Resin composition, method of manufacturing adhesive member including providing the resin composition, and display device including the adhesive member

Patent metadata

Field	Value
Publication number	US-12157787-B2
Application number	US-202218073387-A
Country	US
Kind code	B2
Filing date	Dec 1, 2022
Priority date	Feb 23, 2022
Publication date	Dec 3, 2024
Grant date	Dec 3, 2024

Abstract

A resin composition may include at least one urethane (meth)acrylate oligomer, at least one (meth)acrylate monomer, and at least one photoinitiator. The urethane (meth)acrylate oligomer may include a first urethane (meth)acrylate oligomer derived from a phosphate ester-containing polyol represented by Formula 1, and the first urethane (meth)acrylate oligomer may have a number-average molecular weight of about 805 to about 955. Accordingly, the resin composition may exhibit the characteristics of a low viscosity before being cured, and excellent or suitable shear modulus and peel strength after being cured.

First claim

What is claimed is:

1. A resin composition comprising:
at least one urethane (meth)acrylate oligomer;
at least one (meth)acrylate monomer; and
at least one photoinitiator,
wherein the urethane (meth)acrylate oligomer comprises a first urethane (meth)acrylate oligomer derived from a phosphate ester-containing polyol, the phosphate ester-containing polyol being represented by Formula 1, and the first urethane (meth)acrylate oligomer has a number-average molecular weight of about 805 to about 955:

and
wherein, in Formula 1, n1 is 3 or 4.

2. The resin composition of claim 1 , wherein the (meth)acrylate monomer has a weight percent of about 80 wt % to about 90 wt % with respect to a total weight of the resin composition.

3. The resin composition of claim 1 , wherein a viscosity at about 25° C. as measured according to JIS K7117-2 method is about 5.0 mPa·s to about 20.0 mPa·s.

4. The resin composition of claim 1 , wherein a shear modulus (G′) at about −20° C. as measured according to JISK7244-6 method after the resin composition is UV-cured is about 1.0×10 3 Pa to about 2.0×10 5 Pa.

5. The resin composition of claim 1 , wherein the urethane (meth)acrylate oligomer further comprises a second urethane (meth)acrylate oligomer comprising two hydroxy groups.

6. The resin composition of claim 1 , wherein the photoinitiator comprises a radical polymerization initiator.

7. A method of manufacturing an adhesive member, the method comprising:
providing, on a substrate, a resin composition comprising at least one urethane (meth)acrylate oligomer, at least one (meth)acrylate monomer, and at least one photoinitiator;
providing first light to the resin composition to form a preliminary adhesive member; and
providing second light to the preliminary adhesive member to form an adhesive member,
wherein the urethane (meth)acrylate oligomer comprises a first urethane (meth)acrylate oligomer derived from a phosphate ester-containing polyol, the phosphate ester-containing polyol being represented by Formula 1, and the first urethane (meth)acrylate oligomer has a number-average molecular weight of about 805 to about 955:

and
wherein, in Formula 1, n1 is 3 or 4.

8. The method of claim 7 , further comprising providing a protective member on the preliminary adhesive member after the providing of first light to the resin composition to form the preliminary adhesive member,
wherein the second light is configured to pass through the protective member and be provided to the preliminary adhesive member.

9. The method of claim 7 , wherein at least one of the urethane (meth)acrylate oligomer or the (meth)acrylate monomer comprises an acryloyl group, and a reaction rate of the acryloyl group in response to the providing of the first light is about 90% or more.

10. The method of claim 9 , wherein the reaction rate of the acryloyl group satisfies Equation 1:
Equation 1
Z 1 =[( X 2 /Y 2 )/( X 1 /Y 1 )]×100%, and  Equation 1

wherein, in Equation 1,
X 1 is a height of absorbance of a carbon-carbon double bond (H 2 C═CH—*) of the acryloyl group as measured by Fourier-transform infrared spectroscopy (FT-IR) in the resin composition, X 2 is a height of absorbance of a carbon-carbon double bond (H 2 C═CH—*) of the acryloyl group as measured by FT-IR in the preliminary adhesive member, Y 1 is a height of absorbance of a carbonyl group

of the acryloyl group as measured by FT-IR in the resin composition, and Y 2 is a height of absorbance of a carbonyl group of the acryloyl group as measured by FT-IR in the preliminary adhesive member.

11. The method of claim 7 , wherein the resin composition is provided by an inkjet printing method or a dispensing method.

12. The method of claim 7 , wherein a total amount of the first light is about 450 mJ/cm 2 to about 550 mJ/cm 2 , and a total amount of the second light is about 3,500 mJ/cm 2 to about 4,500 mJ/cm 2 .

Assignees

• Samsung Display Co Ltd

Inventors

• Morita Keisuke

Classifications

• C08F230/02

  containing phosphorus · CPC title

• C08F130/02

  containing phosphorus · CPC title

• C09J143/02

  Homopolymers or copolymers of monomers containing phosphorus · CPC title

• C09J133/14 Primary

  of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen · CPC title

• C08F20/06

  Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof · CPC title