Opening claim text (preview).

What is claimed is: 1. A process for creating a leaf spring, the process comprising: coupling an insert into a mold base, wherein the insert comprises: a substrate; a hole within the substrate, wherein the hole extends through the substrate; a post that protrudes from the substrate to allow the insert to be coupled to the mold, wherein the post covers the hole on a first end, so the hole is not exposed; a thin overlay that covers the hole on a second end opposite of the first end; adding fiberglass and resin to the mold; curing the resin to form a leaf spring; adhering the insert to the leaf spring; removing the leaf spring from the mold; and detaching the thin overlay and the post from the insert, while leaving the insert in the leaf spring. 2. The process of claim 1 , wherein the insert tapers at opposite ends. 3. The process of claim 2 , wherein the insert tapers to a point at both of the opposite ends. 4. The process of claim 1 , wherein the insert includes rounded edges between opposite ends. 5. The process of claim 1 , wherein the insert includes a second hole in the substrate. 6. The process of claim 5 , wherein the insert includes a third hole in the substrate. 7. An insert to a mold for leaf spring, wherein the insert becomes part of the leaf spring forming an assembly, wherein the assembly comprises: a substrate; a hole within the substrate, wherein the hole extends through the substrate; a post that protrudes from the substrate to allow the insert to be coupled to the mold, wherein the post covers the hole on a first end, so the hole is not exposed and a thin overlay covers the hole on a second end opposite of the first end, and wherein the insert is embedded in the leaf spring. 8. The insert of claim 7 , wherein the insert tapers at opposite ends. 9. The insert of claim 8 , wherein the insert tapers to a point at both of the opposite ends. 10. The insert of claim 7 further including rounded edges between opposite ends. 11. The insert of claim 7 further including a second hole in the substrate. 12. The insert of claim 11 further including a third hole in the substrate.

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What does patent US12163565B2 cover?
An insert to a mold for a leaf spring comprises a substrate and a hole that extends through the substrate, A post protrudes from the substrate such that the insert, may be coupled to the mold. Further, the post covers the hole on a first end, so the hole is not exposed. On the other end of the hole, a thin overlay that covers the hole. Thus, during a process where resin is added to the mold, no…
Who is the assignee on this patent?
Hendrickson Usa Llc
What technology area does this patent fall under?
Primary CPC classification F16F1/368. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Dec 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).