Piezoelectric micromachined transducer and device

US12161507B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12161507-B2
Application numberUS-202318387043-A
CountryUS
Kind codeB2
Filing dateNov 5, 2023
Priority dateDec 13, 2019
Publication dateDec 10, 2024
Grant dateDec 10, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom electrode layer. The top electrode layer is disposed above the piezoelectric layer and comprises a segmented center electrode disposed above a center of the membrane layer and a segmented outer electrode spaced apart from the segmented center electrode. The controller, responsive to the PMUT being placed in a transmit mode, is configured to couple the first and second segments of the bottom electrode layer with ground, couple the first output of the transmitter with the segments of the segmented center electrode, and couple the second output with the segments of the segmented outer electrode.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of manufacturing a piezoelectric micromachined transducer, the method comprising: depositing a bottom electrode layer above a membrane layer; depositing a piezoelectric layer disposed above the bottom electrode layer; depositing a top electrode layer above the piezoelectric layer, the top electrode layer comprising a center electrode disposed above a center of the membrane layer and an outer electrode spaced apart from the center electrode and disposed away from the center of the membrane layer in a ring around the center electrode; and etching through the top electrode layer, the piezoelectric layer, and the bottom electrode layer to create: a first bottom electrode and a second bottom electrode from the bottom electrode layer, wherein the first bottom electrode and the second bottom electrode are substantially equal in surface area; a first piezoelectric portion and a second piezoelectric portion from the piezoelectric layer, the first piezoelectric portion disposed above the first bottom electrode and the second piezoelectric portion disposed above the second bottom electrode; a first outer electrode segment and a second outer electrode segment from the outer electrode, wherein the first outer electrode segment is disposed above the first bottom electrode and the second outer electrode segment is disposed above the second bottom electrode; and a first center electrode segment and a second center electrode segment from the center electrode, wherein the first center electrode segment is disposed above the first bottom electrode and the second center electrode segment is disposed above the second bottom electrode. 2. The method as recited in claim 1 , wherein the depositing the top electrode layer above the piezoelectric layer comprises: depositing the outer electrode and the center electrode such that they are substantially equal in surface area. 3. The method as recited in claim 1 , wherein the etching through the top electrode layer, the piezoelectric layer, and the bottom electrode layer to create the first center electrode segment and the second center electrode segment from the center electrode comprises: creating the first center electrode segment and the second center electrode segment to be substantially equal in surface area to the first outer electrode segment and the second outer electrode segment. 4. The method as recited in claim 1 , wherein the etching through the top electrode layer, the piezoelectric layer, and the bottom electrode layer to create the first piezoelectric portion and the second piezoelectric portion from the piezoelectric layer, the first piezoelectric portion disposed above the first bottom electrode and the second piezoelectric portion disposed above the second bottom electrode comprises: creating the first piezoelectric portion and the second piezoelectric portion to be substantially equal in surface area. 5. The method as recited in claim 1 , wherein the depositing the top electrode layer above the piezoelectric layer, the top electrode layer comprising the center electrode disposed above the center of the membrane layer and the outer electrode spaced apart from the center electrode and disposed away from the center of the membrane layer in the ring around the center electrode further comprises: depositing the center electrode such that it is disposed above a portion of the piezoelectric layer in which a Laplacian of an out-of-plane displacement in the piezoelectric layer has a positive sign in a given displaced shape; and depositing the outer electrode such that it is disposed above a second portion of the piezoelectric layer in which the Laplacian of the out-of-plane displacement in the piezoelectric layer has a negative sign in the same given displaced shape. 6. The method as recited in claim 1 , wherein the depositing the top electrode layer above the piezoelectric layer, the top electrode layer comprising the center electrode disposed above the center of the membrane layer and the outer electrode spaced apart from the center electrode and disposed away from the center of the membrane layer in the ring around the center electrode further comprises: depositing the center electrode such that it is disposed above a portion of the piezoelectric layer in which a sum of the normal components of an in-plane strain in the piezoelectric layer has a positive sign in a given displaced shape; and depositing the outer electrode such that it is disposed above a second portion of the piezoelectric layer in which the sum of the normal components of the in-plane strain in the piezoelectric layer has a negative sign in the same given displaced shape. 7. A method of manufacturing a piezoelectric micromachined transducer, the method comprising: depositing a bottom electrode layer such that it is disposed above and coupled with a membrane layer, wherein the bottom electrode layer comprises a first bottom electrode and a second bottom electrode, and wherein the first bottom electrode and the second bottom electrode are substantially equal in surface area; depositing a piezoelectric layer such that it is disposed above and coupled with the bottom electrode layer, wherein the piezoelectric layer comprises a first piezoelectric portion disposed above the first bottom electrode and a second piezoelectric portion disposed above the second bottom electrode, and wherein the first piezoelectric portion and the second piezoelectric portion are substantially equal in surface area; and depositing a top electrode layer such that it is disposed above and coupled with the piezoelectric layer, wherein: the top electrode layer comprises a segmented center electrode disposed above a center of the membrane layer and a segmented outer electrode which is spaced apart from the segmented center electrode; the segmented outer electrode is disposed away from the center of the membrane layer in a ring around the segmented center electrode; a first segment of the segmented outer electrode and a first segment of the segmented center electrode are disposed above the first bottom electrode; a second segment of the segmented outer electrode and a second segment of the segmented center electrode are disposed above the second bottom electrode; and individual segments of the segmented center electrode and individual segments of the segmented outer electrode are all substantially equal in surface area. 8. The method as recited in claim 7 , wherein the depositing the top electrode layer such that it is disposed above and coupled with the piezoelectric layer further comprises: depositing the segmented center electrode such that it is disposed above a portion of the piezoelectric layer in which a Laplacian of an out-of-plane displacement in the piezoelectric layer has a positive sign in a given displaced shape; and depositing the segmented outer electrode such that it is disposed above a second portion of the piezoelectric layer in which the Laplacian of the out-of-plane displacement in the piezoelectric layer has a negative sign in the same given displaced shape. 9. The method as recited in claim 7 , wherein the depositing the top electrode layer such that it is disposed above and coupled with the piezoelectric layer further comprises: depositing the segmented center electrode such that it is disposed above a portion of the piezoelectric layer in which a sum of the normal components of an in-plane strain in the piezoelectric layer has a positive sign in a given displaced shape; and depositing the segmented outer electrode such that it is disposed above a second portion of the piezoelectric layer in which the sum of the normal components of the in-plane strain in the piezoelectric layer has a ne

Assignees

Inventors

Classifications

  • Electrodes or interconnections, e.g. leads or terminals · CPC title

  • with foil-type piezoelectric elements, e.g. PVDF · CPC title

  • Piezoelectric probes · CPC title

  • Constructional features · CPC title

  • with a plurality of electrodes on both sides · CPC title

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What does patent US12161507B2 cover?
An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom…
Who is the assignee on this patent?
Invensense Inc
What technology area does this patent fall under?
Primary CPC classification A61B8/4483. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Dec 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).