Chamber components with polished internal apertures

US12162115B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12162115-B2
Application numberUS-202318215633-A
CountryUS
Kind codeB2
Filing dateJun 28, 2023
Priority dateJun 27, 2014
Publication dateDec 10, 2024
Grant dateDec 10, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.

First claim

Opening claim text (preview).

What is claimed is: 1. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment, the chamber component comprising: a ceramic article having a plurality of polished apertures therein, wherein a roughness of the plurality of polished apertures is less than 32 μin, wherein at least one aperture of the plurality of polished apertures was polished by flowing an abrasive media through the at least one aperture, wherein the abrasive media comprises a polymer base and a plurality of abrasive particles, and wherein a viscosity of the abrasive media is between about 150,000 cP and about 750,000 cP. 2. The chamber component of claim 1 , wherein at least one of the plurality of polished apertures have a first diameter at a first region and a second diameter at a second region, wherein the second diameter is less than the first diameter. 3. The chamber component of claim 1 , wherein at least one of the plurality of polished apertures comprises at least one bend within the chamber component. 4. The chamber component of claim 1 , wherein at least one of the plurality of polished apertures is substantially non-linear. 5. The chamber component of claim 1 , wherein an opening of at least one of the plurality of polished apertures has a rounded edge. 6. The chamber component of claim 1 , wherein the ceramic article comprises at least one of Al 2 O 3 , AlN, SiO 2 , Y 3 Al 5 O 12 , Y 4 Al 2 O 9 , Y 2 O 3 , Er 2 O 3 , Gd 2 O 3 , Er 3 Al 5 O 12 , Gd 3 Al 5 O 12 , YF 3 , Nd 2 O 3 , Er 4 Al 2 O 9 , ErAlO 3 , Gd 4 Al 2 O 9 , GdAlO 3 , Nd 3 Al 5 O 12 , Nd 4 Al 2 O 9 , NdAlO 3 , or a ceramic compound comprising Y 4 Al 2 O 9 and a solid-solution of Y 2 O 3 —ZrO 2 . 7. The chamber component of claim 1 , wherein the chamber component is a showerhead gas distribution plate or a nozzle. 8. The chamber component of claim 1 , wherein the chamber component is selected from a group consisting of a substrate support assembly, an electrostatic chuck, a gas distribution plate, a nozzle, a showerhead, a flow equalizer, a cooling base, a gas feeder, a liner kit, and a chamber lid. 9. The chamber component of claim 1 , wherein a diameter of at least one of the plurality of polished apertures is between about 0.01 inches and about 0.1 inches. 10. The chamber component of claim 9 , wherein the diameter of the at least one of the plurality of polished apertures is between about 0.05 inches and about 0.1 inches. 11. The chamber component of claim 9 , wherein the diameter of the at least one of the plurality of polished apertures is between about 0.01 inches and about 0.05 inches. 12. The chamber component of claim 1 , wherein the roughness of the plurality of polished apertures is less than 25 μin. 13. The chamber component of claim 1 , wherein at least one of the polished apertures pass through a body of the ceramic article. 14. The chamber component of claim 1 , wherein the ceramic article is coated with a ceramic layer. 15. The chamber component of claim 1 , wherein the ceramic article comprises a material selected from a group consisting of a ceramic material, a metal-ceramic composite material, and a polymer-ceramic composite material. 16. The chamber component of claim 1 , wherein at least one of the plurality of polished apertures comprises a circular shape or a c-slot shape. 17. The chamber component of claim 1 , wherein the ceramic article has a diameter between about 200 millimeters and about 500 millimeters. 18. The chamber component of claim 1 , wherein the ceramic article has a thickness between about 50 millimeters and about 200 millimeters. 19. The chamber component of claim 1 , wherein the ceramic article comprises one or more junctions joining two or more apertures of the plurality of polished apertures. 20. The chamber component of claim 1 , wherein the ceramic article further comprises one or more non-polished apertures.

Assignees

Inventors

Classifications

  • for feeding of solid grinding, polishing or lapping agents · CPC title

  • designed for working internal surfaces of revolution, e.g. of cylindrical or conical shapes · CPC title

  • whereby the workpieces are mounted on a holder and are immersed in the abrasive material · CPC title

  • using plastically deformable grinding compound, moved relatively to the workpiece under the influence of pressure · CPC title

  • Ceramic · CPC title

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What does patent US12162115B2 cover?
Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification B24B31/006. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).