Electric heated base for container blow-molding device

Patent metadata

Field	Value
Publication number	US-12162204-B2
Application number	US-202017603223-A
Country	US
Kind code	B2
Filing date	Apr 14, 2020
Priority date	Apr 15, 2019
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

A device for blow molding a container from a preform. The device includes a mold base and a pedestal for supporting the mold base. An electric heating element is beneath the mold base for heating the mold base. An insulator is between the heating element and the pedestal.

First claim

What is claimed is:

1. A device for blow molding a container from a preform, the device comprising:
a mold base including an inner portion and an outer portion, the mold base configured to form only a base of the container from an outer standing ring of the base inward to a center of the base, the mold base confined to an area at and inward of the standing ring of the base, the mold base movable between a retracted position and an extended position during blow molding;
a pedestal for supporting the mold base;
a case on which the mold base is seated, the case and the mold base have a common outer diameter such that the mold base does not extend outward beyond the case;
at least one electric heating element for heating the mold base including an inner electric heating element configured to heat the inner portion of the mold base and an outer electric heating element configured to heat the outer portion of the mold base, both the inner electric heating element and the outer electric heating element are within the case on which the mold base is seated; and
a first insulator for isolating the heating element;
wherein the inner electric heating element and the outer electric heating element are configured to be heated at different temperatures.

2. The device of claim 1 , wherein the at least one heating element is configured to consume about 60 W at steady state to maintain 80 C.

3. The device of claim 1 , wherein the at least one heating element is configured to consume about 110 W at steady state to maintain 160 C.

4. The device of claim 1 , wherein the pedestal is configured to be water-cooled.

5. The device of claim 1 , further comprising a control module configured to:
receive an input from a temperature sensor indicating a temperature of the mold base;
receive a temperature set point indicating a target temperature of the mold base; and
operate the at least one electric heating element to heat the mold base to bring the temperature of the mold base to the target temperature.

6. The device of claim 1 , wherein the first insulator has a thickness of 0.005″ to 0.050″.

7. The device of claim 1 , wherein the first insulator has a thickness of about 0.020″.

8. The device of claim 1 , wherein the at least one electric heating element is cast within the case.

9. The device of claim 1 , wherein the at least one electric heating element is between the first insulator and the mold base.

10. The device of claim 1 , wherein the first insulator is an air gap.

11. The device of claim 1 , wherein the first insulator is located below the at least one electric heating element.

12. The device of claim 1 , wherein the mold base and the pedestal define an opening to accommodate a stretch rod of the device.

13. The device of claim 1 , wherein the pedestal actuates the mold base, the at least one electric heating element, and the first insulator along a longitudinal axis of the device.

14. The device of claim 1 , further comprising a second insulator between the inner electric heating element and the outer electric heating element.

15. The device of claim 14 , wherein the second insulator has a thickness of 0.005″ to 0.050″.

16. The device of claim 14 , wherein the second insulator has a thickness of about 0.020″.

17. The device of claim 1 , further comprising a temperature sensor configured to measure temperature of the mold base.

18. The device of claim 17 , wherein the temperature sensor is at an outer mold surface of the mold base.

19. The device of claim 17 , wherein the temperature sensor is beneath an outer mold surface of the mold base.

20. The device of claim 17 , wherein the temperature sensor is about 0.5 mm below an outer mold surface of the mold base.

21. The device of claim 17 , wherein the temperature sensor is seated in a well defined by the mold base.

22. The device of claim 17 , wherein the temperature sensor is a thermocouple.

23. The device of claim 17 , wherein the temperature sensor is integrated with the at least one electric heating element.

24. The device of claim 1 , further comprising a first temperature sensor configured to measure temperature of the inner portion of the mold base and a second temperature sensor configured to measure temperature of the outer portion of the mold base.

Assignees

• Amcor Rigid Packaging Usa Llc

Inventors

• Wurster Michael
• Lisch G David
• Mast Luke A
• Teitlebaum Aaron
• Steih Richard

Classifications

• B29C49/12

  Stretching rods · CPC title

• B29C2049/4848

  Bottom · CPC title

• B29C2049/4825

  for cooling moulds or mould parts (B29C2049/5889 takes precedence) · CPC title

• B29C49/786 Primary

  Temperature · CPC title

• B29C49/78

  Measuring, controlling or regulating · CPC title