Print head and method of manufacturing print head

US12162282B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12162282-B2
Application numberUS-202217818403-A
CountryUS
Kind codeB2
Filing dateAug 9, 2022
Priority dateAug 26, 2021
Publication dateDec 10, 2024
Grant dateDec 10, 2024

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Breakage of components is suppressed at the time of bonding. A print head with a metal film formed on laminated layers includes an electric wiring layer electrical connection with a metal film, a protective film covering and protecting the electric wiring layer, a groove separating the protective film and the electric wiring layer around the metal film, and a resin film applied to the groove.

First claim

Opening claim text (preview).

What is claimed is: 1. A print head with a metal film formed on laminated layers, the print head comprising: an electric wiring layer formed below the metal film and electrically connected to the metal film; a protective film covering and protecting the electric wiring layer; a groove separating the protective film and the electric wiring layer around the metal film; and a resin film applied to the groove. 2. The print head according to claim 1 , wherein the resin film is formed on a surface of the protective film. 3. The print head according to claim 1 , wherein the resin film comprises at least one selected from the group consisting of polyether amide resin, acrylic resin, cyclized rubber, and epoxy resin. 4. The print head according to claim 1 , further comprising a lead joined to the metal film. 5. The print head according to claim 1 , wherein the groove is formed by photolithography. 6. The print head according to claim 1 , wherein the groove is filled with the resin film, and a second resin film obtained by curing the resin film is formed on the protective film. 7. The print head according to claim 1 , wherein a shape of the metal film is substantially rectangular in a plan view, and the groove is formed so as not to entirely surround a periphery of the metal film. 8. The print head according to claim 7 , wherein the groove is continuously formed outside both of long edges of the metal film. 9. The print head according to claim 7 , wherein the groove is intermittently formed outside both of long edges of the metal film. 10. The print head according to claim 7 , wherein the groove is formed outside either one of short edges of the metal film.

Assignees

Inventors

Classifications

  • thin film formation · CPC title

  • Production of bubble jet print heads (B41J2/1606, B41J2/162 take precedence) · CPC title

  • etching · CPC title

  • thin film formation by spincoating · CPC title

  • photolithography · CPC title

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Frequently asked questions

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What does patent US12162282B2 cover?
Breakage of components is suppressed at the time of bonding. A print head with a metal film formed on laminated layers includes an electric wiring layer electrical connection with a metal film, a protective film covering and protecting the electric wiring layer, a groove separating the protective film and the electric wiring layer around the metal film, and a resin film applied to the groove.
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B41J2/14072. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).