Thermopile module

Patent metadata

Field	Value
Publication number	US-12158375-B2
Application number	US-202318143565-A
Country	US
Kind code	B2
Filing date	May 4, 2023
Priority date	Mar 20, 2015
Publication date	Dec 3, 2024
Grant date	Dec 3, 2024

Abstract

An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

First claim

What is claimed is:

1. An electronic device, comprising:
an outer case having an opening;
a circuit substrate disposed inside the outer case;
a thermopile sensor chip disposed on the circuit substrate;
a filter structure disposed above the thermopile sensor chip; and
a waterproof structure disposed on the circuit substrate for encapsulating the thermopile sensor chip and the filter structure.

2. The electronic device as claimed in claim 1 , wherein the thermopile sensor chip and the filter structure are covered by the waterproof structure.

3. The electronic device as claimed in claim 1 , wherein the thermopile sensor chip is electrically connected to the circuit substrate by wire-bonding or flip-chip bonding.

4. The electronic device as claimed in claim 1 , wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.

5. The electronic device as claimed in claim 4 , further comprising a support structure disposed between the circuit substrate and the waterproof structure for supporting the waterproof structure.

6. The electronic device as claimed in claim 5 , wherein the waterproof structure includes a first waterproofing element, a second waterproofing element, and a support structure, the first waterproofing element is surroundingly connected onto the filter structure, the second waterproofing element is surroundingly connected onto the outer case, the support structure is disposed between the first waterproofing element and the second waterproofing element.

7. The electronic device as claimed in claim 6 , wherein the support structure has a first support portion connected between the first waterproofing element and the second waterproofing element and a second support portion extended downwardly from the first support portion to contact the circuit substrate for supporting the second waterproofing element.

8. The electronic device as claimed in claim 7 , wherein the first waterproofing element has a first through hole, the second waterproofing element has a second through hole communicated with the opening of the outer case, the first support portion has a third through hole communicated between the first through hole and the second through hole.

Assignees

• Pixart Imaging Inc

Inventors

• Tsai Ming-Han
• Sun Chih-Ming
• Liao Jian-Cheng

Classifications

• G01J5/0802

  Optical filters · CPC title

• G01J5/05

  Means for preventing contamination of the components of the optical system; Means for preventing obstruction of the radiation path · CPC title

• G01J5/0025 Primary

  Living bodies (ear thermometers G01J5/0011; detecting, measuring or recording for diagnostic purposes A61B5/00) · CPC title

• G01J5/0875

  Windows; Arrangements for fastening thereof · CPC title

• G01J5/12

  using thermoelectric elements, e.g. thermocouples · CPC title