Heatpipe to help reduce radio frequency interference

Patent metadata

Field	Value
Publication number	US-12160216-B2
Application number	US-202017122075-A
Country	US
Kind code	B2
Filing date	Dec 15, 2020
Priority date	Dec 15, 2020
Publication date	Dec 3, 2024
Grant date	Dec 3, 2024

Abstract

Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a heat source on the substrate, and a heat pipe. The heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate. The bumps are configured to help mitigate radio frequency interference in the electronic device. More specifically, the bumps can be configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

First claim

What is claimed is:

1. An electronic device comprising:
a substrate; and
a heat pipe wherein the heat pipe includes a plurality of bumps that extend from the heat pipe towards the substrate but do not come into contact with the substrate, wherein a first subset of the plurality of bumps has a bump to substrate gap and a second subset of the plurality of bumps has a bump to chassis gap and the bump to substrate gap is different than the bump to chassis gap.

2. The electronic device of claim 1 , wherein the plurality of bumps help to mitigate radio frequency interference in the electronic device.

3. The electronic device of claim 1 , wherein the plurality of bumps are configured to provide a resonant frequency in a specific radio frequency band and act as a radio frequency filter.

4. The electronic device of claim 1 , wherein the plurality of bumps are tuned to reduce radio frequency interference that travels along the heat pipe.

5. The electronic device of claim 1 , wherein the plurality of bumps extend from the heat pipe towards a chassis of the electronic device but do not come into contact with the chassis.

6. The electronic device of claim 1 , wherein the plurality of bumps are in two or more rows along the heat pipe.

7. An electronic device comprising:
a chassis;
a substrate;
an antenna, wherein the antenna is sensitive to radio frequency interference;
a heat source on the substrate, wherein the heat source produces radio frequency interference; and
a heat pipe coupled to the heat source, wherein the heat pipe includes a plurality of bumps that extend from the heat pipe towards the chassis but do not come into contact with the chassis, wherein a first portion of the plurality of bumps has a bump to substrate gap and a second portion of the plurality of bumps has a bump to chassis gap and the bump to substrate gap is the same as the bump to chassis gap.

8. The electronic device of claim 7 , wherein the plurality of bumps extend from the heat pipe towards the substrate but do not come into contact with the substrate.

9. The electronic device of claim 7 , wherein the plurality of bumps help to mitigate the radio frequency interference from the heat source.

10. The electronic device of claim 7 , wherein the plurality of bumps are configured as an LC filter.

11. The electronic device of claim 7 , wherein the plurality of bumps are tuned to reduce radio frequency interference that travels along the heat pipe.

12. The electronic device of claim 7 , wherein the first portion of the plurality of bumps has different dimensions than the second portion of the plurality of bumps.

13. The electronic device of claim 7 , wherein the plurality of bumps are in a single row.

14. A method comprising:
determining that a heat pipe is a cause of radio frequency interference;
determining a configuration of bumps along the heat pipe that will mitigate the radio frequency interference; and
creating the heat pipe with a plurality of radio frequency interference reducing bumps to reduce the radio frequency interference from the heat pipe, wherein a first portion of the heat pipe includes a first portion of the plurality of radio frequency interference reducing bumps with a bump to substrate gap and a second portion of the heat pipe includes a second portion of the plurality of radio frequency interference reducing bumps with a bump to chassis gap and the bump to substrate gap is different than the bump to chassis gap.

15. The method of claim 14 , wherein the plurality of bumps are in two or more rows and each row of the plurality of bumps has a different dimension than the other row or rows of the plurality of bumps.

16. The method of claim 14 , wherein the heat pipe is coupled to a heat source that is at least partially a source of the radio frequency interference.

17. The method of claim 14 , wherein the plurality of bumps are configured as an LC filter.

18. The method of claim 14 , further comprising:
determining a first configuration of bumps along the heat pipe that will provide a first resonant frequency in a first radio frequency band and act as a first radio frequency filter; and
determining a second configuration of bumps along the heat pipe that will provide a second resonant frequency in a second radio frequency band and act as a second radio frequency filter, wherein the created heat pipe includes the first configuration of bumps and the second configuration of bumps.

Assignees

• Intel Corp

Inventors

• Liu Kae-An
• Lee Jaejin
• Browning David W

Classifications

• H01P1/2005

  Electromagnetic photonic bandgaps [EPB], or photonic bandgaps [PBG] · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H01Q1/02

  Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} · CPC title

• F28F2265/28

  for preventing noise · CPC title

• F28F2265/24

  for electrical insulation · CPC title