Sensor package and method for attaching sensor package

US12158362B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12158362-B2
Application numberUS-202017760906-A
CountryUS
Kind codeB2
Filing dateSep 16, 2020
Priority dateSep 17, 2019
Publication dateDec 3, 2024
Grant dateDec 3, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin portion.

First claim

Opening claim text (preview).

The invention claimed is: 1. A sensor package to be attached to an object, the sensor package comprising: a first substrate; a Fiber Bragg Grating (FBG) sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, wherein the FBG sensor is held by the resin portion, the first pressure-sensitive adhesive layer has an opening portion that penetrates in a thickness direction, and the resin portion holds the FBG sensor so as to fill a gap between the FBG sensor disposed in the opening portion and the opening portion. 2. The sensor package according to claim 1 , wherein the adhesive layer is cured at room temperature. 3. The sensor package according to claim 1 , wherein the adhesive layer is cured by a curing agent. 4. The sensor package according to claim 1 , wherein at least a part of an entire periphery of the resin portion holding the FBG sensor excluding a surface on the adhesive layer side is covered with the first pressure-sensitive adhesive layer. 5. The sensor package according to claim 1 , wherein surfaces of the first pressure-sensitive adhesive layer and the adhesive layer on a side to be attached to the object are protected by a first release liner. 6. The sensor package according to claim 1 , wherein the first substrate is transparent or translucent. 7. The sensor package according to claim 1 , further comprising: a second pressure-sensitive adhesive layer and a second substrate in this order on a surface of the first substrate on a side opposite to a surface on the first pressure-sensitive adhesive layer side. 8. The sensor package according to claim 7 , wherein the second substrate is a weather resistant substrate. 9. The sensor package according to claim 7 , further comprising: a release liner in a part between the first substrate and the second pressure-sensitive adhesive layer, wherein the release liner includes an extension portion that extends beyond the second pressure-sensitive adhesive layer and is exposed in a surface spreading direction of the release liner. 10. A method for attaching the sensor package according to claim 1 , wherein the adhesive layer in the sensor package is cured by a curing agent, the method for attaching the sensor package comprising: a step of applying the curing agent to at least one of the adhesive layer and the object; and a step of attaching the sensor package to the object via the adhesive layer. 11. A method for attaching the sensor package according to claim 1 , wherein the adhesive layer in the sensor package is cured by a curing agent, the method for attaching the sensor package comprising: a step of applying the curing agent to the adhesive layer; a step of applying the curing agent to the object; and a step of attaching the sensor package to the object so that the curing agent applied to the adhesive layer and the curing agent applied to the object are in contact with each other. 12. A method for attaching the sensor package according to claim 1 in which the sensor package is attached to the object, wherein in the sensor package, surfaces of the first pressure-sensitive adhesive layer and the adhesive layer on a side to be attached to the object are protected by a first release liner, the sensor package includes the first substrate, a second pressure-sensitive adhesive layer and a second substrate in this order on a surface of the first pressure-sensitive adhesive layer on a side opposite to a surface on the side to be attached to the object, and the sensor package includes a second release liner in a part between the first substrate and the second pressure-sensitive adhesive layer, and the second release liner includes an extension portion that extends beyond the second pressure-sensitive adhesive layer and is exposed in a surface spreading direction of the second release liner, the method for attaching the sensor package comprising: a step of releasing the first release liner and applying a curing agent to the adhesive layer; a step of attaching a release surface from which the first release liner of the sensor package is released to the object; and a step of releasing the second release liner and attaching a release surface of the second pressure-sensitive adhesive layer, from which the second release liner is released, to the first substrate. 13. A set comprising: the sensor package according to claim 1 and a curing agent. 14. A sensor package to be attached to an object, the sensor package comprising: a first substrate; a Fiber Bragg Grating (FBG) sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, wherein the FBG sensor is held by the resin portion, and surfaces of the first pressure-sensitive adhesive layer and the adhesive layer on a side to be attached to the object are protected by a first release liner. 15. The sensor package according to claim 14 , wherein the adhesive layer is cured at room temperature. 16. The sensor package according to claim 14 , wherein the adhesive layer is cured by a curing agent. 17. The sensor package according to claim 14 , wherein at least a part of an entire periphery of the resin portion holding the FBG sensor excluding a surface on the adhesive layer side is covered with the first pressure-sensitive adhesive layer. 18. A sensor package to be attached to an object, the sensor package comprising: a first substrate; a Fiber Bragg Grating (FBG) sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, wherein the FBG sensor is held by the resin portion, and the first substrate is transparent or translucent. 19. The sensor package according to claim 18 , further comprising: a second pressure-sensitive adhesive layer and a second substrate in this order on a surface of the first substrate on a side opposite to a surface on the first pressure-sensitive adhesive layer side. 20. The sensor package according to claim 19 , further comprising: a release liner in a part between the first substrate and the second pressure-sensitive adhesive layer, wherein the release liner includes an extension portion that extends beyond the second pressure-sensitive adhesive layer and is exposed in a surface spreading direction of the release liner.

Assignees

Inventors

Classifications

  • involving heating of the applied adhesive · CPC title

  • Pressure-sensitive adhesives [PSA] · CPC title

  • Optical fibre sensor using a particular arrangement of the optical fibre itself · CPC title

  • using a Bragg gratings · CPC title

  • Measuring two or more variables by means not covered by a single other subclass · CPC title

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Frequently asked questions

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What does patent US12158362B2 cover?
The present invention relates to a sensor package to be attached to an object, and the sensor package includes: a first substrate; an FBG sensor; a resin portion and a first pressure-sensitive adhesive layer positioned on the first substrate; and an adhesive layer positioned on a surface of the resin portion on a side opposite to the first substrate, in which the FBG sensor is held by the resin…
Who is the assignee on this patent?
Nitto Denko Corp, Ihi Inspection And Instr Co Ltd
What technology area does this patent fall under?
Primary CPC classification G01D5/35316. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Dec 03 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).